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특허 상세정보

Powdery coating glass material, coating glass paste using the same and coating glass composition prepared thereby

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C03C-008/04    C03C-008/02    C03C-003/062    C03C-003/066   
미국특허분류(USC) 501/26 ; 501/20 ; 501/21 ; 501/32
출원번호 US-0515414 (1990-04-27)
우선권정보 JP-0110618 (1989-04-28)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 32  인용 특허 : 0
초록

A powdery coating glass material essentially consists of V2O5 5-35 wt. %, ZnO 33-60 wt. %, B2O3 3-25 wt. %, SiO2 1-15 wt. %, Al2O3 0-5 wt. %, and at least one element 2-20 wt. % selected from the group consisting of MgO, CaO, SrO, and BaO, which coating glass material has a softening point of 600°C. or less. A coating glass composition is prepared by the above powdery coating glass material or a coating glass paste for use in a thick-film technique which contains the above powdery coating glass material. The prepared coating glass composition has a therm...

대표
청구항

A powdery coating glass material consisting essentially of V2O5 5-35 wt. %, ZnO 33-60 wt. %, B2O3 3-25 wt. %, SiO2 1-15 wt. %, Al2O3 0-5 wt. %, and at least one oxide 2-20 wt. % selected from the group consisting of MgO, CaO, SrO, and BaO, having a softening point of 600°C. or less.

이 특허를 인용한 특허 피인용횟수: 32

  1. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP20181110125045.
  2. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016069359247.
  3. Dennis, Timothy A.. Coefficient of thermal expansion filler for vanadium-based frit materials and/or methods of making and/or using the same. USP2016109458052.
  4. Sridharan,Srinivasan; Kumar,Umesh. Copper termination inks containing lead free and cadmium free glasses for capacitors. USP2008037339780.
  5. Sridharan,Srinivasan; Kumar,Umesh; Khadilkar,Chandrashekhar S.. Copper termination inks containing lead free and cadmium free glasses for capacitors. USP2006016982864.
  6. Norikazu Fukushima JP; Hiroyuki Oshita JP; Takayuki Mito JP; Masahiko Ouji JP; Kazuo Hadano JP. Dielectric composition useful for light transparent layer in PDP. USP2002076417123.
  7. Sawai, Yuichi; Shiono, Osamu; Namekawa, Takashi; Akata, Hiroyuki; Naito, Takashi; Kanazawa, Keiichi; Kijima, Yuuichi; Hirasawa, Shigemi; Asakura, Shunichi; Hayashibara, Mitsuo. Display device and production method thereof. USP2011098022000.
  8. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Frits for use in vacuum insulating glass (VIG) units, and/or associated methods. USP2018069988302.
  9. Lee, Seung-Han; Choi, Jong-Seo; Jeon, Jin-Hwan; Sin, Sang-Wook. Glass plate with glass frit structure. USP2011017871949.
  10. Sridharan, Srinivasan; Pham, Tung; Khadilkar, Chandrashekhar S.; Shaikh, Aziz S.; Kim, Steve S.. Lead free solar cell contacts. USP2012018093491.
  11. Sridharan, Srinivasan; Pham, Tung; Khadilkar, Chandrashekhar S.; Shaikh, Aziz S.; Kim, Steve S.. Lead free solar cell contacts. USP2015089105768.
  12. Brown,Orville W.; Sridharan,Srinivasan. Lead-free and cadmium-free conductive copper thick film pastes. USP2009037504349.
  13. Brown,Orville Washington; Sridharan,Srinivasan. Lead-free and cadmium-free conductive copper thick film pastes. USP2007027176152.
  14. Yoshida, Masahiro; Hatate, Yasuo; Sarata, Tsugumitsu; Uemura, Yoshimitsu; Honda, Tomoyuki. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same. USP2009097585798.
  15. Yoshida,Masahiro; Hatate,Yasuo; Sarata,Tsugumitsu; Uemura,Yoshimitsu; Honda,Tomoyuki; Fukunaga,Hiroyuki; Iwashita,Masahiro. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same. USP2008097425518.
  16. Cooper, David J.; Dear, Ryan L.; Miller, Robert A.. Localized heating techniques incorporating tunable infrared element(s) for vacuum insulating glass units, and/or apparatuses for same. USP2017119822580.
  17. Naoya Hayakawa JP; Kazuhiro Nishikawa JP. Low-melting glass for covering substrate. USP2002116475605.
  18. Dennis, Timothy A.. Materials and/or method of making vacuum insulating glass units including the same. USP2014058733128.
  19. Jones, Jeffrey A.. Method and apparatus for installing vacuum insulated glass (VIG) window unit in existing window sash. USP2017099752375.
  20. Dennis, Timothy A.. Method of making vacuum insulated glass (VIG) window unit. USP20181010107028.
  21. Sridharan Srinivasan ; Faust William D. ; Roberts Gordon J.. Porcelain enamel composition for electronic applications. USP1999125998037.
  22. Merchant, Nazarali; Shaikh, Aziz S.; Sridharan, Srinivasan. Thick film pastes for fire through applications in solar cells. USP2012118309844.
  23. Merchant, Nazarali; Shaikh, Aziz S.; Sridharan, Srinivasan. Thick film pastes for fire through applications in solar cells. USP2014088802970.
  24. Jones, Jeffrey A.. Vacuum insulated glass (VIG) window unit including pump-out tube protection ring and/or cap and methods for making same. USP2017079695628.
  25. Dennis, Timothy A.; Pantke, Andrew W.. Vacuum insulated glass (VIG) window unit with reduced seal height variation and method for making same. USP2016089428952.
  26. Hogan, John P.; Dennis, Timothy Alan; Petrmichl, Rudolph Hugo; Kemenah, Greg. Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same. USP2017039593527.
  27. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20181010087676.
  28. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP2017109776910.
  29. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP20190210196299.
  30. Dennis, Timothy A.. Vanadium-based frit materials, and/or methods of making the same. USP2014088802203.
  31. Dennis, Timothy Alan. Vanadium-based frit materials, and/or methods of making the same. USP2016039290408.
  32. Dennis, Timothy A.. Vanadium-based frit materials, binders, and/or solvents and methods of making the same. USP2016049309146.