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[미국특허] CAD driven microprobe integrated circuit tester 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-001/04
출원번호 US-0354268 (1989-05-19)
발명자 / 주소
  • Yih Christopher (Cupertino CA) Yang Tsen-Shau (Cupertino CA) Huang Kuang-Hua (Cupertino CA) Chou Ger-Chih (San Jose CA)
출원인 / 주소
  • Knights Technology, Inc. (Cupertino CA 02)
인용정보 피인용 횟수 : 102  인용 특허 : 11

초록

A system for testing integrated circuits is disclosed which uses a mechanical microprobe and the integrated circuit\s CAD database. The system is integrated with the CAD database in such a manner that after an initial alignment operation between the CAD database and the integrated circuit being test

대표청구항

A system for testing integrated circuits comprising: computer means for storing, accessing and displaying a database describing the integrated circuit being tested; microprobe means for injecting test signals into and receiving test signals from the integrated circuit; microprobe drive means compris

이 특허에 인용된 특허 (11) 인용/피인용 타임라인 분석

  1. Fulton Donald E. (Stoneham MA) Curtiss William P. (Winthrop MA) Leehey Jonathan R. (Malden MA), Adaptive induction motor controller.
  2. Frohlich Sigurd (Santa Barbara CA), Apparatus for automatically electrically testing printed circuit boards.
  3. Dixon Kenneth K. (Rancho Palos Verdes CA), Automatic component assembly machine and method relating thereto.
  4. Richardson Neil (Mountain View CA), Electron beam test probe system for analyzing integrated circuits.
  5. Crum Gerald W. (Elyria OH) Rooney Brian M. (Amherst OH), Manually programmable robot with power-assisted motion during programming.
  6. Stridsberg Lennart (Enskede SEX) Rodin Gunnar (Bromma SEX), Method and apparatus for calibrating a positioning system.
  7. Burr Robert P. (Matinicus ME) Keogh Raymond J. (Huntington NY) Morino Ronald (Sea Cliff NY) Crowell Jonathan C. (Brooklyn NY) Burr James B. (Centerport NY) Christophersen James C. (West Islip NY), Method and apparatus for testing of electrical interconnection networks.
  8. Epstein Daniel (Oceanside NY) Lieberman Robert (Bethpage NY), Opto-video inspection system.
  9. Benjamin Harry L. (1000 Brittany Hills Dr. Dayton OH 45459), Position sensing device.
  10. Touchton James J. (Boulder CO) Hill John P. (Broomfield CO), Resonance suppression method.
  11. Hendriks, Ferdinand; Taylor, Russell H., Robot precision probe positioner with guidance optics.

이 특허를 인용한 특허 (102) 인용/피인용 타임라인 분석

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
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  4. Dunklee, John, Chuck for holding a device under test.
  5. Dunklee, John, Chuck for holding a device under test.
  6. Dunklee, John, Chuck for holding a device under test.
  7. Dunklee,John, Chuck for holding a device under test.
  8. Dunklee,John, Chuck for holding a device under test.
  9. Dunklee,John, Chuck for holding a device under test.
  10. Stewart, Craig; Lord, Anthony; Spencer, Jeff; Burcham, Terry; McCann, Peter; Jones, Rod; Dunklee, John; Lesher, Tim; Newton, David, Chuck for holding a device under test.
  11. Stewart,Craig; Lord,Anthony; Spencer,Jeff; Burcham,Terry; McCann,Peter; Jones,Rod; Dunklee,John; Lesher,Tim; Newton,David, Chuck for holding a device under test.
  12. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  13. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  14. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  15. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  16. Strid, Eric; Campbell, Richard, Differential signal probing system.
  17. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  18. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  19. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  20. Dunklee, John; Norgden, Greg; Cowan, C. Eugene, Guarded tub enclosure.
  21. Dunklee,John; Norgden,Greg; Cowan,C. Eugene, Guarded tub enclosure.
  22. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  23. Jensen, Lance Christopher, Layout data reduction for use with electronic design automation tools.
  24. McFadden,Bruce, Localizing a temperature of a device for testing.
  25. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  26. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  27. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  28. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  29. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  30. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  31. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  32. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  33. Pyun Do-Sun,KRX, Method and apparatus for testing internal circuit.
  34. Saunders,J. Lynn; Loudermilk,Alan R., Method for manufacturing an electronic device having an electronically determined physical test member.
  35. Caywood John ; Lepejian David Y, Method for using inspection data for improving throughput of stepper operations in manufacturing of integrated circuits.
  36. Lepejian David Yepejian, Method for using wafer navigation to reduce testing times of integrated circuit wafers.
  37. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  38. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  39. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  40. J. Lynn Saunders ; Alan R. Loudermilk, Methods for making contact device for making connection to an electronic circuit device and methods of using the same.
  41. Saunders, J. Lynn; Loudermilk, Alan R., Methods for making contact device for making connection to an electronic circuit device and methods of using the same.
  42. Saunders, J. Lynn; Loudermilk, Alan R., Methods for making contact device for making connection to an electronic circuit device and methods using the same.
  43. Saunders, J. Lynn; Loudermilk, Alan R., Methods for manufacturing an electronic device having an electronically determined physical test member.
  44. Saunders, J. Lynn; Loudermilk, Alan R., Methods for manufacturing an electronic device using an electronically determined test member.
  45. Bell Martin J. (Santa Clara CA), Netlist editor allowing for direct, interactive low-level editing of netlists.
  46. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  47. Harris,Daniel L.; McCann,Peter R., Optical testing device.
  48. Sinsheimer Roger ; Richards Tom, Probe card changer system and method.
  49. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  50. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  51. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  52. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  53. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  54. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  55. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  56. Schwindt,Randy, Probe holder for testing of a test device.
  57. Nordgren, Greg; Dunklee, John, Probe station.
  58. Nordgren, Greg; Dunklee, John, Probe station.
  59. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  60. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  61. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  62. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  63. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  64. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  65. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  66. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  67. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  68. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  69. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  70. Navratil,Peter; Froemke,Brad; Stewart,Craig; Lord,Anthony; Spencer,Jeff; Runbaugh,Scott; Fisher,Gavin; McCann,Pete; Jones,Rod, Probe station with two platens.
  71. Lesher, Timothy E., Probe testing structure.
  72. Lesher,Timothy E., Probe testing structure.
  73. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  74. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  75. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  76. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  77. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  78. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  79. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  80. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  81. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  82. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  83. Dunklee,John, Switched suspended conductor and connection.
  84. Dunklee,John, Switched suspended conductor and connection.
  85. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  86. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  87. Andrews, Peter; Hess, David, System for testing semiconductors.
  88. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  89. Campbell, Richard, Test structure and probe for differential signals.
  90. Campbell,Richard, Test structure and probe for differential signals.
  91. Rumbaugh,Scott, Thermal optical chuck.
  92. Rumbaugh,Scott, Thermal optical chuck.
  93. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  94. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  95. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  96. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  97. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station having a skirting component.
  98. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  99. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  100. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  101. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  102. Campbell, Richard, Wideband active-passive differential signal probe.

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