초록 ▼

A hot melt adhesive consisting essentially of amorphous polypropylene, styrene-based themoplastic elastomer, tackifier and wax having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C. Such adhesives exhibit good

A hot melt adhesive consisting essentially of amorphous polypropylene, styrene-based themoplastic elastomer, tackifier and wax having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C. Such adhesives exhibit good shear strength and shock resistance.

대표청구항 ▼

1. A composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer, said elastomer being styrene-diene block copolymer or hydrogenated styr

1. A composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer, said elastomer being styrene-diene block copolymer or hydrogenated styrene-diene block copolymer; (c) between about 1 and about 35 weight percent of tackifier: and (d) up to about 24 weight percent of wax; and having a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23° C. 2. The composition of claim 1 consisting essentially of the following: (a) between about 14 and about 50 weight percent of said amorphous polypropylene; (b) between about 2 and about 60 weight percent of said styrene-based elastomer; (c) between about 1 and about 25 weight percent of said tackifier; and (d) up to about 24 weight percent of said wax. 3. The composition of claim 1 wherein said amorphous polypropylene has a weight average molecular weight between about 10,000 and about 100,000. 4. The composition of claim 1 wherein said amorphous polypropylene has a weight average molecular weight between about 10,000 and about 50,000. 5. The composition of claim 1 wherein said amorphous polypropylene comprises at least one of: atactic polypropylene, and propylene copolymerized with a low molecular weight alkene. 6. The composition of claim 1 wherein said styrene-based elastomer has a repeating structure of A-B or A-B-A wherein A is polystyrene and B is a compatible soft segment copolymer. 7. The composition of claim 6 wherein said A blocks have a weight average molecular weight of between about 5,000 and about 125,000. 8. The composition of claim 6 wherein said A blocks have a weight average molecular weight of between about 8,000 and about 45,000. 9. The composition of claim 7 wherein said B blocks has a weight average molecular weight of between about 30,000 and about 125,000. 10. The composition of claim 6 wherein said B blocks have a weight average molecular weight of between about 50,000 and about 100,000. 11. The composition of claim 6 wherein the weight ratio of said A blocks to said B blocks is between about 1:4 and about 4:1. 12. The composition of claim 1 wherein said styrene-based thermoplastic elastomer comprises blocks of hard segments and blocks of soft segments, said soft segments being substantially saturated. 13. The composition of claim 1 wherein said tackifier is at least one of the following: polyterpenes, rosins, rosin esters and derivatives thereof, aliphatic and aromatic resins, modified terpenes, coumarone-indenes, polyesters, alkyl phenols, or styrene oligomers. 14. The composition of claim 1 wherein said wax is at least one of the following: low molecular weight polyethylene, microcrystalline wax, Fischer-Tropsch wax, or paraffin wax. 15. The composition of claim 1 further comprising at least one of the following: crystalline polyolefin, filler, colorant, or stabilizer. 16. The composition of claim 1 wherein said composition has a volume resistivity of between about 10 14 and about 10 17 ohm-cm at 23° C., a dielectric strength of between about 25 and about 50 kilovolts/millimeter, a dielectric constant of between about 2.3 and about 3.0 at 1 kilohertz, a dissipation factor of between about 0.0008 and about 0.010 at a 1 kilohertz at 23° C., and electrolytic corrosion after 1000 hours of between about 10 10 and about 10 12 ohms. 17. A method of bonding electronic components said method comprising using a composition consisting essentially of the following: (a) between about 10 and about 70 weight percent of amorphous polypropylene; (b) between about 2 and about 70 weight percent of styrene-based thermoplastic elastomer; (c) between about 1 and about 35 weight percent of tackifier; and (d) up to about b 24 weight percent of wax; wherein said composition has a dissipation factor of about 0.010 or less at 1 kilohertz at 23° C., and a volume resistivity of at least about 1×10 14 ohm-cm at 23°C.