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Electro-optical multiple connection arrangement 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02B-006/12
출원번호 US-0504550 (1990-04-03)
우선권정보 DE-3910710 (1989-04-03)
발명자 / 주소
  • Lsch Kurt (Stuttgart DEX) Florjancic Matjaz (Murr DEX)
출원인 / 주소
  • Alcatel N.V. (Amsterdam NLX 03)
인용정보 피인용 횟수 : 42  인용 특허 : 0

초록 ▼

For the connection of an electro-optical chip (5) to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible interconnect member (2) and connected, using a film bonding process previously known only for purely electrical connections, both with connector elements

대표청구항 ▼

Multiple connection arrangement for connecting a substrate to an integrated circuit comprising at least one optical component, the connection arrangement comprising: a flexible interconnect member between the integrated circuit and the substrate, and at least one optical waveguide extending across t

이 특허를 인용한 특허 (42)

  1. Loiferman, Igor; Gibbs, Avi; Khoury, Samer, Cable backplane.
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  2. Liu,Jia; Nguyen,Luu Thanh; Pham,Ken; Mazotti,William Paul; Roberts,Bruce Carlton; Gee,Stephen Andrew; Briant,John P., Ceramic optical sub-assembly for optoelectronic modules.
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  3. Liu,Jia; Nguyen,Luu Thanh; Pham,Ken; Mazotti,William Paul; Roberts,Bruce Carlton; Gee,Stephen Andrew; Briant,John P., Ceramic optical sub-assembly for optoelectronic modules.
    상세보기
  4. Yoshimura, Tetsuzo; Roman, James; Wang, Wen-chou Vincent; Inao, Masaaki; McCormack, Mark Thomas, Device transfer method.
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  5. Herbsommer, Juan A.; Payne, Robert F.; Corsi, Marco; Haroun, Baher S.; Ali, Hassan, Dielectric waveguide core between ground planes secured in a channel.
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  6. Asghari, Mehdi; Shafiiha, Roshanak; Lee, Daniel C.; Feng, Dazeng; Zheng, Xuezhe; Krishnamoorthy, Ashok; Thacker, Hiren; Cunningham, John E., Edge coupling of optical devices.
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  7. Krishnamoorthy, Ashok V.; Zheng, Xuezhe, Edge-coupled optical proximity communication.
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  8. Howard, William E., Electro-optic connector module.
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  9. Michael Alan Meis ; Gordon Dwight Henson ; Terry Lee Smith ; Robert Travis Smith ; Dewain Robert Goff, Flexible optical circuit appliques.
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  10. Khoury, Samer; Gibbs, Avi; Loiferman, Igor, Graded midplane.
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  11. Aksyuk Vladimir Anatolyevich ; Bishop David John ; Bolle Cristian A. ; Gates ; II John VanAtta ; Giles Randy Clinton ; Scotti Ronald Edward, Hybrid electro-optic device with combined mirror arrays.
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  12. Herbsommer, Juan A.; Payne, Robert F.; Corsi, Marco; Haroun, Baher S.; Ali, Hassan, Microstrip line of different widths, ground planes of different distances.
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  13. Meis,Michael A.; Lee,Nicholas A.; Henson,Gordon D.; Carlson,Luke, Multi-layer optical circuit and method for making.
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  14. Yoshimura, Tetsuzo; Takahashi, Yashuhito; Inao, Masaaki; Lee, Michael G.; Chou, William; Beilin, Solomon I.; Wang, Wen-chou Vincent; Roman, James J.; Massingill, Thomas J., Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making.
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  15. Mazotti,William Paul; Huss,Brian Scott, Multi-purpose optical light pipe.
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  16. Yoshimura, Tetsuzo; Takahashi, Yasuhito; Roman, James; McCormack, Mark Thomas; Beilin, Solomon I.; Wang, Wen-chou Vincent; Inao, Masaaki, Optical coupling structures and the fabrication processes.
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  17. Minamio,Masanori; Fukuda,Toshiyuki; Yoshikawa,Noriyuki; Fujimoto,Hiroaki; Kunitomo,Yoshinobu, Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure.
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  18. Yoshimura, Tetsuzo; Takahashi, Yashuhito; Kuwabara, Kiyoshi; Beilin, Solomon I.; Peters, Michael; Wang, Wen-Chou Vincent; Inao, Masaaki, Optical reflective structures and method for making.
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  19. Mazotti,William Paul; Deane,Peter; Nguyen,Luu Thanh; Pham,Ken; Roberts,Bruce Carlton; Liu,Jia; Koh,Yongseon; Briant,John P.; Clarke,Roger William; Nelson,Michael R.; Smith,Christopher J.; Townsend,Ja, Optical sub-assembly for opto-electronic modules.
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  20. Mazotti, William Paul; Deane, Peter; Nguyen, Luu Thanh; Pham, Ken; Roberts, Bruce Carlton; Liu, Jia; Koh, Yongseon; Briant, John P.; Clarke, Roger William; Nelson, Michael R.; Smith, Christopher J.; , Optical sub-assembly for optoelectronic modules.
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  21. Yamada, Hidenori; Funada, Masao; Kamimura, Takeshi; Okada, Junji; Kyozuka, Shinya; Sakai, Kazuhiro; Hamada, Tsutomu; Ozeki, Shinobu; Takanashi, Osamu; Miura, Masaaki; Niitsu, Takehiro; Baba, Tomo; Hi, Optical wiring circuit, optical wiring circuits layered body and opto-electric wiring apparatus.
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  22. William Eric Corr GB, Optical/electrical inputs for an integrated circuit.
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  23. Li, Yuan-Liang, Optical/electrical interconnects and package for high speed signaling.
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  24. Rolston,David R.; Maj,Tomasz; Mainardi,Richard; Fu,Shao Wei; Moskovitz,Gary, Optically enabled hybrid semiconductor package.
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  25. Mazotti,William Paul; Huss,Brian Scott, Opto-electronic module form factor having adjustable optical plane height.
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  26. Yoshimura, Tetsuzo; Takahashi, Yashuhito; Inao, Masaaki; Lee, Michael G.; Chou, William; Beilin, Solomon I.; Wang, Wen-chou Vincent; Roman, James J.; Massingill, Thomas J., Opto-electronic substrates with electrical and optical interconnections and methods for making.
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  27. John A. Trezza, Optoelectronic connector system.
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  28. Kobayashi,Masahiko; Hiruta,Akihiro, Photoelectric composite interconnection assembly and electronics device using same.
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  29. Osenbach, John W.; Butrie, Timothy; Kish, Jr., Fred A.; Reffle, Michael, Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device.
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  30. Knapp James H. (Chandler AZ) Carney Francis J. (Gilbert AZ), Polyimide optical waveguide having electrical conductivity.
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  31. Kim, Sang-Hoon; Yoo, Je-Gwang; Kim, Joon-Sung; Cho, Han Seo, Printed circuit board and manufacturing method thereof.
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  32. Kim, Sang-Hoon; Yoo, Je-Gwang; Kim, Joon-Sung; Cho, Han Seo, Printed circuit board and manufacturing method thereof.
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  33. Kim,Sang Hoon; Yoo,Je Gwang; Kim,Joon Sung; Cho,Han Seo, Printed circuit board and manufacturing method thereof.
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  34. Griebenow, Uwe; Frohberg, Kai; Hoentschel, Jan, Semiconductor device comprising a buried waveguide for device internal optical communication.
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  35. Nakano, Yoshiaki; Song, Xueliang; Wang, Shurong, Signal transmission device.
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  36. Marjakangas, Jari, Signal transmission method and motherboard structure.
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  37. Yoshimura, Tetsuzo; Takahashi, Yasuhito; Roman, James; Beilin, Solomon I.; Wang, Wen-chou Vincent; Inao, Masaaki, Single and multilayer waveguides and fabrication process.
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  38. Tourné, Joseph A. A. M., System and method for integrating optical layers in a PCB for inter-board communications.
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  39. Tourn챕,Joseph A. A. M., System and method for integrating optical layers in a PCB for inter-board communications.
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  40. Tetsuzo Yoshimura ; Yashuhito Takahashi ; Masaaki Inao ; Michael G. Lee ; William Chou ; Solomon I. Beilin ; Wen-chou Vincent Wang ; James J. Roman ; Thomas J. Massingill, Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making.
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  41. Nguyen, Luu Thanh; Pham, Ken; Deane, Peter; Mazotti, William Paul; Roberts, Bruce Carlton; Nguyen, Hau Thanh; Briant, John P.; Clarke, Roger; Nelson, Michael R.; Townsend, Janet E., Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package.
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  42. Yoshimura, Tetsuzo; Takahashi, Yashuhito; Inao, Masaaki; Lee, Michael G.; Chou, William; Beilin, Solomon I.; Wang, Wen-chou Vincent; Roman, James J.; Massingill, Thomas J., Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making.
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