이 특허를 인용한 특허 (74)

1. Korleski ; Jr. Joseph E., Adhesive-filler film composite.

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2. Heikkila, Kurt E.; Williams, Rodney K.; Kroll, John S., Ceramic composite.

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3. Crosley, Jessica, Circuit materials, circuits laminates, and method of manufacture thereof.

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4. Paul, Sankar K.; Caisse, Christopher J.; Baars, Dirk M.; Horn, III, Allen F., Circuit materials, circuits laminates, and method of manufacture thereof.

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5. Smith, James D. B.; Stevens, Gary; Wood, John W., Composite insulation tape with loaded HTC materials.

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6. Mohan, Krishna K.; Goliber, Cynthia A.; Hong, Yaoliang; Froass, Peter M.; Young, Herbert; Anderson, Dennis W.; Faber, Richard D., Compositions containing expandable microspheres and an ionic compound, as well as methods of making and using the same.

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7. Smith, James D; Stevens, Gary; Wood, John W; Lutz, Andreas, Compression of resin impregnated insulating tapes.

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8. Williams, Richard C.; Froass, Peter M.; Boone, David A.; Faber, Richard D., Cut resistant paper and paper articles and method for making same.

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9. James L. Lykins ; Jan I. Strandberg, Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates.

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10. Mao,Guoping; Qu,Shichun; Li,Fuming B.; Clough,Robert S.; O'Bryan,Nelson B., Dielectric composite material.

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11. Fischer Paul J. ; Korleski Joseph, Electronic chip package.

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12. Fischer, Paul J.; Korleski, Joseph E., Electronic chip package.

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13. Hong, Yaoliang; Mohan, Kosaraju Krishna; Dimonie, Victoria Laurentia; Fagan, Mark Edward; Klein, Andrew; Daniels, Eric Scott; Boyars, Brian; Froass, Peter M.; Anderson, Christopher D.; Sudol, Edward David, Expandable microspheres and methods of making and using the same.

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14. Hong, Yaoliang; Mohan, Kosaraju Krishna; Froass, Peter M.; Fagan, Mark; Anderson, Christopher D.; Boyars, Brian; Daniels, Eric Scott; Dimonie, Victoria Laurentia; Sudol, Edward David; Klein, Andrew, Expandable microspheres and methods of making and using the same.

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15. Smith, James D; Stevens, Gary; Wood, John W, Fabrics with high thermal conductivity coatings.

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16. Smith, James D; Stevens, Gary; Wood, John W, Fabrics with high thermal conductivity coatings.

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17. Kober Horst,DEX ; Spiess Karl-Heinz,DEX ; Kosack Steffen,DEX, Flat seal.

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18. Japp,Robert M.; Markovich,Voya R.; Papathomas,Kostas I., Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same.

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19. Moh Kyung H. (Woodbury MN), Glass and glass-ceramic bubbles having an aluminum nitride coating.

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20. Gaku, Morio; Kimbara, Hidenori; Ikeguchi, Nobuyuki; Motegi, Masakazu, Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity.

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21. Miller, Mark L., High thermal conductivity dielectric tape.

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22. Smith, James David Blackhall; Stevens, Gary; Wood, John William, High thermal conductivity materials aligned within resins.

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23. Smith, James David Blackhall, High thermal conductivity materials with grafted surface functional groups.

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24. Smith, James David Blackhall; Stevens, Gary; Wood, John William, High thermal conductivity materials with grafted surface functional groups.

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25. Smith, James D; Stevens, Gary; Wood, John W, Insulation paper with high thermal conductivity materials.

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26. Ohashi,Kazuhiko; Yokomizo,Osamu; Yoshida,Koji, Integrated circuit chip bonding sheet and integrated circuit package.

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27. Nagai Akira,JPX ; Ogata Masatsugu,JPX ; Eguchi Shuji,JPX ; Ogino Masahiko,JPX ; Ishii Toshiaki,JPX ; Segawa Masanori,JPX ; Kokaku Hiroyoshi,JPX ; Moteki Ryo,JPX ; Anjoh Ichiro,JPX, Laminate and multilayer printed circuit board.

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28. Blackshear, Edmund; Li, Shidong, Laminate substrates having radial cut metallic planes.

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29. Mohan, Kosaraju Krishna; Koukoulas, Alexander A; Froass, Peter Matthew; Reed, David Verd, Low density paperboard articles.

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30. Mohan, Kosaraju Krishna; Koukoulas, Alexander A; Froass, Peter Matthew; Reed, David Verd, Low density paperboard articles.

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31. Rosenmayer C. Thomas, Low dielectric constant material for use as an insulation element in an electronic device.

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32. Rosenmayer C. Thomas, Low dielectric constant material for use as an insulation element in an electronic device.

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33. Rosenmayer C. Thomas, Low dielectric constant material with improved dielectric strength.

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34. Heikkila, Kurt E.; Williams, Rodney K.; Kroll, John S., Magnetic composite.

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35. Heikkila, Kurt E.; Kroll, John S.; Williams, Rodney K., Magnetic polymer composite.

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36. Zhang, Dong, Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards.

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37. Yamamoto, Yoshihisa; Yoshimoto, Hiroyuki; Nakagawa, Hideto, Metal-clad laminate, method for producing same, and flexible printed board.

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38. Jiang Linda (Tong) ; Hymes Diane J., Method and apparatus for cleaning low K dielectric and metal wafer surfaces.

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39. Jiang Linda ; Hymes Diane J., Method and apparatus for cleaning low K dielectric and metal wafer surfaces.

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40. Rendek, Jr., Louis Joseph; Weatherspoon, Michael Raymond; Rodriguez, Casey Philip; Nicol, David, Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices.

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41. Rendek, Jr., Louis Joseph; Weatherspoon, Michael; Rodriguez, Casey Philip; Nicol, David, Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices.

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42. Kempf Ulrich W., Microsphere containing circuit board paper.

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43. Smith, James D. B.; Stevens, Gary; Wood, John W., Mix of grafted and non-grafted particles in a resin.

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44. Stevens, Gary; Smith, James D. B.; Wood, John W.; Groeppel, Peter, Multi-layered platelet structure.

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45. Stevens, Gary; Smith, James D. B.; Wood, John W., Nano and meso shell-core control of physical properties and performance of electrically insulating composites.

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46. Swerin, Agne; Herman, Michael; Song, Jay C; Yang, Sen; Lee, Peter F; Bednarik, Ladislav, Paper with improved stiffness and bulk and method for making same.

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47. Swerin, Agne; Song, Jay C.; Bednarik, Ladislav; Lee, Peter F.; Herman, Michael C.; Yang, Sen, Paper with improved stiffness and bulk and method for making same.

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48. Swei Gwo S. ; Arthur David J., Particulate filled composition.

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49. Smith, James D. B.; Stevens, Gary; Wood, John W., Patterning on surface with high thermal conductivity materials.

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50. Smith, James D. B.; Stevens, Gary; Wood, John W., Patterning on surface with high thermal conductivity materials.

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51. Stevens, Gary C.; Smith, James D. B.; Wood, John W., Polymer brushes.

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52. Jang, Chang-soo; Won, Dong-kwan; Roh, Hyoung-ho; Ryu, Jae-chul, Printed circuit board and method of manufacturing the same.

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53. Jang,Chang soo; Won,Dong kwan; Roh,Hyoung ho; Ryu,Jae chul, Printed circuit board and method of manufacturing the same.

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54. Lin, Pui-Yan; Rajendran, Govindasamy Paramasivam; Zahr, George Elias, Printed circuits prepared from filled epoxy compositions.

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55. Kariya, Takashi; Furutani, Toshiki; Furusawa, Takeshi, Printed wiring board.

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56. Keen, Roy M., Printed wiring board pad cratering inhibitor.

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57. Romankiw, Lubomyr Taras, Process for making low dielectric constant hollow chip structures by removing sacrificial dielectric material after the chip is joined to a chip carrier.

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58. Givens, John H., Reduced RC between adjacent substrate wiring lines.

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59. Givens John H., Reduced RC delay between adjacent substrate wiring lines.

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60. Givens John H., Reduced RC delay between adjacent substrate wiring lines.

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61. John H. Givens, Reduced RC delay between adjacent substrate wiring lines.

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62. Amou, Satoru; Umino, Morimichi; Nagai, Akira; Nakamura, Yoshihiro; Minami, Nobuyuki, Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof.

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63. Amou,Satoru; Umino,Morimichi; Nagai,Akira; Nakamura,Yoshihiro; Minami,Nobuyuki, Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof.

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64. Hasegawa Yoshitsugu,JPX ; Yamamoto Hiroshi,JPX ; Wada Hiroshi,JPX ; Konishi Toshiharu,JPX ; Matsuoka Naoki,JPX, Resonance circuit tag, method for production thereof and method for changing resonance characteristic thereof.

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65. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding of HTC fillers to form dendritic structures.

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66. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding resins for enhancing the crystallinity of polymeric substructures.

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67. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding resins for enhancing the crystallinity of polymeric substructures.

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68. Kipp, Michael D.; Pugh, Dilworth L.; Ridges, Michael D.; McCarvill, William T., Shear panel building material.

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69. Kipp, Michael D.; Pugh, Dilworth L.; Ridges, Michael D.; McCarvill, William T., Sound attenuation building material and system.

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70. Kipp, Michael D.; Pugh, Dilworth L.; Ridges, Michael D.; McCarvill, William T., Sound attenuation building material and system.

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71. Smith, James David Blackhall; Stevens, Gary; Wood, John William, Structured resin systems with high thermal conductivity fillers.

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72. Kipp, Michael D.; Pugh, Dilworth L.; Ridges, Michael D.; McCarvill, William T., Utility materials incorporating a microparticle matrix.

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73. Kipp, Michael D.; Ridges, Michael D.; McCarvill, William T.; Pugh, Dilworth L., Utility materials incorporating a microparticle matrix.

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74. Kipp, Michael D.; Pugh, Dilworth L.; Ridges, Michael D.; McCarvill, William T., Utility materials incorporating a microparticle matrix formed with a setting agent.

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