$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for spatially uniform electropolishing and electrolytic etching 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25F-003/02
  • C25F-003/16
  • C25F-007/00
출원번호 US-0597225 (1990-10-15)
발명자 / 주소
  • Mayer Steven T. (Piedmont CA) Contolini Robert J. (Pleasanton CA) Bernhardt Anthony F. (Berkeley CA)
출원인 / 주소
  • The United States of America as represented by the United States Department of Energy (Washington DC 06)
인용정보 피인용 횟수 : 196  인용 특허 : 0

초록 ▼

In an electropolishing or electrolytic etching apparatus the anode is separated from the cathode to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier. The anode extends into the top of the barrier

대표청구항 ▼

A method for electropolishing and electrolytically etching a workpiece, comprising: electrically connecting the workpiece to a substantially flat anode of a voltage source; placing the anode and a cathode in an electrolytic solution; rotating the anode; flowing a current of sufficient density throug

이 특허를 인용한 특허 (196)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
    상세보기
  2. Sun,Lizhong; Tsai,Stan; Redeker,Fritz, Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus.
    상세보기
  3. Manens, Antoine P.; Duboust, Alain; Neo, Siew S.; Chen, Liang Yuh, Algorithm for real-time process control of electro-polishing.
    상세보기
  4. Manens,Antoine P.; Duboust,Alain; Neo,Siew S.; Chen,Liang Yuh, Algorithm for real-time process control of electro-polishing.
    상세보기
  5. He, Zhian, Anisotropic high resistance ionic current source (AHRICS).
    상세보기
  6. Reid, Jonathan D.; Archer, Timothy Mark; Vu, Thomas Tan; Varadarajan, Seshasayee; Henri, Jon; Mayer, Steven T.; Sauer, David; Kang, Anita; Feldewerth, Gerald, Anode and anode chamber for copper electroplating.
    상세보기
  7. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
    상세보기
  8. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
    상세보기
  9. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Chua, Lee Peng; Berke, Aaron; Rash, Robert; Mayer, Steven T., Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity.
    상세보기
  10. Ritzdorf,Thomas L.; Eudy,Steve L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and method for processing a microelectronic workpiece using metrology.
    상세보기
  11. Peace, Steven L., Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids.
    상세보기
  12. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  13. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  14. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
    상세보기
  15. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
    상세보기
  16. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
    상세보기
  17. Akram, Salman; Hembree, David R., Apparatus for continuous processing of semiconductor wafers.
    상세보기
  18. Enda Masami,JPX ; Sakurai Jiro,JPX ; Sakai Hitoshi,JPX ; Sasaki Osamu,JPX, Apparatus for electrochemical decontamination of radioactive metallic waste.
    상세보기
  19. Patton, Evan E.; Fetters, Wayne, Apparatus for electroplating copper onto semiconductor wafer.
    상세보기
  20. Mayer, Steven T.; Reid, Jonathan; Contolini, Robert, Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers.
    상세보기
  21. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  22. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
    상세보기
  23. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  24. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  25. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
    상세보기
  26. Evan E. Patton ; Wayne Fetters, Clamshell apparatus for electrochemically treating semiconductor wafers.
    상세보기
  27. Patton Evan E. ; Fetters Wayne, Clamshell apparatus for electrochemically treating semiconductor wafers.
    상세보기
  28. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
    상세보기
  29. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
    상세보기
  30. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
    상세보기
  31. Butterfield, Paul D.; Chen, Liang-Yuh; Hu, Yonqi; Manens, Antoine P.; Mavliev, Rashid; Tsai, Stan D.; Liu, Feng Q.; Wadensweiler, Ralph; Sun, Lizhong; Neo, Siew S.; Duboust, Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  32. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  33. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  34. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  35. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  36. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  37. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  38. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  39. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  40. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  41. Liu, Feng Q.; Mavliev, Rashid, Contact assembly and method for electrochemical mechanical processing.
    상세보기
  42. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan, Contacts for electrochemical processing.
    상세보기
  43. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
    상세보기
  44. Mavliev,Rashid; Tsai,Stan; Hu,Yongqi; Butterfield,Paul; Manens,Antoine; Chen,Liang Yuh, Contacts for electrochemical processing.
    상세보기
  45. He, Zhian; Zhou, Jian; Feng, Jingbin; Reid, Jonathan D.; Ghongadi, Shantinath, Control of electrolyte flow dynamics for uniform electroplating.
    상세보기
  46. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  47. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  48. Mayer, Steven T.; Porter, David W.; Goh, Edwin; Buckalew, Bryan L.; Rash, Robert, Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  49. Sun,Lizhong; Chen,Liang Yuh; Neo,Siew; Liu,Feng Q.; Duboust,Alain; Tsai,Stan D.; Mavliev,Rashid, Control of removal profile in electrochemically assisted CMP.
    상세보기
  50. Mayer, Steven T.; Patton, Evan E.; Jackson, Robert L.; Reid, Jonathan D., Copper electroplating method and apparatus.
    상세보기
  51. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T.; Zhu, Huanfeng, Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers.
    상세보기
  52. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T., Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers.
    상세보기
  53. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
    상세보기
  54. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
    상세보기
  55. Wu,Qunwei; Brodeur,Craig L.; Pillion,John E.; Shyu,Jieh Hwa, Device and method for increasing mass transport at liquid-solid diffusion boundary layer.
    상세보기
  56. Evan E. Patton ; Wayne Fetters, Dual channel rotary union.
    상세보기
  57. Graham, Gabriel Hay; Hiester, Jacob Lee; Chua, Lee Peng; Buckalew, Bryan L., Dynamic modulation of cross flow manifold during electroplating.
    상세보기
  58. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh, Edge bead removal by an electro polishing process.
    상세보기
  59. Graham, Gabriel Hay; Buckalew, Bryan L.; Mayer, Steven T.; Rash, Robert; Fortner, James Isaac; Chua, Lee Peng, Edge flow element for electroplating apparatus.
    상세보기
  60. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping apparatus for holding a semiconductor wafer during electroplating.
    상세보기
  61. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping method for electroplating.
    상세보기
  62. Walsh Dave ; Jones Derrick, Electrochemical machining.
    상세보기
  63. Duquette, David J.; Loparco, Lisa J., Electrochemical planarization of metal feature surfaces.
    상세보기
  64. Riewe,Curtis Heath, Electrochemical stripping using single loop control.
    상세보기
  65. Duboust, Alain; Sun, Lizhong; Liu, Feng Q.; Wang, Yuchun; Wang, Yan; Neo, Siew; Chen, Liang-Yuh, Electrolyte composition and treatment for electrolytic chemical mechanical polishing.
    상세보기
  66. Sun, Lizhong; Liu, Feng Q.; Neo, Siew; Tsai, Stan; Chen, Liang-Yuh, Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP.
    상세보기
  67. Sun,Lizhong; Liu,Feng Q.; Neo,Siew; Tsai,Stan; Chen,Liang Yuh, Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP.
    상세보기
  68. Mayer Steven T. ; Contolini Robert J., Electroplanarization of large and small damascene features using diffusion barriers and electropolishing.
    상세보기
  69. Dinneen, Daniel Mark; Duncan, James E., Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems.
    상세보기
  70. Reid Jonathan David ; Contolini Robert J. ; Dukovic John Owen, Electroplating anode including membrane partition system and method of preventing passivation of same.
    상세보기
  71. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
    상세보기
  72. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
    상세보기
  73. Feng, Jingbin; He, Zhian; Rash, Robert; Mayer, Steven T., Electroplating apparatus with vented electrolyte manifold.
    상세보기
  74. Broadbent Eliot K., Electroplating system with shields for varying thickness profile of deposited layer.
    상세보기
  75. Yahalom, Joseph; Padhi, Deenesh; Gandikota, Srinivas; Dixit, Girish A., Electropolishing of metallic interconnects.
    상세보기
  76. Manens, Antoine P.; Galburt, Vladimir; Wang, Yan; Duboust, Alain; Olgado, Donald J. K.; Chen, Liang-Yuh, Electroprocessing profile control.
    상세보기
  77. Manens, Antoine P.; Galburt, Vladimir; Wang, Yan; Duboust, Alain; Olgado, Donald J. K.; Chen, Liang-Yuh, Electroprocessing profile control.
    상세보기
  78. Duboust, Alain; Wang, Yan; Neo, Siew; Chen, Liang-Yuh, Endpoint detection for electro chemical mechanical polishing and electropolishing processes.
    상세보기
  79. Wang, Yan; Manens, Antoine P.; Neo, Siew S.; Duboust, Alain; Chen, Liang-Yuh, Endpoint for electroprocessing.
    상세보기
  80. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  81. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  82. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  83. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  84. Mayer, Steven T.; Reid, Jonathan D., High resistance ionic current source.
    상세보기
  85. Wang,Yan; Liu,Feng Q.; Duboust,Alain; Neo,Siew S.; Chen,Liang Yuh; Hu,Yongqi, Hydrogen bubble reduction on the cathode using double-cell designs.
    상세보기
  86. Whitlow Maridana L. ; McGlothlan J. Kirk ; Anderson Jeffrey J. ; Karambelas Randy C. ; Schmachtenberg ; III Richard, Ink jet print heads.
    상세보기
  87. Hsu,Wei Yung; Chen,Liang Yuh; Morad,Ratson; Carl,Daniel A.; Somekh,Sasson, Integrated multi-step gap fill and all feature planarization for conductive materials.
    상세보기
  88. Hillabrand, David; Knapp, Theodore, Manufacturing apparatus for depositing a material and an electrode for use therein.
    상세보기
  89. Hillabrand, David; Knapp, Theodore, Manufacturing apparatus for depositing a material and an electrode for use therein.
    상세보기
  90. Kim, Doyeon; Ghongadi, Shantinath; Takada, Yuichi; Huang, Ludan; Majid, Tariq, Membrane design for reducing defects in electroplating systems.
    상세보기
  91. Reid, Jonathan David; Contolini, Robert J.; Dukovic, John Owen, Membrane partition system for plating of wafers.
    상세보기
  92. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  93. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  94. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.
    상세보기
  95. Hsu, Wei-Yung; Chen, Liang-Yuh; Morad, Ratson; Carl, Daniel A.; Somekh, Sasson, Method and apparatus for electro-chemical processing.
    상세보기
  96. Wang, Yan; Neo, Siew; Liu, Feng; Tsai, Stan D.; Hu, Yongqi; Duboust, Alain; Manens, Antoine; Wadensweiler, Ralph M.; Mavliev, Rashid; Chen, Liang-Yuh; Olgado, Donald J. K.; Butterfield, Paul D.; Tseng, Ming-Kuei; Chang, Shou-Sung; Sun, Lizhong, Method and apparatus for electrochemical mechanical processing.
    상세보기
  97. Lizhong Sun ; Stan D. Tsai ; Fred C. Redeker, Method and apparatus for electrochemical-mechanical planarization.
    상세보기
  98. Sun, Lizhong; Tsai, Stan D.; Redeker, Fred C., Method and apparatus for electrochemical-mechanical planarization.
    상세보기
  99. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
    상세보기
  100. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
    상세보기
  101. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
    상세보기
  102. Reid, Jonathan; Buckalew, Bryan; He, Zhian; Park, Seyang; Varadarajan, Seshasayee; Pennington, Bryan; Ponnuswamy, Thomas; Breling, Patrick; Ibarreta, Glenn; Mayer, Steven, Method and apparatus for electroplating.
    상세보기
  103. Wang,You; Diao,Jie; Tsai,Stan D.; Karuppiah,Lakshmanan, Method and apparatus for electroprocessing a substrate with edge profile control.
    상세보기
  104. Wang,Hui, Method and apparatus for end-point detection.
    상세보기
  105. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.
    상세보기
  106. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.
    상세보기
  107. Tsai, Stan; Liu, Feng Q.; Wang, Yan; Mavliev, Rashid; Chen, Liang-Yuh; Duboust, Alain, Method and apparatus for local polishing control.
    상세보기
  108. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly.
    상세보기
  109. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly.
    상세보기
  110. Mayer,Steven T.; Reid,Jonathan; Contolini,Robert, Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers.
    상세보기
  111. Redeker, Fred C.; Boyd, John; Dordi, Yezdi; Thie, William; Maraschin, Bob, Method and apparatus for semiconductor wafer planarization.
    상세보기
  112. Redeker,Fred C.; Boyd,John; Dordi,Yezdi; Thie,William; Maraschin,Bob, Method and apparatus for semiconductor wafer planarization.
    상세보기
  113. Wadensweiler, Ralph; Duboust, Alain; Chen, Liang-Yuh; Birang, Manoocher; Morad, Ratson; Butterfield, Paul D., Method and apparatus for substrate polishing.
    상세보기
  114. Wadensweiler, Ralph; Duboust, Alain; Chen, Liang-Yuh; Birang, Manoocher; Morad, Ratson; Butterfield, Paul D., Method and apparatus for substrate polishing.
    상세보기
  115. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
    상세보기
  116. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
    상세보기
  117. Mayer, Steven T.; Contolini, Robert J.; Broadbent, Eliot K.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation.
    상세보기
  118. Liu,Feng Q.; Du,Tianbao; Duboust,Alain; Hsu,Wei Yung, Method and composition for electrochemical mechanical polishing processing.
    상세보기
  119. Jia,Renhe; Liu,Feng Q.; Tsai,Stan D.; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  120. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Duboust,Alain; Neo,Siew S.; Hu,Yongqi; Wang,Yan; Butterfield,Paul D., Method and composition for polishing a substrate.
    상세보기
  121. Liu,Feng Q.; Du,Tianbao; Duboust,Alain; Wang,Yan; Hu,Yongqi; Tsai,Stan D.; Chen,Liang Yuh; Tu,Wen Chiang; Hsu,Wei Yung, Method and composition for polishing a substrate.
    상세보기
  122. Liu,Feng Q.; Tsai,Stan D.; Hu,Yongqi; Neo,Siew S.; Wang,Yan; Duboust,Alain; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  123. Liu,Feng Q.; Tsai,Stan D.; Hu,Yongqi; Neo,Siew S.; Wang,Yan; Duboust,Alain; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  124. Golden, Josh H.; Porshnev, Peter I.; Myers, Donald, Method and system for point of use recycling of ECMP fluids.
    상세보기
  125. Akram, Salman; Hembree, David R., Method for continuous processing of semiconductor wafers.
    상세보기
  126. Reid, Jonathan David, Method for electrochemical planarization of metal surfaces.
    상세보기
  127. Hui Wang, Method for electropolishing metal on semiconductor devices.
    상세보기
  128. Andryushchenko, Tatyana N.; Miller, Anne E., Method for forming planarizing copper in a low-k dielectric.
    상세보기
  129. Brintzinger,Axel; Uhlendorf,Ingo, Method for forming three-dimensional structures on a substrate.
    상세보기
  130. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
    상세보기
  131. Mayer, Steven T.; Reid, Jonathan; Contolini, Robert, Method for potential controlled electroplating of fine patterns on semiconductor wafers.
    상세보기
  132. Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly.
    상세보기
  133. Patton Evan E. ; Fetters Wayne, Method of depositing metal layer.
    상세보기
  134. Mayer, Steven T.; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
    상세보기
  135. Mayer, Steven T; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
    상세보기
  136. Takahashi Hiroshi,JPX ; Tokunaga Kazuhiko,JPX ; Yoshigoe Shunichi,JPX, Method of etching back layer on substrate.
    상세보기
  137. Andryushchenko, Tatyana, Method of fabricating damascene structures in mechanically weak interlayer dielectrics.
    상세보기
  138. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  139. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  140. Wang, Hui, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.
    상세보기
  141. Hui Wang, Methods and apparatus for end-point detection.
    상세보기
  142. Ritzdorf,Thomas L.; Eudy,Steve L.; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Aegerter,Brian; Dundas,Curt; Peace,Steven L., Methods and apparatus for processing microelectronic workpieces using metrology.
    상세보기
  143. Dinneen, Daniel Mark; Mayer, Steven T., Methods and apparatuses for electroplating and seed layer detection.
    상세보기
  144. Dinneen, Daniel Mark; Mayer, Steven T., Methods and apparatuses for electroplating and seed layer detection.
    상세보기
  145. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.
    상세보기
  146. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical polishing.
    상세보기
  147. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
    상세보기
  148. Chang,Shou Sung; Tsai,Stan D; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
    상세보기
  149. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
    상세보기
  150. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
    상세보기
  151. Mayer, Steven T.; Drewery, John Stephen; Webb, Eric G., Photoresist-free metal deposition.
    상세보기
  152. Lorincz, Thomas A., Pipe electropolishing apparatus using an electrolyte heater and cooler.
    상세보기
  153. Chen, Liang-Yuh; Hsu, Wei-Yung; Duboust, Alain; Morad, Ratson; Carl, Daniel A., Planarization of substrates using electrochemical mechanical polishing.
    상세보기
  154. Akram,Salman; Hembree,David R., Plating.
    상세보기
  155. Basol, Bulent M., Plating method and apparatus for controlling deposition on predetermined portions of a workpiece.
    상세보기
  156. Basol, Bulent M., Plating method and apparatus for controlling deposition on predetermined portions of a workpiece.
    상세보기
  157. Mayer, Steven T.; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
    상세보기
  158. Mayer, Steven; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
    상세보기
  159. Basol, Bulent M., Plating methods for low aspect ratio cavities.
    상세보기
  160. Wang, Zhihong; Wang, You; Mao, Daxin; Jia, Renhe; Tsai, Stan D.; Hu, Yongqi; Tian, Yuan A.; Chen, Liang Yuh, Process and composition for conductive material removal by electrochemical mechanical polishing.
    상세보기
  161. Manens, Antoine P.; Chen, Liang-Yuh, Process control in electrochemically assisted planarization.
    상세보기
  162. Manens,Antoine P.; Chen,Liang Yuh, Process control in electrochemically assisted planarization.
    상세보기
  163. Manens,Antoine P.; Chen,Liang Yuh, Process control in electrochemically assisted planarization.
    상세보기
  164. Manens,Antoine P., Processing pad assembly with zone control.
    상세보기
  165. Hanson, Kyle M.; Eudy, Steve L.; Ritzdorf, Thomas L.; Wilson, Gregory J.; Woodruff, Daniel J.; Harris, Randy; Weber, Curtis A.; McGlenn, Tim; Anderson, Timothy A.; Bexten, Daniel P., Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces.
    상세보기
  166. Akram Salman ; Hembree David R., Rotating system and method for electrodepositing materials on semiconductor wafers.
    상세보기
  167. Akram Salman ; Hembree David R., Rotating system for electrochemical treatment of semiconductor wafers.
    상세보기
  168. Mayer, Steven T.; Drewery, John S., Rotationally asymmetric variable electrode correction.
    상세보기
  169. Mayer, Steven T.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  170. Mayer, Steven T.; Drewery, John; Hill, Richard S.; Archer, Timothy; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  171. Mayer, Steven T.; Stowell, Marshall R.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  172. Reardon,Timothy J.; Meuchel,Craig P.; Oberlitner,Thomas H.; Owczarz,Aleksander; Thompson,Raymon F., Semiconductor processing apparatus.
    상세보기
  173. Reardon,Timothy J.; Oberlitner,Thomas H.; Meuchel,Craig P.; Owczarz,Aleksander; Thompson,Raymon F., Semiconductor processing apparatus.
    상세보기
  174. Doan, Trung Tri; Meikle, Scott G., Semiconductor processing methods of removing conductive material.
    상세보기
  175. Doan, Trung Tri; Meikle, Scott G., Semiconductor processing methods of removing conductive material.
    상세보기
  176. Doan,Trung Tri; Meikle,Scott G., Semiconductor processing methods of removing conductive material.
    상세보기
  177. Doan,Trung Tri; Meikle,Scott G., Semiconductor processing methods of removing conductive material.
    상세보기
  178. Rumph Timothy P., Small parts plating apparatus.
    상세보기
  179. Nackashi, David P.; Damiano, Jr., John; Mick, Stephen E.; Schmelzer, Thomas G.; Zapata, III, Michael, Specimen holder used for mounting.
    상세보기
  180. Nackashi, David P.; Damiano, Jr., John; Mick, Stephen E.; Schmelzer, Thomas G.; Zapata, III, Michael, Specimen holder used for mounting samples in electron microscopes.
    상세보기
  181. Nackashi, David P.; Damiano, Jr., John; Mick, Stephen E.; Schmelzer, Thomas G.; Zapata, III, Michael, Specimen holder used for mounting samples in electron microscopes.
    상세보기
  182. Nackashi, David P.; Damiano, Jr., John; Mick, Stephen E.; Schmelzer, Thomas G.; Zapata, III, Michael, Specimen holder used for mounting samples in electron microscopes.
    상세보기
  183. Lubomirsky,Dmitry, Substrate support with fluid retention band.
    상세보기
  184. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
    상세보기
  185. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
    상세보기
  186. Hu,Zhongmin; Young,Eric J., Thiourea-and cyanide-free bath and process for electrolytic etching of gold.
    상세보기
  187. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  188. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  189. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
    상세보기
  190. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
    상세보기
  191. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
    상세보기
  192. Reid, Jonathan; Park, Seyang; Varadarajan, Seshasayee; Doubina, Natalia, Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers.
    상세보기
  193. Mayer, Steven T., Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction.
    상세보기
  194. Uzoh Cyprian Emeka, Wafer edge deplater for chemical mechanical polishing of substrates.
    상세보기
  195. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
    상세보기
  196. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로