$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for polishing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-029/00
출원번호 US-0293211 (1989-01-04)
우선권정보 JP-0012995 (1988-01-22)
발명자 / 주소
  • Doy Toshiroh K. (Tokorozawa JPX) Nakada Hiroshi (Tokyo JPX) Kunimitsu Yoshihiko (Shinnanyo JPX)
출원인 / 주소
  • Nippon Telegraph & Telephone Corp. (Tokyo JPX 03) Nippon Silica Industrial Co., Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 34  인용 특허 : 4

초록 ▼

Polishing agent including as a main constituent an aqueous solution containing sodium bromite. The aqueous solution may further contain particles which are not dissolved in the solution or an alkali agent to adjust the pH to 8 to 14. Also the apparatus and method for polishing articles using the pol

대표청구항 ▼

A polishing apparatus for polishing hard and fragile materials, comprising: a polisher having a polishing surface on which the material to be polished is placed, a conditioning rotatable ring slidably supported on the polishing surface and arranged to loosely hold the material to be polished, a meta

이 특허에 인용된 특허 (4)

  1. Basi Jagtar S. (Fishkill NY) Mendel Eric (Poughkeepsie NY), Method for polishing titanium carbide.
    상세보기
  2. Walsh Robert J. (Ballwin MO), Process for chemical-mechanical polishing of III-V semiconductor materials.
    상세보기
  3. Basi Jagtar S. (Fishkill NY), Silicon wafer polishing.
    상세보기
  4. Shimizu Kazuo (Kasukabe JPX), Substance and process for converting waste cooking oil into liquid soap.
    상세보기

이 특허를 인용한 특허 (34)

  1. Appel Andrew Thorton ; Chisholm Michael Francis, Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications.
    상세보기
  2. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical mechanical polish machines and fabrication process using the same.
    상세보기
  3. Marmillion Patricia M. ; Palagonia Anthony M., Chemical mechanical polisher.
    상세보기
  4. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
    상세보기
  5. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical-mechanical polish machines and fabrication process using the same.
    상세보기
  6. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical-mechanical polish machines and fabrication process using the same.
    상세보기
  7. Geha Sam ; Shan Ende, Controlled isotropic etch process and method of forming an opening in a dielectric layer.
    상세보기
  8. Chen Lai-Juh (Hsin-Chu TWX), Electrochemical simulator for chemical-mechanical polishing (CMP).
    상세보기
  9. Anantha R. Sethuraman ; William W. C. Koutny, Jr., Employing an acidic liquid and an abrasive surface to polish a semiconductor topography.
    상세보기
  10. Sethuraman Anantha R. ; Koutny ; Jr. William W. C., Employing an acidic liquid and an abrasive surface to polish a semiconductor topography.
    상세보기
  11. Koutny ; Jr. William W. C., Employing deionized water and an abrasive surface to polish a semiconductor topography.
    상세보기
  12. Runnels Scott ; Toprac Anthony J., Forced-flow wafer polisher.
    상세보기
  13. Fang, Treliant, Halite salts as silicon carbide etchants for enhancing CMP material removal rate for SiC wafer.
    상세보기
  14. Muroyama Masakazu,JPX ; Sasaki Masayoshi,JPX, Method and apparatus for chemical/mechanical polishing.
    상세보기
  15. Sethuraman Anantha R. ; Koutny ; Jr. William W. C., Method for cleaning a surface of a dielectric material.
    상세보기
  16. Ramkumar, Krishnaswamy; Kallingal, Chidambaram G.; Madhavan, Sriram, Method for forming an integrated circuit device.
    상세보기
  17. Gilboa, Yitzhak; Koutny, Jr., William W. C.; Hedayati, Steven; Ramkumar, Krishnaswamy, Method of making a planarized semiconductor structure.
    상세보기
  18. Sethuraman Anantha R. ; Seams Christopher A., Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect.
    상세보기
  19. Sethuraman, Anantha R.; Seams, Christopher A., Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect.
    상세보기
  20. Koutny, Jr., William W. C.; Sethuraman, Anantha R.; Seams, Christopher A., Planarized semiconductor interconnect topography and method for polishing a metal layer to form wide interconnect structures.
    상세보기
  21. Koutny ; Jr. William W. C. ; Kallingal Chidambaram G. ; Ramkumar Krishnaswamy, Planarizing a trench dielectric having an upper surface within a trench spaced below an adjacent polish stop surface.
    상세보기
  22. Kodama Hitoshi (Aichi-ken JPX) Iwasa Shoji (Aichi-ken JPX), Polishing composition.
    상세보기
  23. Sasaki Yasutaka (Yokohama JPX) Matsuo Mie (Yokohama JPX) Nakata Rempei (Kawasaki JPX) Wada Junichi (Yokohama JPX) Hayasaka Nobuo (Yokosuka JPX) Yano Hiroyuki (Wappingers Falls NY) Okano Haruo (Tokyo , Polishing method and polishing apparatus.
    상세보기
  24. Miyashita Naoto,JPX ; Abe Masahiro,JPX ; Shimomura Mariko,JPX, Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus.
    상세보기
  25. Miyashita Naoto,JPX ; Abe Masahiro,JPX ; Shimomura Mariko,JPX, Polishing slurry.
    상세보기
  26. Miyashita Naoto,JPX ; Abe Masahiro,JPX ; Shimomura Mariko,JPX, Polishing slurry.
    상세보기
  27. Kobayashi Thomas S., Process for polishing a semiconductor substrate.
    상세보기
  28. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Chiu Hao-Kuang,TWX ; Wu Kun-Lin,TWX, Retainer ring design for polishing head of chemical-mechanical polishing machine.
    상세보기
  29. Molinar Hector, Scratch reduction in semiconductor circuit fabrication using chemical-mechanical polishing.
    상세보기
  30. Koutny, Jr., William W. C., Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer.
    상세보기
  31. Heo Tae-yeol,KRX ; Park Jung-min,KRX ; Cho Sung-hoon,KRX ; Kim Gi-jung,KRX, Slurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing elect.
    상세보기
  32. Sethuraman Anantha R. ; Koutny ; Jr. William W. C., System for cleaning a surface of a dielectric material.
    상세보기
  33. Cesna Joseph V. ; Kim Inki, Wafer polishing carrier and ring extension therefor.
    상세보기
  34. Kimura Norio (Tokyo JPX) Aoki Katsuyuki (Tokyo JPX) Kawashima Kiyotaka (Tokyo JPX) Ishikawa Seiji (Tokyo JPX), Waste treatment system in a polishing apparatus.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로