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Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
  • H01L-029/46
  • H01L-029/62
출원번호 US-0609057 (1990-11-02)
발명자 / 주소
  • Brady Michael J. (Brewster NY) Kang Sung K. (Millwood NY) Moskowitz Paul A. (Yorktown Heights NY) Ryan James G. (Essex Junction VT) Reiley Timothy C. (Ridgefield CT) Walton Erick G. (Johnson VT) Bick
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 144  인용 특허 : 0

초록 ▼

A semiconductor chip carrying integrated circuits has lead lines terminating in conductive terminal pads exposed to the exterior through openings in a passivation layer. The pads include pedestals or bumps extending up from them. Each of the pedestals includes a thin metallic adhesion layer deposite

대표청구항 ▼

A structure comprising: a substrate; a bump on said substrate; the predominant component of the thickness of said bump being formed from a soft conducting layer formed from a material selected from the group consisting of aluminum and aluminum alloys; said bump having a surface layer suitable for bo

이 특허를 인용한 특허 (144)

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