초록 ▼

A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconduc

A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece.

대표청구항 ▼

Apparatus to polish a workpiece, comprising: a polishing pad, rotatable about an axis and having a face perpendicular to and coaxial with said axis; said face, in use, to be urged against the workpiece to facilitate polishing of same; said face shaped by a plurality of like sized substantially circu

Apparatus to polish a workpiece, comprising: a polishing pad, rotatable about an axis and having a face perpendicular to and coaxial with said axis; said face, in use, to be urged against the workpiece to facilitate polishing of same; said face shaped by a plurality of like sized substantially circular voids; and said voids having a density within a work zone between radii from said axis which increases with the distance of the voids from said axis, wherein said face, by virtue of its shape, is able to provide a constant, or nearly so, surface contact rate to the workpiece for any radius bounded by an inner radius and an outer radius from said axis, said radii being sufficiently different to accommodate the workpiece between them.