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Extended integration semiconductor structure with wiring layers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
출원번호 US-0301972 (1989-01-25)
발명자 / 주소
  • Jacobs Scott L. (Apex NC)
출원인 / 주소
  • Mosaic, Inc. (San Diego CA 02)
인용정보 피인용 횟수 : 166  인용 특허 : 0

초록 ▼

A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding t

대표청구항 ▼

An extended integration structure comprising: a thin film decal having at least one wiring layer therein; a support ring attached to said decal, for maintaining said decal under tension inside said support ring; at least one integrated circuit chip attached to said decal inside said support ring, sa

이 특허를 인용한 특허 (166)

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