초록 ▼

A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit

A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.

대표청구항 ▼

An integrated circuit package comprising an electrically insulative module, said module including a plurality of walls including a bottom surface, said plurality of walls defining a cavity, said module including a plurality of input/output pins, said module defining integrated circuit connection con

An integrated circuit package comprising an electrically insulative module, said module including a plurality of walls including a bottom surface, said plurality of walls defining a cavity, said module including a plurality of input/output pins, said module defining integrated circuit connection conductors which extend from some of said input/output pins to positions located along the walls of said cavity spaced from the bottom surface of said cavity, said module defining thermoelectric cooler conductor channels which extend from others of said input/output pins to said bottom surface of said cavity, an integrated circuit chip positioned within said cavity, said integrated circuit chip being electrically connected to said portions located along the walls of said cavity, a thermoelectric cooler having a first side and a second side, said first side of said thermoelectric cooler being thermally connected to said integrated circuit chip, and said second side being thermally connected to said bottom surface of said cavity so as to cool said integrated circuit chip, and thermoelectric cooler conductors passing though said thermoelectric conductor channels, said thermoelectric cooler conductors being electrically connected between said second side of said thermoelectric cooler and said others of said input/output pins.