이 특허를 인용한 특허 (154)

1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.

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2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.

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3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.

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4. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic comp.

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5. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.

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6. Ballard Gerald W. (West Dundee IL) Turocy James W. (Arlington Heights IL) Beise Thomas R. (Hoffman Estates IL), Apparatus and method for spray-cooling an electronic module.

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7. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus and method for spray-cooling an electronic module.

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8. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.

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9. Arena, Anthony; Sanderson, Daniel, Battery assembly.

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10. Arena, Anthony, Battery cell assembly.

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11. Garascia, Michael P.; Smith, Alexander Jeffrey, Battery cell assembly.

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12. Yum, Juil; Ketkar, Satish; Yang, Heekook; Lent, Steven, Battery cell assembly.

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13. Beltz, David; Yang, Heekook; Arena, Anthony; Ketkar, Satish, Battery cell assembly and method for coupling a cooling fin to first and second cooling manifolds.

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14. Merriman, Robert; Ketkar, Satish; Nielson, Michael; Isayev, Igor, Battery cell assembly and method for manufacturing a cooling fin for the battery cell assembly.

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15. Merriman, Robert; Nielson, Michael; Isayev, Igor; Ketkar, Satish, Battery cell assembly and method for manufacturing a cooling fin for the battery cell assembly.

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16. Ketkar, Satish, Battery cell assembly and method for manufacturing the battery cell assembly.

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17. Payne, Josh; Isayev, Igor; Yang, Heekook; Koetting, William; Morris, Peter; Natarajan, Venkatachala Moorthi, Battery cell assembly having heat exchanger with serpentine flow path.

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18. Koetting, William; O'Kane, Sean; Tom, Kwok; Payne, Josh, Battery cell assembly, heat exchanger, and method for manufacturing the heat exchanger.

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19. Merriman, Robert; Arena, Anthony; Beltz, David; Phillips, Greg; Garascia, Michael; Yang, Heekook, Battery module and method for assembling the battery module.

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20. Gadawski, Thomas J.; Payne, Josh, Battery module and method for cooling the battery module.

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21. Koetting, William; Payne, Josh, Battery module and method for cooling the battery module.

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22. Koetting, William; Payne, Josh; Tom, Kwok, Battery module having cooling manifold with ported screws and method for cooling the battery module.

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23. Arena, Anthony; Laurain, Paul, Battery pack.

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24. Merriman, Robert; Yang, Heekook, Battery pack and method of assembling the battery pack.

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25. Yum, Juil; Merriman, Robert; Arena, Anthony; Brown, Todd R., Battery pack having a cooling plate assembly.

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26. Ketkar, Satish; Merriman, Robert; Nielson, Michael; Isayev, Igor, Battery system and method for cooling a battery cell assembly.

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27. Ketkar, Satish; Laurain, Paul; McCormick, Richard, Battery system and method for cooling the battery system.

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28. Yum, Juil; Ketkar, Satish, Battery system and method of assembling the battery system.

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29. Gadawski, Thomas J.; Ketkar, Satish; Nielson, Michael, Battery system having an evaporative cooling member with a plate portion and a method for cooling the battery system.

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30. Koetting, William; Payne, Josh, Battery systems, battery modules, and method for cooling a battery module.

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31. Alfano, Donald E.; Etter, Brett; Dupuis, Timothy, Bidirectional multiplexed RF isolator.

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32. Dong, Zhiwei; Yan, Shouli; Thomsen, Axel; Tang, William W. K.; Leung, Ka Y., Capacitive isolation circuitry.

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33. Dupuis, Timothy; Thomsen, Axel; Dong, Zhiwei; Leung, Ka Y., Capacitive isolator.

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34. Dong, Zhiwei; Leung, Ka Y., Capacitive isolator with schmitt trigger.

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35. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.

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36. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.

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37. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.

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38. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.

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39. Flannery, Matt D.; Schmidt, James E.; Weyant, Jens E.; Garner, Scott D., Card retainer device.

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40. Chen, Baoxing; Kliger, Ronn, Chip-scale coils and isolators based thereon.

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41. Giese Douglas A. ; Pagan Michael J., Circuit board card cage with one-piece integral card guide units.

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42. Christiansen, Martin Brokner; Chorosinski, Leonard George; Heffner, H. Craig; Wakamiya, Stanley Katsuyoshi, Circuit card rack system and method.

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43. Gomez, Michael E.; Watkins, Ronnie L.; Smart, Denise L., Circuit card rail positioning system.

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44. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.

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45. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.

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46. Musciano, Michael Joseph; Daniels, Douglas Ronald; Barabi, Nasser, Cooling air distribution scheme for communication boards.

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47. Tantolin, Christian; Sarno, Claude, Cooling an electronic device.

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48. Chandrakant D. Patel ; Vernon Alan Barber ; Hannsjorg Obermaier ; Christian Belady ; David Mike Chastain, Cooling arrangement for high density packaging of electronic components.

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49. Musciano, Michael Joseph; Daniels, Douglas Ronald; Barabi, Nasser, Cooling configuration for communication boards.

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50. Byers, Charles C.; Scofield, William H., Cooling manifold.

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51. Payne, Josh, Cooling manifold.

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52. Yamazaki, Koichi, Cooling mechanism with coolant, and treatment device with cooling mechanism.

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53. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.

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54. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.

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55. Rasmussen,Neil; Bean,John H.; Uhrhan,Greg R.; Buell,Scott D., Cooling system and method.

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56. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.

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57. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.

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58. Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong, Cooling system for electronic components.

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59. Knight,Paul A.; Kabrell,Carl Axel Ingemar, Dry-wet thermal management system.

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60. Nelson, Erik; Teachout, Jeffrey; Spechts, Lee, Electrical cabinet having printed circuit board receiving guide slots.

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61. Walz,Andrew A.; Tegart,Donald A., Electrical module and support therefor with integrated cooling.

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62. Heard, Christopher; Pfahnl, Andreas C., Electronic system with non-parallel arrays of circuit card assemblies.

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63. Bilski, W. John, Electronics cabinet and rack cooling system and method.

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64. Craft ; Jr. Thomas F. ; Kay Jason A. ; Pawlenko Ivan ; D'Alessio Alfonso J. ; Tancreto Anthony R. ; Shevchuk George, Enclosure for electronic components.

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65. Williamson,Russell John; Lillis,Elizabeth Anne, Fan speed control.

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66. Blake John,IEX, Fan speed control system.

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67. Blake,John, Fan speed control system.

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68. Ditri, John, Fluid actuated cooling card retainer.

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69. Guyuron, Bahman; Bahr, Fred; Pulver, Brad A.; Horvath, Jamie; Guyuron, Glen M., Heat exchanger.

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70. Mojaver, Michael; Dong, Quan; Fisk, Ian; Gray, Andrew, High density storage system.

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71. Bean, Jr., John H., Ice thermal storage.

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72. Bean, Jr., John H., Ice thermal storage.

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73. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.

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74. Wexler, Peter, In-row air containment and cooling system and method.

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75. Holahan, Michael M.; Bober, Nick R., Integrated card rail and cooling module for embedded computing systems.

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76. Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.

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77. Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.

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78. Weber Richard M. ; Kviatkofsky James F., Intelligent coolant flow control system.

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79. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.

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80. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.

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81. Ma, Shaoyu; Zhao, Tianting; Chen, Baoxing, Isolated error amplifier for isolated power supplies.

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82. Callahan, Phil A.; Javed, Ahsan; Dong, Zhiwei; Thomsen, Axel; Alfano, Donald E.; Dupuis, Timothy; Leung, Ka Y., Isolator with complementary configurable memory.

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83. Kehl,Kenyon; Phielix,Tom J.; Cronin,William A., Liquid cooled electronic chassis having a plurality of phase change material reservoirs.

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84. Garrett, Gerald Bruce, Liquid storage and cooling computer case.

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85. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.

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86. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.

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87. Meijer, Gerhard I.; Schmidt, Derek I.; Steinke, Mark E.; Womble, James S., Liquid-cooled memory system having one cooling pipe per pair of DIMMs.

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88. Sharfi, Benjamin K., Locking displaceable frame.

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89. Haigh, Geoffrey T.; Chen, Baoxing, Logic isolator.

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90. Leung, Ka Y.; Alfano, Donald E.; Bresemann, David P., MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link.

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91. Tutunoglu, Ozan, Method and apparatus for cooling.

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92. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.

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93. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.

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94. Cipolla, Thomas M.; Tian, Shurong; Colgan, Evan George; Coteus, Paul W.; Hall, Shawn Anthony, Method and apparatus of water cooling several parallel circuit cards each containing several chip packages.

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95. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.

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96. Garner, Robert Barton; Wilcke, Winfried Wolfgang, Method for high-density packaging and cooling of high-powered compute and storage server blades.

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97. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.

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98. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.

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99. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.

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100. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.

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101. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.

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102. Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.

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103. Yun, Ruida; Sun, Yuanjie; Chen, Baoxing, Methods and structures to generate on/off keyed carrier signals for signal isolators.

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104. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.

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105. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.

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106. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.

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107. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.

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108. Alfano, Donald E.; Etter, Brett; Dupuis, Timothy, Multiplexed RF isolator circuit.

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109. Haigh, Geoffrey T.; Chen, Baoxing, Non-optical signal isolator.

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110. Dupuis, Timothy, On chip transformer isolator.

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111. Dupuis,Timothy, On chip transformer isolator.

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112. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.

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113. Okazaki, Nobuo, Operation control device for driving robot.

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114. Rohr, Daniel J., Optically detected liquid depth information in a climate control unit.

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115. Facusse, Mario; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.

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116. Chou,Der Jeou; Nelson,Daniel Todd, Phase-change heat reservoir device for transient thermal management.

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117. Chou,Der Jeou; Nelson,Daniel Todd, Phase-change heat reservoir device for transient thermal management.

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118. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.

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119. Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.

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120. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.

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121. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.

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122. Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.

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123. Arena John J. ; Smith David M. ; Matonis Richard A., Plenumless air cooled avionics rack.

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124. Dupuis,Timothy, RF isolator for isolating voltage sensing and gate drivers.

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125. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.

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126. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.

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127. Arvelo, Amilcar R.; Brandon, Mark A.; Campbell, Levi A.; Doan, Tan D.; Ellsworth, Jr., Michael J.; Kemink, Randall G.; McKeever, Eric J., Selective clamping of electronics card to coolant-cooled structure.

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128. Harvey, Rex J.; Frindt, Jr., Robert A., Self-adjusting clamp system.

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129. Yun, Ruida; Chen, Baoxing, Signal isolator system with protection for common mode transients.

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130. Chen, Baoxing, Signal isolator using micro-transformers.

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131. Chen, Baoxing; Haigh, Geoffrey, Signal isolators using micro-transformers.

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132. Chen, Baoxing; Haigh, Geoffrey, Signal isolators using micro-transformers.

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133. Chen, Baoxing; Haigh, Geoffrey, Signal isolators using micro-transformers.

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134. Chen,Baoxing; Haigh,Geoffrey, Signal isolators using micro-transformers.

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135. Bear, Daniel B., Single or dual buss thermal transfer system.

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136. Knight,Paul A.; Fales,Brent M., Spray cool system with a dry access chamber.

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137. Knight,Paul A., Spray coolant reservoir system.

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138. Tilton Donald E. ; Seaney Kevin D. ; Baddeley Ryan J ; Tilton Charles L, Spray cooled circuit card cage.

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139. Dupuis, Timothy, Spread spectrum isolator.

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140. Bean, John H.; Lomas, Jonathan M., Sub-cooling unit for cooling system and method.

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141. Bean, John H; Lomas, Jonathan M, Sub-cooling unit for cooling system and method.

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142. Bean,John H.; Lomas,Jonathan M., Sub-cooling unit for cooling system and method.

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143. Hulan, Jamie; Perry, David; Straznicky, Ivan, Supplemental heat conduction path for card to chassis heat dissipation.

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144. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.

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145. VanGilder, James William, System and method for prediction of temperature values in an electronics system.

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146. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.

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147. Akselband, Boris, Tapered cold plate.

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148. Semple J. Brooks (Warrenton VA), Temperature limiting apparatus for elevator controls.

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149. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.

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150. Chen, Lei, Thermoelectric temperature control with convective air flow for cooling elevator components.

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151. Dupuis, Timothy, Transformer coils for providing voltage isolation.

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152. Jacob Tzlil IL; Ronen Zagoory IL, Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module.

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153. Mosier, David W.; Bame, Rodney G., Wedge based circuit board retainer.

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154. Mao, Shau-Gang, Wireless power transmitting apparatus.

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