초록 ▼

A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facil

A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate. In one preferred method of forming the multi-path feed-thru lead of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways. The multi-path feed-thru lead of the present invention thereby provides multiple conductive pathways on a single substrate member.

대표청구항 ▼

A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration, said insulative substrate including an extended intermediate portion and first and second end portions, said first and second end portions having conf

A multi-path feed-thru lead providing increased conductive pathway density, comprising: an insulative substrate having a predetermined configuration, said insulative substrate including an extended intermediate portion and first and second end portions, said first and second end portions having configurations defining a first and second plurality of bonding pads, respectively; a plurality of metalized conductive pathways formed on said intermediate portion and said plurality of bonding pads defined by said first and second end portions, respectively, of said insulative substrate; adjacent ones of said metalized conductive pathways being defined and separated by exposed strips of said insulative substrate; and conductive interconnect trace means formed in said exposed strips of said insulative substrate for electrically interconnecting at least one adjacent pair of said metalized conductive pathways.