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A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling

A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.

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A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; and liquid supplying means provided on said sealing mem

A semiconductor cooling device comprising: a plurality of semiconductor integrated circuits mounted on a module substrate; a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits; and liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said liquid nozzles emit and direct jets of a cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits.