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Apparatus for controlled air-impingement module cooling 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02B-001/00
출원번호 US-0446258 (1989-12-05)
발명자 / 주소
  • Hamadah Talal T. (Littleton MA) Ryder Douglas N. (Amherst NH) Friedman Harvey S. (Sudbury MA)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 59  인용 특허 : 0

초록 ▼

A modularized air-impingement cooling apparatus is provided for removing heat from integrated circuit components mounted to a circuit board configured for insertion into a computer backplane. In general, pin-fin designed heat sinks are attached to the electronic components requiring heat removal. Fi

대표청구항 ▼

Cooling apparatus for removing the heat from heat dissipating electronic components mounted to a first circuit board configured for insertion into a backplane, said apparatus comprising: wall means for substantially thermally isolating each of said electronic components one from the other; inlet mea

이 특허를 인용한 특허 (59)

  1. Spokoiny, Michael; Kerner, James M.; Qiu, Xinliang; Lux, Craig J.; Maurus, James W., Airflow heat dissipation device.
    상세보기
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
    상세보기
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
    상세보기
  4. Baker Jay DeAvis ; Kneisel Lawrence Leroy ; Lemecha Myron, Apparatus and method of assembling vehicle instrument panel structural and electronic components.
    상세보기
  5. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
    상세보기
  6. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
    상세보기
  7. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
    상세보기
  8. Hamilton Roger Duane ; Kang Sukhvinder Singh ; Mann Christopher William, Bi-directional cooling arrangement for use with an electronic component enclosure.
    상세보기
  9. Milligan,Charles A.; Leonhardt,Michael L.; Selkirk,Stephen S.; Nguyen,Thai; McCown,Steven H.; Konshak,Michael V.; Klunker,Robert; Nions,Gerald O.; Debiez,Jacques; Duval,Ludovic; Le. Graverand,Philippe Y., Canister-based storage system.
    상세보기
  10. Milligan,Charles A.; Leonhardt,Michael L.; Selkirk,Stephen S.; Nguyen,Thai; McCown,Steven H.; Konshak,Michael V.; Klunker,Robert; O'Nions,Gerald; Debiez,Jacques; Duval,Ludovic; Le Graverand,Philippe Y., Canister-based storage system.
    상세보기
  11. Hoffman, Mark S.; Drahms, David C., Circuit board cover with exhaust apertures for cooling electronic components.
    상세보기
  12. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
    상세보기
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
    상세보기
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
    상세보기
  15. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
    상세보기
  16. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
    상세보기
  17. Umezawa Kazuhiko,JPX, Cooling structure for multi-chip module.
    상세보기
  18. Sakaiya, Hiroyuki; Kaga, Kunihiko, Device for radiating heat generating electronic parts, an electronic equipment having a heat radiating construction, and an electronic apparatus.
    상세보기
  19. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Direct jet impingement-assisted thermosyphon cooling apparatus and method.
    상세보기
  20. Hashikura, Manabu; Shimizu, Tatsuya; Nishida, Futoshi, Electric connection box.
    상세보기
  21. Mongia, Rajiv K.; Bhattacharya, Anandaroop, Electromagnetic interference shielding for device cooling.
    상세보기
  22. Konshak, Michael V.; Eichel, Dale R.; Fechner, Jimmy R., Forced air system for cooling a high density array of disk drives.
    상세보기
  23. Shuy, Geoffrey Wen-Tai, Heat exchange enhancement.
    상세보기
  24. Straub, Jr.,Walter H.; Holmes,Jonathan Frank; Nguyen,Voi V., Heat exchanger system for circuit card assemblies.
    상세보기
  25. Spokoyny, Mikhail; Ortenberg, Nick, Heat exchanging apparatus and method for transferring heat.
    상세보기
  26. Song, Tae-Ho; Kim, Sung-Jin, Heat sink.
    상세보기
  27. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  28. Ghosh, Debashis; Bhatti, Mohinder Singh, Impingement cooled heat sink with low pressure drop.
    상세보기
  29. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
    상세보기
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
    상세보기
  31. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus.
    상세보기
  32. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus.
    상세보기
  33. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah, Liquid impingement cooling module for semiconductor devices.
    상세보기
  34. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
    상세보기
  35. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
    상세보기
  36. Sauciuc, Ioan; Chrysler, Gregory M., Localized microelectronic cooling apparatuses and associated methods and systems.
    상세보기
  37. Flotta, Matteo; Martin, Yves C.; Romankiw, Lubomyr T.; van Kessel, Theodore G., Method and apparatus for chip cooling.
    상세보기
  38. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
    상세보기
  39. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
    상세보기
  40. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
    상세보기
  41. Edward, Brian J; Sabatino, Mark; Ruzicka, Peter J, Method and apparatus for dissipating heat, and radar antenna containing heat dissipating apparatus.
    상세보기
  42. Bhattacharya, Anandaroop; Mongia, Rajiv K.; Varadarajan, Krishnakumar; Vedula, Rajendra Prasad; Prabhu, Siddini Venkatesh, Method and apparatus for inverted vortex generator for enhanced cooling.
    상세보기
  43. Bhattacharya, Anandaroop; Mongia, Rajiv K.; Varadarajan, Krishnakumar, Method, apparatus and computer system for vortex generator enhanced cooling.
    상세보기
  44. Konshak, Michael V.; Eichel, Dale R.; Cook, Wayne K.; Fechner, Jimmy R., Modular multiple disk drive apparatus.
    상세보기
  45. Konshak,Michael V.; Eichel,Dale R.; Cook,Wayne K.; Fechner,Jimmy R., Modular multiple disk drive apparatus.
    상세보기
  46. Konshak, Michael V.; Fechner, Jimmy R.; Eichel, Dale R.; Kemmer, Lawrence R.; Snyder, Mark S.; Wewel, Paul A., Multi-element storage array.
    상세보기
  47. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
    상세보기
  48. Mehring, Carsten, Passively controlled smart microjet cooling array.
    상세보기
  49. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, immersion-cooling of electronic compnent(s).
    상세보기
  50. Liu, Yao-Hsien; Chang, Sheng-Kai, Rack assembly.
    상세보기
  51. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
    상세보기
  52. Pike, Dion; Chow, Joey; Sprately, Jonathan; Serjak, Peter; DeCecco, Stefano, System and method of configuring a network element.
    상세보기
  53. Hara,Chikashi; Hayakawa,Kazuyo; Kumai,Satoru; Nomura,Taichiroh; Sakurai,Toshio; Takenoshita,Hiroyuki, System for cooling interior and external housing surfaces of an electronic apparatus.
    상세보기
  54. Hauser, Raymond; Reid, Bruce E.; Rousser, Donald; Keller, Scott W., Systems and methods for cooling a controller assembly.
    상세보기
  55. Hauser, Raymond; Reid, Bruce E.; Rousser, Donald; Keller, Scott W., Systems and methods for cooling a controller assembly.
    상세보기
  56. Hauser, Raymond; Reid, Bruce E.; Rousser, Donald; Keller, Scott W., Systems and methods for cooling a controller assembly.
    상세보기
  57. Sommerer, Yannick; Jeanmougin, Stéphanie, Thermal protection device for equipment in a turbomachine engine compartment.
    상세보기
  58. Remsburg Ralph, Thermosyphon-powered jet-impingement cooling device.
    상세보기
  59. Shabbir, Hasnain; Strmiska, Bernard D., Universal blank for air flow management.
    상세보기

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