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Sealing glass compositions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03C-003/12
  • C03C-003/21
  • C03C-008/24
  • C03C-014/00
출원번호 US-0407470 (1989-09-15)
발명자 / 주소
  • Finkelstein Leo (San Francisco CA) Dumesnil Maurice E. (Los Altos Hills CA) Tetschlag Richard R. (San Jose CA)
출원인 / 주소
  • VLSI Packaging Materials, Inc. (Sunnyvale CA 02)
인용정보 피인용 횟수 : 31  인용 특허 : 2

초록

Fluid, stable glasses useful for low-temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, phosphorus pentoxide, titania and/or zirconium oxide to the lead oxide vanadium oxide binary. The phosphorus pentoxide may be replaced partially or entirely with niobium pentox

대표청구항

A low-melting glass composition comprising, in weight percent calculated on an oxide basis: (a) PbO: 35-50% (b) V2O5: 35-50% (c) Bi2O3: 0.1-6% (d) P2O5, Nb2O5, Ta2O5, or combinations thereof: 0.1-8% (e) ZnO, MgO, CaO, BaO, SrO, or combinations thereof: 0.1-5% (f) TiO2, ZrO2, or combinations thereof:

이 특허에 인용된 특허 (2)

  1. Dumesnil Maurice E. (Los Altos Hills CA) Finkelstein Leo (San Francisco CA), Low melting glass composition.
  2. Dumesnil Maurice E. (Palo Alto CA) Schreier Ulrich (San Francisco CA), Sealing glass composition.

이 특허를 인용한 특허 (31)

  1. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  2. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  3. Dennis, Timothy A., Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same.
  4. Laughlin, Brian J; Wang, Yueli; Palanduz, Cengiz Ahmet; Suess, Terry Roland, Conductive silver paste for a metal-wrap-through silicon solar cell.
  5. Sawai, Yuichi; Shiono, Osamu; Namekawa, Takashi; Akata, Hiroyuki; Naito, Takashi; Kanazawa, Keiichi; Kijima, Yuuichi; Hirasawa, Shigemi; Asakura, Shunichi; Hayashibara, Mitsuo, Display device and production method thereof.
  6. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Frits for use in vacuum insulating glass (VIG) units, and/or associated methods.
  7. Aitken, Bruce G.; Carberry, Joel P.; DeMartino, Steven E.; Hagy, Henry E.; Lamberson, Lisa A.; Miller, II, Richard J.; Morena, Robert; Schroeder, III, Joseph F.; Streltsov, Alexander; Widjaja, Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
  8. Hudecek Carl J. ; Peer Joseph V. ; Bobinski Jon G., High strength sealing glass.
  9. Yoshida, Masahiro; Hatate, Yasuo; Sarata, Tsugumitsu; Uemura, Yoshimitsu; Honda, Tomoyuki, Lead-free glass material for use in sealing and, sealed article and method for sealing using the same.
  10. Yoshida,Masahiro; Hatate,Yasuo; Sarata,Tsugumitsu; Uemura,Yoshimitsu; Honda,Tomoyuki; Fukunaga,Hiroyuki; Iwashita,Masahiro, Lead-free glass material for use in sealing and, sealed article and method for sealing using the same.
  11. Cooper, David J.; Dear, Ryan L.; Miller, Robert A., Localized heating techniques incorporating tunable infrared element(s) for vacuum insulating glass units, and/or apparatuses for same.
  12. Dietz Raymond L. (Georgetown MA) Peck David M. (Salem MA), Low temperature glass paste with high metal to glass ratio.
  13. Dennis, Timothy A., Materials and/or method of making vacuum insulating glass units including the same.
  14. Keite-Telgenbüscher, Klaus; Staiger, Anja; Michel, Uwe, Method for the production of a layered or stacked inorganic/organic composite material.
  15. Dennis, Timothy A., Method of making vacuum insulated glass (VIG) window unit.
  16. Farnworth Warren M. ; Wood Alan G., Process of making a glass semiconductor package.
  17. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  18. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  19. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  20. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  21. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  22. Akiyama, Katsunori; Nagano, Ichiro; Shida, Masato; Ota, Satoshi, Thermal barrier coating material.
  23. Vasudevan Subramanian ; Sridharan Srinivasan ; Roberts Gordon J., Thick film having acid resistance.
  24. Aitken, Bruce Gardiner; An, Chong Pyung; Hanson, Benjamin Zain; Quesada, Mark Alejandro, Tin phosphate barrier film, method, and apparatus.
  25. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg, Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same.
  26. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  27. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  28. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  29. Dennis, Timothy A., Vanadium-based frit materials, and/or methods of making the same.
  30. Dennis, Timothy Alan, Vanadium-based frit materials, and/or methods of making the same.
  31. Dennis, Timothy A., Vanadium-based frit materials, binders, and/or solvents and methods of making the same.
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