$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
출원번호 US-0563054 (1990-08-06)
발명자 / 주소
  • Schultz Laurence D. (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 292  인용 특허 : 0

초록 ▼

A method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer or the like. The apparatus includes a polishing head for rotating the wafer under a controlled pressure against a rotating polishing platen. The polishing head is mounted such that the wafer can be mo

대표청구항 ▼

A process for polishing a thin flat generally circular shaped semiconductor wafer having an oxide coating and for detecting the thickness of the oxide coating, comprising: a. holding the semiconductor wafer in a rotatable polishing head; b. rotating the semiconductor wafer over a rotating polishing

이 특허를 인용한 특허 (292)

  1. Lugg, Paul S., Abrasive article for the deposition and polishing of a conductive material.
    상세보기
  2. Manoocher Birang ; Boguslaw Swedek, Adaptive endpoint detection for chemical mechanical polishing.
    상세보기
  3. Taylor,Theodore M., Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization.
    상세보기
  4. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  5. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  6. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  7. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  8. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  9. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  10. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
    상세보기
  11. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
    상세보기
  12. Chandrasekaran,Nagasubramaniyan, Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces.
    상세보기
  13. Wright David Q., Apparatus and method for polishing a semiconductor wafer in an overhanging position.
    상세보기
  14. Wright David Q., Apparatus and method for polishing a semiconductor wafer in an overhanging position.
    상세보기
  15. Blalock,Guy T., Apparatus and method for removing material from microfeature workpieces.
    상세보기
  16. Homayoun Talieh, Apparatus and method of polishing with slurry delivery through a polishing pad.
    상세보기
  17. Nikoonahad, Mehrdad; Sethuraman, Anantha R.; Zhao, Guoheng, Apparatus and methods for detecting killer particles during chemical mechanical polishing.
    상세보기
  18. Nikoonahad, Mehrdad; Lee, Shing M.; Kele, Kalman; Zhao, Guoheng; Lehman, Kurt R., Apparatus and methods for performing self-clearing optical measurements.
    상세보기
  19. Holzapfel Paul ; Yednak ; III Andrew ; Natalicio John ; Goudie Chad, Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing.
    상세보기
  20. Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  21. Agarwal, Vishnu K., Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  22. Dvir Eran,ILX ; Haimovich Eli,ILX ; Shulman Benjamin,ILX, Apparatus for optical inspection of wafers during polishing.
    상세보기
  23. Eran Dvir IL; Moshe Finarov IL; Eli Haimovich IL; Beniamin Shulman IL, Apparatus for optical inspection of wafers during polishing.
    상세보기
  24. Finarov Moshe,ILX, Apparatus for optical inspection of wafers during polishing.
    상세보기
  25. Finarov, Moshe, Apparatus for optical inspection of wafers during polishing.
    상세보기
  26. Finarov,Moshe, Apparatus for optical inspection of wafers during processing.
    상세보기
  27. Taylor, Theodore M., Apparatus for planarizing microelectronic workpieces.
    상세보기
  28. Kimura,Norio; Ishii,Yu; Hiyama,Hirokuni; Okumura,Katsuya; Yano,Hiroyuki, Apparatus for polishing a substrate.
    상세보기
  29. Cote William J. (Poughquag NY) Ryan James G. (Newtown CT) Okumura Katsuya (Poughkeepsie NY) Yano Hiroyuki (Wappingers Falls NY), Apparatus for processing semiconductor wafers.
    상세보기
  30. Wright David Q. ; Walker Mike ; Robinson Karl M., Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers.
    상세보기
  31. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
    상세보기
  32. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
    상세보기
  33. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
    상세보기
  34. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  35. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.
    상세보기
  36. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.
    상세보기
  37. Agarwal,Vishnu K., Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  38. Greene George W. (Burlington MA) Albrecht Peter D. (Spartanburg SC) Strittmatter Kenneth D. (Mauldin SC) Hidalgo Rafael (Greenville SC), Automated wafer lapping system.
    상세보기
  39. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Block for polishing a wafer during manufacture of integrated circuits.
    상세보기
  40. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
    상세보기
  41. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
    상세보기
  42. Chandrasekaran, Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
    상세보기
  43. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
    상세보기
  44. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
    상세보기
  45. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.
    상세보기
  46. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.
    상세보기
  47. Shendon, Norm, Carrier head for a chemical mechanical polishing apparatus.
    상세보기
  48. Talieh Homayoun, Chemical mechanical polishing apparatus using multiple polishing pads.
    상세보기
  49. Talieh Homayoun (San Jose CA), Chemical mechanical polishing apparatus with improved slurry distribution.
    상세보기
  50. Bennett,Doyle E; David,Jeffrey Drue; Birang,Manoocher; Zhang,Jimin; Swedek,Boguslaw A, Chemical mechanical polishing control system and method.
    상세보기
  51. Li Leping (Poughkeepsie NY) Barbee Steven George (Dover Plains NY) Halperin Arnold (Cortlandt Manor NY), Chemical mechanical polishing endpoint process control.
    상세보기
  52. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.
    상세보기
  53. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.
    상세보기
  54. Talieh Homayoun, Chemical mechanical polishing with a small polishing pad.
    상세보기
  55. Talieh Homayoun, Chemical mechanical polishing with a small polishing pad.
    상세보기
  56. David,Jeffrey Drue; Roover,Dirk De; Zhang,Jimin; Swedek,Boguslaw A.; Bennett,Doyle E.; Birang,Manoocher, Chemical mechanical polishing with multi-stage monitoring of metal clearing.
    상세보기
  57. William H. Ma ; Adam D. Ticknor, Chemical-mechanical polishing pad conditioner.
    상세보기
  58. Lebel Richard J. ; Maurer Frederic ; Nadeau Rock ; Smith ; Jr. Paul H. ; Wickramasinghe Hemantha K. ; van Kessel Theodore G., Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement.
    상세보기
  59. Zuniga, Steven; Birang, Manoocher, Closed-loop control of wafer polishing in a chemical mechanical polishing system.
    상세보기
  60. Zuniga,Steven; Birang,Manoocher, Closed-loop control of wafer polishing in a chemical mechanical polishing system.
    상세보기
  61. Johansson, Nils; Swedek, Boguslaw A.; Birang, Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.
    상세보기
  62. Johansson,Nils; Swedek,Boguslaw A.; Birang,Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.
    상세보기
  63. Swedek, Boguslaw A.; Adams, Bret W.; Rajaram, Sanjay; Chan, David A.; Birang, Manoocher, Computer-implemented method for process control in chemical mechanical polishing.
    상세보기
  64. Swedek, Boguslaw A.; Adams, Bret W.; Rajaram, Sanjay; Chan, David A.; Birang, Manoocher, Computer-implemented process control in chemical mechanical polishing.
    상세보기
  65. Shanmugasundram, Arulkumar; Parikh, Suketu A., Copper wiring module control.
    상세보기
  66. David,Jeffrey Drue; Johansson,Nils; Birang,Manoocher; Swedek,Boguslaw A.; Carlsson,Ingemar, Determination of position of sensor measurements during polishing.
    상세보기
  67. Bradl Stephan,DEX ; Heitzsch Olaf,DEX, Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components.
    상세보기
  68. Hofmann Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  69. Hofmann, Jim, Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  70. Dalrymple,Alice Madrone; Horrell,Robert J., Devices and methods for optical endpoint detection during semiconductor wafer polishing.
    상세보기
  71. Jaso Mark A. ; Schnabel Rainer F., Dummy patterns for aluminum chemical polishing (CMP).
    상세보기
  72. Mark A. Jaso ; Rainer F. Schnabel, Dummy patterns for aluminum chemical polishing (CMP).
    상세보기
  73. Sarfaty,Moshe; Sreenivasan,Ramaswamy; Nulman,Jaim, Eddy-optic sensor for object inspection.
    상세보기
  74. Yi, Jingang; Xu, Cangshan, End point detection with imaging matching in semiconductor processing.
    상세보기
  75. Wolf,Stephan H., Endpoint detection system for wafer polishing.
    상세보기
  76. Wolf,Stephan H., Endpoint detection system for wafer polishing.
    상세보기
  77. Swedek Boguslaw ; Wiswesser Andreas Norbert,DEX, Endpoint detection with light beams of different wavelengths.
    상세보기
  78. Swedek, Boguslaw; Wiswesser, Andreas Norbert, Endpoint detection with light beams of different wavelengths.
    상세보기
  79. Wiswesser,Andreas Norbert; Schoenleber,Walter, Endpoint detection with multiple light beams.
    상세보기
  80. Doan Trung T., Endpoint detector and method for measuring a change in wafer thickness.
    상세보기
  81. Sandhu Gurtej Singh ; Doan Trung Tri, Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconducto.
    상세보기
  82. Doan Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.
    상세보기
  83. Doan, Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.
    상세보기
  84. Tsai Stan ; Redeker Fred C. ; Wijekoon Kapila, Endpoint monitoring with polishing rate change.
    상세보기
  85. Bennett,Doyle E.; Swedek,Boguslaw A.; Shanmugasundram,Arulkumar, Feedback controlled polishing processes.
    상세보기
  86. Bennett,Doyle E.; Swedek,Boguslaw A.; Shanmugasundram,Arulkumar, Feedback controlled polishing processes.
    상세보기
  87. Ushio Yoshijiro,JPX ; Koyama Motoo,JPX, Film inspection method.
    상세보기
  88. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  89. Chen, Haiguang; Lee, Shing, In-situ end point detection for semiconductor wafer polishing.
    상세보기
  90. Redeker Fred C. ; Birang Manoocher ; Li Shijian ; Somekh Sasson, In-situ monitoring of linear substrate polishing operations.
    상세보기
  91. Redeker, Fred C.; Birang, Manoocher; Li, Shijian; Somekh, Sasson, In-situ monitoring of linear substrate polishing operations.
    상세보기
  92. Cesna Joseph V., In-situ polishing pad flatness control.
    상세보기
  93. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  94. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  95. Tang Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical po.
    상세보기
  96. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  97. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  98. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  99. Swedek, Boguslaw A.; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  100. Swedek, Boguslaw A; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  101. Swedek,Boguslaw A.; Birang,Manoocher; Johansson,Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  102. Benvegnu,Dominic J., Iso-reflectance wavelengths.
    상세보기
  103. Redeker, Fred C.; Birang, Manoocher; Li, Shijian; Somekh, Sasson, Linear polishing sheet with window.
    상세보기
  104. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
    상세보기
  105. Sabde, Gundu M.; Hofmann, James J.; Joslyn, Michael J.; Lee, Whonchee, Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids.
    상세보기
  106. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
    상세보기
  107. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
    상세보기
  108. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  109. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  110. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  111. Manoocher Birang ; Boguslaw Swedek ; Nils Johansson, Method and apparatus for detecting polishing endpoint with optical monitoring.
    상세보기
  112. Wiswesser,Andreas Norbert; Schoenleber,Walter; Swedek,Boguslaw; Birang,Manoocher, Method and apparatus for determining polishing endpoint with multiple light sources.
    상세보기
  113. Wiswesser Andreas Norbert,DEX ; Schoenleber Walter,DEX ; Swedek Boguslaw ; Birang Manoocher, Method and apparatus for determining substrate layer thickness during chemical mechanical polishing.
    상세보기
  114. Parikh, Prabodh J., Method and apparatus for endpoint detection during chemical mechanical polishing.
    상세보기
  115. Robinson Karl M., Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  116. Sandhu Gurtej S., Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates.
    상세보기
  117. Sandhu,Gurtej S., Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates.
    상세보기
  118. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.
    상세보기
  119. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.
    상세보기
  120. Pecen Jiri ; Chadda Saket ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing.
    상세보기
  121. Pecen, Jiri; Chadda, Saket; Jairath, Rahul; Krusell, Wilbur C., Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing.
    상세보기
  122. Pecen Jiri ; Fielden John ; Chadda Saket ; LaComb ; Jr. Lloyd J. ; Jairath Rahul ; Krusell Wilbur C., Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing.
    상세보기
  123. Robinson Karl M., Method and apparatus for increasing chemical-mechanical-polishing selectivity.
    상세보기
  124. Robinson, Karl M., Method and apparatus for increasing chemical-mechanical-polishing selectivity.
    상세보기
  125. Robinson Karl M., Method and apparatus for increasing-chemical-polishing selectivity.
    상세보기
  126. Nyui Masaru,JPX ; Ban Mikichi,JPX, Method and apparatus for measuring film thickness and film thickness distribution during polishing.
    상세보기
  127. Andreas Norbert Wiswesser DE; Wallter Waiter Schoenleber DE; Boguslaw Swedek, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.
    상세보기
  128. Wiswesser Andreas Norbert,DEX ; Schoenleber Walter,DEX ; Swedek Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.
    상세보기
  129. Wiswesser, Andreas Norbert; Schoenleber, Walter; Swedek, Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.
    상세보기
  130. Wiswesser, Andreas Norbert; Schoenleber, Walter; Swedek, Boguslaw, Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing.
    상세보기
  131. Ishikawa, Akira; Ushio, Yoshijiro, Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device.
    상세보기
  132. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw ; Birang Manoocher, Method and apparatus for optical monitoring in chemical mechanical polishing.
    상세보기
  133. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Buguslaw; Birang, Manoocher, Method and apparatus for optical monitoring in chemical mechanical polishing.
    상세보기
  134. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
    상세보기
  135. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
    상세보기
  136. Kistler,Rodney C.; Carswell,Andrew, Method and apparatus for removing material from microfeature workpieces.
    상세보기
  137. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  138. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  139. Fisher ; Jr. Thomas R. ; Jaso Mark A. ; Stevens ; Jr. Leonard C., Method and apparatus of monitoring polishing pad wear during processing.
    상세보기
  140. Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.
    상세보기
  141. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.
    상세보기
  142. Holzapfel Paul ; Yednak ; III Andrew ; Natalicio John ; Goudie Chad, Method for cleaning workpiece surfaces and monitoring probes during workpiece processing.
    상세보기
  143. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  144. Strasbaugh, Alan, Method for making a polishing pad with built-in optical sensor.
    상세보기
  145. Ohkawa, Makoto, Method for manufacturing semiconductor device by polishing.
    상세보기
  146. Wiswesser,Andreas Norbert; Schoenleber,Walter; Swedek,Boguslaw, Method for monitoring a substrate during chemical mechanical polishing.
    상세보기
  147. Lenkersdorfer Paul, Method for obtaining a desired film thickness using chemical mechanical polishing.
    상세보기
  148. Taylor,Theodore M., Method for planarizing microelectronic workpieces.
    상세보기
  149. Kimura, Norio; Ishii, Yu; Hiyama, Hirokuni; Okumura, Katsuya; Yano, Hiroyuki, Method for polishing a substrate.
    상세보기
  150. Birang Manoocher ; Gleason Allan ; Guthrie William L., Method of forming a transparent window in a polishing pad.
    상세보기
  151. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
    상세보기
  152. Wiswesser, Andreas Norbert; Oshana, Ramiel; Hughes, Kerry F.; Rohde, Jay; Huo, David Datong; Benvegnu, Dominic J., Method of making and apparatus having polishing pad with window.
    상세보기
  153. Ueda,Masaaki; Kashima,Ryuichi, Method of manufacturing substrate for magnetic disk, apparatus for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk.
    상세보기
  154. Ohkawa, Makoto, Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate.
    상세보기
  155. Hudson, Guy F.; Walker, Michael A., Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate.
    상세보기
  156. Hudson, Guy F.; Walker, Michael A., Method of removing material from a semiconductor substrate.
    상세보기
  157. Dunton, Samuel V.; Nagahara, Ron; Galvez, Pepito C., Method of testing the processing of a semiconductor wafer on a CMP apparatus.
    상세보기
  158. Birang,Manoocher; Smekalin,Konstantin Y.; Chan,David A., Methods and apparatus for polishing control.
    상세보기
  159. Birang,Manoocher; Smekalin,Konstantin Y.; Chan,David A., Methods and apparatus for polishing control.
    상세보기
  160. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates.
    상세보기
  161. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  162. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  163. Blalock,Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
    상세보기
  164. Lu, Jin, Methods and apparatuses for removing polysilicon from semiconductor workpieces.
    상세보기
  165. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
    상세보기
  166. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
    상세보기
  167. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
    상세보기
  168. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
    상세보기
  169. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
    상세보기
  170. Elledge, Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  171. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  172. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  173. Moore,Carter; Folkes,Elon; Castor,Terry, Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  174. Taylor,Theodore M., Methods for planarizing microelectronic workpieces.
    상세보기
  175. Moore,Carter; Folkes,Elon; Castor,Terry, Methods for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  176. Southwick Scott A., Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization.
    상세보기
  177. Scott A. Southwick, Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization.
    상세보기
  178. Scott A. Southwick, Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization.
    상세보기
  179. Allen Robert F. ; Holzapfel Paul ; Bartels Anthony L. ; Lin Warren, Methods for the in-process detection of workpieces in a CMP environment.
    상세보기
  180. Elledge,Jason B., Methods of manufacturing carrier heads for polishing micro-device workpieces.
    상세보기
  181. Swedek,Boguslaw A.; Benvegnu,Dominic J., Metrology for chemical mechanical polishing.
    상세보기
  182. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
    상세보기
  183. Tolles, Robert D., Multilayer polishing pad and method of making.
    상세보기
  184. Adams, Bret W.; Swedek, Boguslaw A.; Bajaj, Rajeev; Nanjangud, Savitha; Wiswesser, Andreas Norbert; Tsai, Stan D.; Chan, David A.; Redeker, Fred C.; Birang, Manoocher, Optical monitoring in a two-step chemical mechanical polishing process.
    상세보기
  185. Adams, Bret W.; Swedek, Boguslaw A.; Bajaj, Rajeev; Nanjangud, Savitha; Wiswesser, Andreas Norbert; Tsai, Stan D.; Chan, David A.; Redeker, Fred C.; Birang, Manoocher, Optical monitoring in a two-step chemical mechanical polishing process.
    상세보기
  186. Herbert E. Litvak, Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  187. Herbert E. Litvak, Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  188. Litvak Herbert E., Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  189. Litvak Herbert E., Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  190. Litvak Herbert E., Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
    상세보기
  191. Martin, Michael H.; Crump, Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.
    상세보기
  192. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.
    상세보기
  193. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.
    상세보기
  194. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.
    상세보기
  195. Arai Hatsuyuki,JPX, Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device.
    상세보기
  196. Scott E. Moore, Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.
    상세보기
  197. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates.
    상세보기
  198. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.
    상세보기
  199. Joslyn, Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.
    상세보기
  200. Joslyn,Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.
    상세보기
  201. Wright, David Q., Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  202. Aaron T. Bartlett, Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  203. Taylor, Theodore M.; Chandrasekaran, Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.
    상세보기
  204. Taylor,Theodore M.; Chandrasekaran,Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.
    상세보기
  205. Chen,Feng; Leong,Lup San; Lin,Charles, Polishing apparatus and method for forming an integrated circuit.
    상세보기
  206. Feng Chen SG; Lup San Leong SG; Charles Lin SG, Polishing apparatus and method for forming an integrated circuit.
    상세보기
  207. Nyui Masaru,JPX ; Ban Mikichi,JPX ; Suzuki Takehiko,JPX ; Sugiyama Yasushi,JPX, Polishing apparatus and polishing method.
    상세보기
  208. Nyui, Masaru; Ban, Mikichi; Suzuki, Takehiko; Sugiyama, Yasushi, Polishing apparatus and polishing method.
    상세보기
  209. Hiyama Hirokuni,JPX ; Wada Yutaka,JPX, Polishing apparatus including thickness or flatness detector.
    상세보기
  210. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
    상세보기
  211. Elledge, Jason B., Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
    상세보기
  212. Kitajima,Tomohiko; Yasuhara,Gen, Polishing method and apparatus.
    상세보기
  213. Nyui, Masaru; Ban, Mikichi, Polishing method and polishing apparatus using the same.
    상세보기
  214. Kubo Akira,JPX, Polishing method of substrate and polishing device therefor.
    상세보기
  215. Newell, Kelly J., Polishing pad comprising a filled translucent region.
    상세보기
  216. Dunn,Freddie L., Polishing pad conditioners having abrasives and brush elements, and associated systems and methods.
    상세보기
  217. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
    상세보기
  218. Barbour, Greg, Polishing pad sensor assembly with a damping pad.
    상세보기
  219. Halley, David G.; Barbour, Gregory L.; Smedley, Ben; Wolf, Stephen H., Polishing pad with built-in optical sensor.
    상세보기
  220. Halley,David G.; Barbour,Gregory L.; Smedley,Ben; Wolf,Stephen H., Polishing pad with built-in optical sensor.
    상세보기
  221. Halley,David G.; Barbour,Gregory L.; Smedley,Ben; Wolf,Stephen H., Polishing pad with built-in optical sensor.
    상세보기
  222. Stephan H. Wolf, Polishing pad with built-in optical sensor.
    상세보기
  223. Barbour, Greg, Polishing pad with optical sensor.
    상세보기
  224. Wiswesser, Andreas Norbert; Swedek, Boguslaw A., Polishing pad with transparent window.
    상세보기
  225. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  226. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  227. Tolles,Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  228. Wiswesser,Andreas Norbert, Polishing pad with window.
    상세보기
  229. Wiswesser,Andreas Norbert, Polishing pad with window.
    상세보기
  230. Wiswesser,Andreas Norbert; Oshana,Ramiel; Hughes,Kerry F.; Rohde,Jay; Huo,David Datong; Benvegnu,Dominic J., Polishing pad with window.
    상세보기
  231. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
    상세보기
  232. Hudson Guy F. ; Walker Michael A., Polishing polymer surfaces on non-porous CMP pads.
    상세보기
  233. Swedek, Boguslaw A.; Adams, Bret W.; Rajaram, Sanjay; Chan, David A.; Birang, Manoocher, Polishing system with in-line and in-situ metrology.
    상세보기
  234. Swedek,Boguslaw A.; Adams,Bret W.; Rajaram,Sanjay; Chan,David A.; Birang,Manoocher, Polishing system with in-line and in-situ metrology.
    상세보기
  235. Swedek,Boguslaw A.; Adams,Bret W.; Rajaram,Sanjay; Chan,David A.; Birang,Manoocher, Polishing system with in-line and in-situ metrology.
    상세보기
  236. Daniel L. Fran.cedilla.a ; Raymond Khoury ; Jose M. Ocasio ; Uldis A. Ziemins, Real-time method for profiling and conditioning chemical-mechanical polishing pads.
    상세보기
  237. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.
    상세보기
  238. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.
    상세보기
  239. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
    상세보기
  240. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
    상세보기
  241. Taylor,Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
    상세보기
  242. Yu Chen-Hua,TWX ; Jang Syun-Ming,TWX, Robust end-point detection for contact and via etching.
    상세보기
  243. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., Sealed polishing pad methods.
    상세보기
  244. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., Sealed polishing pad, system and methods.
    상세보기
  245. Masako Kodera JP; Takashi Yoda JP; Motosuke Miyoshi JP, Semiconductor polishing apparatus and method for chemical/mechanical polishing of films.
    상세보기
  246. Pant Anil K. ; Breivogel Joseph R. ; Young Douglas W. ; Jairath Rahul ; Engdahl Erik H., Sensors for a linear polisher.
    상세보기
  247. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods.
    상세보기
  248. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.
    상세보기
  249. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.
    상세보기
  250. Birang,Manoocher; David,Jeffrey Drue; Swedek,Boguslaw A., Substrate edge detection.
    상세보기
  251. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  252. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  253. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  254. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  255. Wiswesser,Andreas Norbert; Birang,Manoocher; Swedek,Boguslaw A., Substrate monitoring during chemical mechanical polishing.
    상세보기
  256. Talieh Homayoun, Substrate polishing apparatus.
    상세보기
  257. Talieh Homayoun, Substrate polishing apparatus.
    상세보기
  258. Talieh, Homayoun, Substrate polishing apparatus.
    상세보기
  259. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  260. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  261. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  262. Lebel, Richard J.; Maurer, Frederic; Nadeau, Rock; Smith, Jr., Paul H.; Wickramasinghe, Hemantha K.; van Kessel, Theodore G., Support and alignment device for enabling chemical mechanical polishing rinse and film measurements.
    상세보기
  263. Swedek,Boguslaw A; Johansson,Nils; Wiswesser,Andreas Norbert; Birang,Manoocher, System and method for in-line metal profile measurement.
    상세보기
  264. Bharath Rangarajan ; Bhanwar Singh ; Ursula Q. Quinto, System and method for mitigating wafer surface disformation during chemical mechanical polishing (CMP).
    상세보기
  265. Klein, Rita J., System for planarizing microelectronic substrates having apertures.
    상세보기
  266. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
    상세보기
  267. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
    상세보기
  268. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
    상세보기
  269. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
    상세보기
  270. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
    상세보기
  271. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
    상세보기
  272. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
    상세보기
  273. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
    상세보기
  274. Sandhu, Gurtej S.; Doan, Trung Tri, System for real-time control of semiconductor wafer polishing.
    상세보기
  275. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including heater.
    상세보기
  276. Sandhu Gurtej S. (Boise ID) Doan Trung Tri (Boise ID), System for real-time control of semiconductor wafer polishing including optical monitoring.
    상세보기
  277. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including optical montoring.
    상세보기
  278. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., System with sealed polishing pad.
    상세보기
  279. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
    상세보기
  280. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
    상세보기
  281. Elledge, Jason B.; Chandrasekaran, Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
    상세보기
  282. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
    상세보기
  283. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
    상세보기
  284. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
    상세보기
  285. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
    상세보기
  286. Bastian, Joseph A.; Reukauf, Jeremey T., Systems and methods for removing microfeature workpiece surface defects.
    상세보기
  287. Bastian,Joseph A.; Reukauf,Jeremey T., Systems and methods for removing microfeature workpiece surface defects.
    상세보기
  288. Moore,Carter; Folkes,Elon; Castor,Terry, Systems for planarizing workpieces, e.g., microelectronic workpieces.
    상세보기
  289. Palou-Rivera, Ignasi; Swedek, Boguslaw A.; Karuppiah, Lakshmanan, Wafer edge characterization by successive radius measurements.
    상세보기
  290. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.
    상세보기
  291. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.
    상세보기
  292. Cesna Joseph V., Wafer polishing with improved end point detection.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로