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High performance interconnect system for an integrated circuit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
  • B44C-001/22
  • C03C-015/00
  • C23F-001/02
출원번호 US-0610962 (1990-11-08)
발명자 / 주소
  • Thomas Michael E. (Cupertino CA) Chinn Jeffrey D. (Foster City CA)
출원인 / 주소
  • Fairchild Camera and Instrument Corp. (Mountain View CA 02)
인용정보 피인용 횟수 : 124  인용 특허 : 0

초록 ▼

A semiconductor integrated circuit device includes a high performance interconnect structure which comprises a plurality of interconnects, with each interconnect being structurally separated from the remaining interconnects except at electrical contact points. In one embodiment, each interconnect is

대표청구항 ▼

A semiconductor integrated circuit device including an interconnect structure for electrically connecting regions in a semiconductor substrate having contact areas disposed in a predetermined spaced relation, said interconnect structure comprising: a first level of interconnects disposed above said

이 특허를 인용한 특허 (124)

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