$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색도움말
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

통합검색

도움말도움말
상세검색 다국어 입력

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Multi-path feed-thru lead and method for formation thereof

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01R-004/58   
미국특허분류(USC) 439/886 ; 439/78 ; 439/931 ; 439/933
출원번호 US-0458092 (1989-12-28)
발명자 / 주소
  • Koepke Richard A. (New Bedford MA)
출원인 / 주소
  • Isotronics, Inc. (New Bedford MA 02)
인용정보 피인용 횟수 : 25  인용 특허 : 19
초록
▼

A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and ...

대표
청구항
▼

A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration, said insulative substrate including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of ...

인용문헌 (19)

  1. Scherer Jeremy D. (Dartmouth MA) Tower Steven A. (Dartmouth MA), All metal flat package for microcircuitry.
  2. Ishimaru Hajime (Ibaraki JPX), Bakable multi-pins vacuum feedthrough.
  3. Butt Sheldon H. (Godfrey IL) Cann William F. (Ladue MO), Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs.
  4. Kersch Dennis R. (Phoenix AZ) Mitchell Don E. (Phoenix AZ), Copper body power hybrid package and method of manufacture.
  5. Ahearn John E. (Middleboro MA) Frates Raymond A. (Fairhaven MA) Girard Dennis (New Bedford MA) Koepke Richard A. (New Bedford MA) O\Hern Robert M. (Taunton MA) Schmidt James K. (Mt. Pleasant PA) Mano, Duplex glass preforms for hermetic glass-to-metal compression sealing.
  6. Ahearn John E. (Middleboro MA) Frates Raymond A. (Fairhaven MA) Girard Dennis (New Bedford MA) Koepke Richard A. (New Bedford MA) Schmidt James K. (Mt. Pleasant PA) Manon C. Dodd (Ligonier PA), Duplex glass preforms for hermetic glass-to-metal sealing.
  7. Marks Daniel W. (2649 SW. 17th Pl. Gresham OR 97080) Schmachtenberg ; III Richard (6915 SW. 179th Ave. Beaverton OR 97007), Electrical connector.
  8. Goldfarb Samuel (21 Sycamore Dr. Roslyn ; County of Nassau NY 11576), Electronic component package with multiconductive base forms for multichannel mounting.
  9. Miller Wilson N. (Anaheim CA) Gray Ormal E. (Placentia CA), Hermetically sealable package for hybrid solid-state electronic devices and the like.
  10. Pollock John A. (c/o Product Engineering Associates Inc. ; P.O. Box 269 Wilton NH 03086), Hermetically sealed feedthroughs and methods of making same.
  11. Pryor Michael J. (Woodbridge CT) Singhdeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT), Hermetically sealed package.
  12. Navarro John N. (Pasadena CA), Method of forming a multichannel connector.
  13. Mallik Debendra (2139 S. Cottonwood Mesa AZ 85202) Bhattacharyya Bidyut K. (5063 W. Boston Way Chandler AZ 85226), Method of making a multilayer molded plastic IC package.
  14. Wildeboer Nicolaas (South Dartmouth MA), Microcircuit flat pack with integral shell.
  15. Scherer Jeremy D. (South Dartmouth MA), Microcircuit package and sealing method.
  16. Ibrahim Shawki (Lafayette IN) Elsner James E. (Lafayette IN), Multi-layer ceramic package.
  17. Kennedy James D. (El Cajon CA) McCurdy Scott G. (Anaheim CA) Ruggio Stanley R. (La Verne CA), Printed circuit board and process for its manufacture.
  18. Phy William S. (Los Altos Hills CA), Process of forming a compliant lead frame for array-type semiconductor packages.
  19. Inoue Tatsuo (Tokyo JPX) Kimura Mitsuru (Tokyo JPX), Substrate having at least one fine-wired conductive layer.

이 특허를 인용한 특허 (25)

  1. Crane ; Jr. Stanford W. ; Larcomb Daniel ; Krishnapura Lakshminarasimha, Apparatus for and method of manufacturing a semiconductor die carrier.
  2. Crane, Jr., Stanford W.; Larcomb, Daniel; Krishnapura, Lakshminarasimha, Apparatus for and method of manufacturing a semiconductor die carrier.
  3. Crane, Jr., Stanford W.; Portuondo, Maria M.; Erickson, Willard; Bizzarri, Maurice, Backplane system having high-density electrical connectors.
  4. Crane, Jr.,Stanford W., Backplane system having high-density electrical connectors.
  5. Crane ; Jr. Stanford W. ; Portuondo Maria M. ; Erickson Willard ; Bizzarri Maurice, Computer having a high density connector system.
  6. Crane ; Jr. Stanford W. ; Portuondo Maria M. ; Erickson Willard ; Bizzarri Maurice, Computer system having a modular architecture.
  7. Steiner Urs, Electrical connector feedthrough to low pressure chamber.
  8. Evans,Cliff; Dalton,Mark William, Electrical feedthru.
  9. Crane ; Jr. Stanford W., Electrical interconnect system with wire receiving portion.
  10. Hyakutake, Yasuhiro, Ferrule for optical fiber.
  11. Takita, Kyoji; Taniguchi, Hiroshi; Noshiro, Takashi; Hyakutake, Yasuhiro; Takeda, Shinichi, Ferrule for optical fiber.
  12. Takita, Kyoji; Taniguchi, Hiroshi; Noshiro, Takashi; Hyakutake, Yasuhiro; Takeda, Shinichi, Ferrule for optical fiber.
  13. Crane ; Jr. Stanford W., High-density electrical interconnect system.
  14. Crane ; Jr. Stanford W., High-density electrical interconnect system.
  15. Crane ; Jr. Stanford W. (3934 NW. 57th St. Boca Raton FL 33496), High-density electrical interconnect system.
  16. Crane, Jr., Stanford W., High-density electrical interconnect system.
  17. Rossi Markku J. (Houston TX), Low weight multilayer printed circuit board.
  18. Neal, Dan M.; Clouser, Paul, Method and apparatus for high speed differential signaling, employing split pin connectors and split via technology.
  19. Evans, Cliff; Dalton, Mark William, Method of fabricating an electrical feedthru.
  20. Crane, Jr., Stanford W., Modular architecture for high bandwidth computers.
  21. Crane ; Jr. Stanford W. ; Portuondo Maria M., Semiconductor chip carrier affording a high-density external interface.
  22. Crane, Jr., Stanford W.; Portuondo, Maria M., Semiconductor chip carrier affording a high-density external interface.
  23. Crane, Jr.,Stanford W.; Portuondo,Maria M., Semiconductor chip carrier affording a high-density external interface.
  24. Crane ; Jr. Stanford W. ; Portuondo Maria M., Semiconductor chip carrier including an interconnect component interface.
  25. Jozwiak Andrew Joseph (Warren OH) Chapin Melodee Ann (Cortland OH), Smart connector for an electrical device.

IPC 상위 출원인