이 특허를 인용한 특허 (178) 인용/피인용 타임라인 분석

1. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.

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2. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.

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3. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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4. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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5. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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6. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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7. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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8. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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9. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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10. Anthony, Jr.,Anthony A.; Anthony,William M., Arrangement for energy conditioning.

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11. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.

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12. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.

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13. Anthony, Anthony A.; Anthony, William M., Arrangements for energy conditioning.

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14. Elkhatib, Hecham K.; McGrath, James L.; Mendenhall, David W.; MacKillop, William J.; Raclawski, Alan A., Cable assembly with a material at an edge of a substrate.

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15. Elkhatib, Hecham K.; McGrath, James L.; Mendenhall, David W.; MacKillop, William J.; Raclawski, Alan A., Cable assembly with printed circuit board having a ground layer.

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16. Lucas Gregory L., Capacitive PCB with internal capacitive laminate.

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17. Jow,Uei Ming; Lai,Ying Jiunn; Wu,Chun Kun; Wei,Pel Shen; Chen,Chang Sheng; Weng,Ching Liang, Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode.

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18. Cox,G. Sidney, Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof.

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19. Howard, James Robert; Lucas, Gregory Llewellyn, Capacitive power and ground plane structure utilizing fractal elements for the reduction of radiated emissions.

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20. Das, Rabindra N.; Egitto, Frank D.; Lauffer, John M.; Lin, How T.; Markovich, Voya R., Capacitive substrate and method of making same.

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21. Hoffarth Joseph Gerard ; Lauffer John Matthew ; Mahmoud ; deceased Issa Said, Capacitor formed within printed circuit board.

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22. Hoffarth Joseph Gerard ; Lauffer John Matthew ; Mahmoud ; deceased Issa Said, Capacitor formed within printed circuit board.

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23. O'Bryan, Jr., Nelson B., Capacitor having epoxy dielectric layer cured with aminophenylfluorenes.

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24. Das, Rabindra N.; Lauffer, John M.; Papathomas, Kostas I.; Poliks, Mark D., Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate.

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25. Das,Rabindra N.; Lauffer,John M.; Markovich,Voya R.; Poliks,Mark D., Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing.

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26. Jow, Uei Ming; Chen, Chang Sheng; Lai, Ying Jiunn; Shyu, Chin Sun, Capacitor structure.

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27. Chen, Wei-Ting; Chen, Chang-Sheng; Shyu, Chin-Sun; Wei, Chang-Lin; Tsai, Cheng-Hua; Chin, Kuo-Chiang, Capacitor structure with raised resonance frequency.

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28. McKinzie, III, William E.; Rogers, Shawn D., Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards.

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29. McKinzie, III,William E.; Rogers,Shawn D., Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards.

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30. Sugane, Mitsuhiko; Matsui, Akiko; Mukoyama, Takahide; Yamada, Tetsuro; Hiroshima, Yoshiyuki; Choraku, Kohei, Circuit board and method of manufacturing the same.

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31. Steigerwald Todd W. ; Sebring Mitchell C., Circuit board voltage plane impedance matching.

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32. Das, Rabindra N.; Rowlands, Michael J., Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate.

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33. Das, Rabindra N.; Papathomas, Konstantinos I.; Markovich, Voya R.; McNamara, James J., Circuitized substrate with low loss capacitive material and method of making same.

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34. Anthony, Anthony A., Component carrier.

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35. Anthony,Anthony A., Component carrier.

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36. Anthony,Anthony; Anthony,William M., Component carrier.

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37. Anthony,Anthony; Anthony,William M., Component carrier.

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38. Shin, Hyo Soon; Kim, Jin Ho; Kim, Jeong Joo; Ko, Min Ji, Composition for forming dielectric, capacitor produced using composition, and printed circuit board provided with capacitor.

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39. Anthony, William M., Conditioner with coplanar conductors.

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40. Anthony, William M., Conditioner with coplanar conductors.

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41. Hertel, Thomas A.; Soendker, Erich H.; Saldivar, Horacio, Conductive emissions protection.

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42. Anthony,Anthony, Connector related structures including an energy conditioner.

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43. Budnaitis John J. ; Fischer Paul J. ; Hanson David A. ; Noddin David B. ; Sylvester Mark F. ; Petefish William George, Constraining ring for use in electronic packaging.

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44. Budnaitis John J. ; Fischer Paul J. ; Hanson David A. ; Noddin David B. ; Sylvester Mark F. ; Petefish William George, Constraining ring for use in electronic packaging.

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45. Budnaitis John J. ; Fischer Paul J. ; Hanson David A. ; Noddin David B. ; Sylvester Mark F. ; Petefish William George, Constraining ring for use in electronic packaging.

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46. Wan,Lixi, Design of low inductance embedded capacitor layer connections.

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47. Swaminathan, Madhavan; Engin, Ege; Muthana, Prathap; Srinivasan, Krishna, Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit.

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48. Hartman, William F.; Slenes, Kirk M.; Law, Kristen J., Dielectric material including particulate filler.

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49. Kuwako, Fujio; Yamazaki, Kazuhiro; Matsushima, Toshifumi, Double-sided copper clad laminate for capacitor layer formation and its manufacturing method.

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50. McGrath, James L.; Mendenhall, David W.; Elkhatib, Hecham K.; MacKillop, William J.; Raclawski, Alan A., Electrical connector.

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51. Anthony,Anthony A.; Anthony,William M., Electrode arrangement for circuit energy conditioning.

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52. Lin, Ting Hao; Chang, Chien Wei, Embedded passive device structure and manufacturing method thereof.

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53. Anthony, David J., Energy conditioner structures.

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54. Anthony, William M., Energy conditioner with tied through electrodes.

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55. Anthony, William M., Energy conditioner with tied through electrodes.

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56. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.

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57. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.

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58. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.

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59. Anthony, Anthony A.; Anthony, William M.; Musil, Kenneth W., Energy conditioning circuit assembly.

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60. Anthony,Anthony A.; Anthony,William M., Energy conditioning circuit assembly.

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61. Anthony,Anthony; Anthony,William, Energy conditioning structure.

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62. Anthony,William M., Energy pathway arrangement.

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63. Anthony,William M.; Anthony,Anthony A.; Muccioli,James P., Energy pathway arrangement.

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64. Anthony,William M., Energy pathway arrangements for energy conditioning.

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65. Anthony,William M., Energy pathway arrangements for energy conditioning.

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66. Anthony, Anthony, Filter assembly.

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67. Fillion, Arthur J.; Kogami, Osamu; Kurata, Kanji; Murray, Jeffrey A.; Smith, Terrence A., Finishing method for producing thin-laminate panels.

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68. Andresakis, John A.; Skorupski, Edward C.; Zimmerman, Scott; Smith, Gordon, Formation of an embedded capacitor plane using a thin dielectric.

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69. Hunt Andrew T. ; Hwang Tzyy Jiuan ; Hornis Helmut G. ; Lin Wen-Yi, Formation of thin film capacitors.

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70. Hunt, Andrew T.; Hwang, Tzyy Jiuan; Hornis, Helmut G.; Lin, Wen-Yi, Formation of thin film capacitors.

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71. Sundaram, Senthil Kumar; Krishnamoorthy, Rohini, High voltage tank assembly for radiation generator.

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72. Sundaram,Senthil Kumar, High voltage tank assembly for radiation generator.

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73. Lucas Gregory L., In situ method of forming a bypass capacitor element internally within a capacitive PCB.

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74. Brandt Lutz W. ; Matijasevic Goran ; Gandhi Pradeep R., Individual embedded capacitors for laminated printed circuit boards.

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75. Kumashiro, Yasushi; Hirata, Yoshitaka; Takanezawa, Shin; Shimada, Yasushi; Otsuka, Kazuhisa; Kuriya, Hiroyuki; Yamamoto, Kazunori, Insulation material, film, circuit board and method of producing them.

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76. Barnett,Ronald J., Integral charge storage basement and wideband embedded decoupling structure for integrated circuit.

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77. Barnett,Ronald J., Integral charge storage basement and wideband embedded decoupling structure for integrated circuit.

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78. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.

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79. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.

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80. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.

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81. Anthony, David; Anthony, Anthony; Anthony, William M.; Muccioli, James; Neifeld, Richard A., Internally shielded energy conditioner.

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82. Frankeny Jerome Albert ; Frankeny Richard Francis ; Hayden Terry Frederick ; Imken Ronald Lann ; Rice Janet Louise, Laminar stackable circuit board structure with capacitor.

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83. Frankeny Jerome Albert ; Frankeny Richard Francis ; Hayden Terry Frederick ; Imken Ronald Lann ; Rice Janet Louise, Laminar stackable circuit board structure with capacitor.

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84. Fjelstad, Joseph C.; Grundy, Kevin P.; Segaram, Para K.; Wiedemann, William F.; Obenhuber, Thomas J.; Obenhuber, legal representative, Inessa, Low profile discrete electronic components and applications of same.

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85. Anthony, Anthony A.; Anthony, William M., Manufacture including shield structure.

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86. Smith, Larry D.; Novak, Istvan; Freda, Michael C.; Hassanzadeh, Ali, Method and apparatus for distributing power to integrated circuits.

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87. San, Lim Siong; Choon, Neo Mok; Lim, Kevin; Yeow, Kelvin; Chiah, Tan Kwang, Method and process for embedding electrically conductive elements in a dielectric layer.

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88. Honda,Kazuyoshi; Echigo,Noriyasu; Odagiri,Masaru; Sugimoto,Takanori, Method for fabricating semiconductor component.

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89. Anthony, William M.; Anthony, David; Anthony, Anthony, Method for making internally overlapped conditioners.

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90. Lauffer John M. ; Papathomas Konstantinos, Method for producing a circuit board with embedded decoupling capacitance.

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91. Lauffer, John M.; Papathomas, Konstantinos, Method for producing printed circuit board with embedded decoupling capacitance.

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92. Carpenter Richard W., Method for securing and processing thin film materials.

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93. Sohn,Seung Hyun; Chung,Yul Kyo; Jin,Hyun Ju; Park,Eun Tae, Method of fabricating printed circuit board having embedded multi-layer passive devices.

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94. Appelt, Bernd K.; Lauffer, John M., Method of forming a capacitive element.

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95. Bowles, Philip Harbaugh; Mobley, Washington Morris; Parker, Richard Dixon; Ellis, Marion Edmond, Method of forming integral passive electrical components on organic circuit board substrates.

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96. Das,Rabindra N.; Lauffer,John M.; Lin,How T.; Markovich,Voya R., Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate.

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97. Das,Rabindra N.; Lauffer,John M.; Lin,How T.; Markovich,Voya R., Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate.

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98. Das, Rabindra N.; Rowlands, Michael J., Method of making a circuitized substrate.

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99. Das,Rabindra N.; Lauffer,John M.; Markovich,Voya R.; Matthews,James T., Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate.

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100. Das, Rabindra N.; Lauffer, John M.; Markovich, Vova R., Method of making circuitized substrate with a resistor.

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101. Kim, Jin Cheol; Kim, Min Soo; Oh, Jun Rok; Kim, Tae Kyoung, Method of manufacturing printed circuit board including embedded capacitors.

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102. Seh, Huankiat; Min, Yongki, Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor.

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103. Banerji, Sounak; Cox, G. Sidney; Dietz, Karl Hartmann, Methods for forming multilayer structures.

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104. Anthony A. Anthony, Multi-functional energy conditioner.

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105. Anthony, Anthony A.; Anthony, William M., Multi-functional energy conditioner.

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106. Anthony, Anthony; Anthony, William M., Multi-functional energy conditioner.

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107. Anthony,Anthony A.; Anthony,William M., Multi-functional energy conditioner.

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108. Das, Rabindra N.; Lauffer, John M.; Memis, Irving; Rosser, Steven G., Multi-layer embedded capacitance and resistance substrate core.

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109. Das, Rabindra N.; Lauffer, John M.; Memis, Irving; Rosser, Steven G., Multi-layer embedded capacitance and resistance substrate core.

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110. Robert M. Japp ; John M. Lauffer ; Konstantinos I. Papathomas, Multilayer capacitance structure and circuit board containing the same.

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111. Robert M. Japp ; John M. Lauffer ; Konstantinos I. Papathomas, Multilayer capacitance structure and circuit board containing the same and method of forming the same.

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112. Hsu, Chien-Min; Lee, Min-Lin; Lai, Shinn-Juh, Multilayer capacitors and methods for making the same.

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113. Shimada, Yasushi; Hirata, Yoshitaka; Kuriya, Hiroyuki; Otsuka, Kazuhisa; Yamaguchi, Masanori; Shimayama, Yuichi; Madarame, Ken; Mizushima, Etsuo; Kondou, Yuusuke; Yamamoto, Kazunori, Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device.

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114. Shimada,Yasushi; Hirata,Yoshitaka; Kuriya,Hiroyuki; Otsuka,Kazuhisa; Yamaguchi,Masanori; Shimayama,Yuichi; Madarame,Ken; Mizushima,Etsuo; Kondou,Yuusuke; Yamamoto,Kazunori, Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device.

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115. Kusagaya, Toshihiro; Yoneda, Yasuhiro; Mizutani, Daisuke; Iijima, Kazuhiko; Suwa, Yuji, Multilayer wiring circuit board.

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116. Kusagaya,Toshihiro; Yoneda,Yasuhiro; Mizutani,Daisuke; Iijima,Kazuhiko; Suwa,Yuji, Multilayer wiring circuit board.

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117. Frosch, Ronald; Riedler, Manfred, Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board.

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118. Hunt Andrew T. ; Lin Wen-Yi ; Carpenter Richard W., Nanolaminated thin film circuitry materials.

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119. Hunt, Andrew T.; Lin, Wen-Yi; Carpenter, Richard W., Nanolaminated thin film circuitry materials.

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120. Anthony, Jr., Anthony A.; Anthony, William M., Offset pathway arrangements for energy conditioning.

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121. Anthony, Anthony A.; Anthony, William M.; Muccioli, James P., PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALA.

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122. Anthony,Anthony A.; Anthony,William M.; Muccioli,James P., PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALA.

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123. Swaminathan,Madhavan; Engin,Ege; Wan,Lixi; Muthana,Prathap, Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof.

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124. Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode fi.

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125. Anthony A. Anthony, Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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126. Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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127. Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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128. Anthony Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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129. Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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130. Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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131. Anthony,Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.

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132. O'Bryan Nelson B. ; Kieschke Robert R. ; Peiffer Joel S., Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article.

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133. O'Bryan, Nelson B.; Kieschke, Robert R.; Peiffer, Joel S., Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article.

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134. Anthony, William M.; Anthony, Anthony A., Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways.

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135. Anthony, Jr.,Anthony A.; Anthony,William M., Pathway arrangement.

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136. Ko, Min Ji; Park, Eun Tae, Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein.

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137. Amey, Jr., Daniel Irwin; Banerji, Sounak; Borland, William J.; Dietz, Karl Hartmann; McGregor, David Ross; Sreeram, Attiganal N., Power core devices.

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138. McGregor, David Ross; Amey, Jr., Daniel Irwin; Banerji, Sounak; Borland, William J.; Dietz, Karl Hartmann; Sreeram, Attiganal N., Power core devices and methods of making thereof.

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139. Smith, Larry D.; Freda, Michael C.; Hassanzadeh, Ali, Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages.

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140. Smith, Larry D.; Novak, Istvan; Freda, Michael C., Power distribution system with a dedicated power structure and a high performance voltage regulator.

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141. Smith,Larry D.; Novak,Istvan; Freda,Michael C., Power distribution system with a dedicated power structure and a high performance voltage regulator.

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142. Moresco Larry Louis ; Wheeler Richard L. ; Beilin Solomon I. ; Horine David A., Power supply distribution structure for integrated circuit chip modules.

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143. Steigerwald Todd W. ; Jones Leroy, Printed circuit board (PCB) including channeled capacitive plane structure.

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144. Appelt Bernd K. ; Lauffer John M., Printed circuit board capacitor structure and method.

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145. Appelt, Bernd K.; Lauffer, John M., Printed circuit board capacitor structure and method.

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146. Istvan Novak, Printed circuit board employing lossy power distribution network to reduce power plane resonances.

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147. Novak, Istvan, Printed circuit board employing lossy power distribution network to reduce power plane resonances.

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148. Kerndlmaier Walter (Riemerlink DEX), Printed circuit board for connectors.

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149. Kim,Tae Kyoung; Oh,Jun Rok; Kim,Jin Cheol, Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same.

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150. Kim, Young Woo; Min, Byoung Youl; Ryu, Chang Myung; Chae, Woo Lim; Kim, Han, Printed circuit board including embedded capacitor and method of fabricating same.

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151. Kim,Young Woo; Min,Byoung Youl; Ryu,Chang Myung; Chae,Woo Lim; Kim,Han, Printed circuit board including embedded capacitor and method of fabricating same.

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152. Ahn,Jin Yong; Ryu,Chang Sup; Cho,Suk Hyeon; Lee,Seok Kyu; Hong,Jong Kuk; Jun,Ho Sik, Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same.

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153. Kim,Jin Cheol; Kim,Min Soo; Oh,Jun Rok; Kim,Tae Kyoung, Printed circuit board including embedded capacitors and method of manufacturing the same.

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154. Ryu,Chang Sup; Lee,Doo Hwan; Ahn,Jin Yong; Kang,Myung Sam; Cho,Suk Hyeon, Printed circuit board including embedded chips and method of fabricating the same.

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155. Lee,Seok Kyu; Min,Byoung Youl; Jin,Hyun Ju; Kang,Jang Kyu, Printed circuit board with embedded capacitors and manufacturing method thereof.

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156. Ahn, Jin Yong; Hwang, Cheol Seong; Kim, Sung Kun; Ryu, Chang Sup; Cho, Suk Hyeon; Jeon, Ho Sik, Printed circuit board with embedded capacitors therein and manufacturing process thereof.

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157. Ahn,Jin Yong; Hwang,Cheol Seong; Kim,Sung Kun; Ryu,Chang Sup; Cho,Suk Hyeon; Jeon,Ho Sik, Printed circuit board with embedded capacitors therein and manufacturing process thereof.

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158. Lee, Seok Kyu; Min, Byoung Youl; Nam, Chang Hyun; Jin, Hyun Ju; Kang, Jang Kyu, Printed circuit board with embedded capacitors therein, and process for manufacturing the same.

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159. Lee, Seok-Kyu; Kang, Jang-Kyu; Jin, Hyun-Ju; Min, Byoung-Youl, Printed circuit board with embedded capacitors therein, and process for manufacturing the same.

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160. Lee,Seok Kyu; Kang,Jang Kyu; Jin,Hyun Ju; Min,Byoung Youl, Printed circuit board with embedded capacitors therein, and process for manufacturing the same.

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161. Lauffer John M. ; Papathomas Konstantinos, Printed circut board with embedded decoupling capacitance and method for producing same.

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162. Mano, Yasuhiko; Yamashita, Atsunari; Tsuchiya, Yoshitake; Kariya, Takashi, Printed wiring board with capacitor.

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163. Das,Rabindra N.; Lauffer,John M.; Markovich,Voya R., Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing s.

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164. You, SE-Ho; Lee, Jinho, Semiconductor package.

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165. Anthony,David; Anthony,Anthony; Anthony,William, Shielded energy conditioner.

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166. Yu, Wan-Ling, Structure of embedded capacitor.

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167. Jow,Uei Ming; Shyu,Chin Sun, Structure of multi-electrode capacitor and method for manufacturing process of the same.

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168. Das, Rabindra N.; Egitto, Frank D.; Lauffer, John M.; Lin, How T., Substrate having internal capacitor and method of making same.

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