초록 ▼

A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connectio

A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.

대표청구항 ▼

A method for assembling and interconnecting a plurality of separately fabricated semiconductor chips comprising the steps of: (a) applying a plurality of semiconductor chips, connection-side down, to a soluble substrate; (b) encapsulating the product of step (a) on the side of said substrate to whic

A method for assembling and interconnecting a plurality of separately fabricated semiconductor chips comprising the steps of: (a) applying a plurality of semiconductor chips, connection-side down, to a soluble substrate; (b) encapsulating the product of step (a) on the side of said substrate to which the semiconductor chips have been applied, (c) dissolving the soluble substrate from the product of step (b) and thereby exposing the connection-sides of the plurality of chips, and (d) applying a pattern of conductive material to the exposed surface to make electrical connections between the plurality of chips.