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Positive working dry film element having a layer of resist composition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03C-001/76
출원번호 US-0507337 (1990-04-10)
발명자 / 주소
  • Bauer Richard D. (Kennett Square PA) Chen Gwendyline Y. (Wilmington DE) Hertler Walter R. (Kennett Square PA) Wheland Robert C. (Wilmington DE)
출원인 / 주소
  • E. I. Du Pont de Nemours and Company (Wilmington DE 02)
인용정보 피인용 횟수 : 30  인용 특허 : 0

초록

This invention relates to positive working resist compositions having utility in dry film photoresists and to fully aqueous methods for developing and stripping them.

대표청구항

A dry film photoresist element comprising a thin flexible polymeric film support having adhered thereto with low to moderate adherence a solid photosensitive layer having a thickness of about 8 microns or greater, said layer comprising the following composition: (a) a polymer chosen from the group c

이 특허를 인용한 특허 (30)

  1. Yokokawa, Natsumi; Hirano, Shuji; Takizawa, Hiroo; Nihashi, Wataru, Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, manufacturing method of electronic device, electronic device and resin.
  2. Zhong, Xing-Fu; Flaim, Tony D.; Malhotra, Jyoti, Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride.
  3. Laubacher Daniel Bruce ; Pang Philip Shek Wah, Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof.
  4. Khojasteh,Mahmoud; Chen,Kuang Jung; Varanasi,Pushkara Rao, Low activation energy positive resist.
  5. Kroeninger, Werner; Schneegans, Manfred, Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer.
  6. Kröninger, Werner; Schneegans, Manfred, Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer.
  7. Kr��ninger,Werner; Schneegans,Manfred, Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer.
  8. Kamijima, Akifumi, Method for forming resist pattern and manufacturing method of thin-film element.
  9. Zhong, Xing-Fu; Malhotra, Jyoti K.; Li, Chenghong, Negative photoresist for silicon KOH etch without silicon nitride.
  10. Cameron, James F.; Pohlers, Gerhard, Photoacid generator systems for short wavelength imaging.
  11. Johnson,Donald W.; Weber,William D.; Waterson,Pamela J.; Urdi,Vincent R.; Molea,Joseph R.; Strand,Thomas Roger, Photoimageable coating composition and composite article thereof.
  12. David P. Sinclair ; Douglas E. Fjare ; John T. Hoback ; Terre L. VanKirk ; Donald E. Rubis ; David A. Wargowski ; Wen-Feng Liu ; Paul A. Sanchez, Photoimageable compositions and films for printed wiring board manufacture.
  13. Kawamura, Maki; Nakanishi, Junji, Photoresist composition.
  14. Schadt, III, Frank Leonard; Fryd, Michael; Periyasamy, Mookkan, Photoresists and processes for microlithography.
  15. Schadt, III,Frank Leonard; Fryd,Michael; Periyasamy,Mookkan, Photoresists and processes for microlithography.
  16. Allen Robert D. (San Jose CA) Brunsvold William R. (Poughkeepsie NY) Carpenter Burton J. (Austin TX) Hinsberg William D. (Fremont CA) LaTorre Joseph (Austin TX) McMaster Michael G. (Austin TX) Montgo, Positive photoresist system for near-UV to visible imaging.
  17. Hatanaka, Tadashi; Uchiyama, Megumi, Positive photosensitive resin composition and lyophobic film.
  18. Imai, Genji; Hasegawa, Takeya, Positive type actinic ray-curable dry film and pattern-forming method by use of the same.
  19. Kim, Byoung-Kee; Park, Se-Hyung; Park, Jong-Min; Baek, Seong-In, Positive type dry film photoresist.
  20. Park, Se-Hyung; Kim, Byoung-Kee; Park, Jong-Min; Baek, Seong-In, Positive type dry film photoresist and composition for preparing the same.
  21. Satoshi Takechi JP; Makoto Takahashi JP; Yuko Kaimoto JP, Radiation sensitive material and method for forming pattern.
  22. Takechi Satoshi,JPX ; Takahashi Makoto,JPX ; Kaimoto Yuko,JPX, Radiation sensitive material and method for forming pattern.
  23. Takechi, Satoshi; Takahashi, Makoto; Kaimoto, Yuko, Radiation sensitive material and method for forming pattern.
  24. Takechi,Satoshi; Takahashi,Makoto; Kaimoto,Yuko, Radiation sensitive material and method for forming pattern.
  25. Takechi,Satoshi; Takahashi,Makoto; Kaimoto,Yuko, Radiation sensitive material and method for forming pattern.
  26. Kishida Takahito (Yao JPX) Matsumura Akira (Hirakata JPX) Kawakami Atsushi (Suita JPX), Resist composition.
  27. Li, Chenghong; Ruben, Kimberly A.; Flaim, Tony D., Spin-on protective coatings for wet-etch processing of microelectronic substrates.
  28. Li, Chenghong; Yess, Kimberly A.; Flaim, Tony D., Spin-on protective coatings for wet-etch processing of microelectronic substrates.
  29. Xu, Gu; Yess, Kimberly A.; Flaim, Tony D., Spin-on protective coatings for wet-etch processing of microelectronic substrates.
  30. Xu, Gu; Yess, Kimberly A.; Flaim, Tony D., Spin-on protective coatings for wet-etch processing of microelectronic substrates.
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