이 특허를 인용한 특허 (31) 인용/피인용 타임라인 분석

1. Harada, Tadaaki; Hosokawa, Toshitsugu, Composition of epoxy resin, anhydride and microcapsule accelerator.

   상세보기
2. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Ortt, Earl M.; Stone, John C., Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion.

   상세보기
3. Du,Hung T.; Walter,Richard T.; Sell,Michael R.; West,Joshua F., Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion.

   상세보기
4. Garrett David William, Epoxy mold compound and method.

   상세보기
5. Ito Hiromi,JPX ; Kikuchi Takumi,JPX ; Fujioka Hirofumi,JPX ; Kanegae Hirozoh,JPX ; Itabashi Yoshifumi,JPX ; Nogami Fumio,JPX, Epoxy resin composition for molding having improved mechanical properties and crack resistance.

   상세보기
6. Ikezawa,Ryoichi; Nara,Naoki; Chaki,Hideyuki; Mizukami,Yoshihiro; Endou,Yoshinori; Kashihara,Takaki; Furusawa,Fumio; Yoshii,Masaki; Hagiwara,Shinsuke; Katayose,Mitsuo, Epoxy resin molding material for sealing use and semiconductor device.

   상세보기
7. Hirano Yasuhiro,JPX ; Akiba Masatsugu,JPX ; Shiomi Yutaka,JPX ; Saito Noriaki,JPX, Filler-containing resin composition suitable for injection molding and transfer molding.

   상세보기
8. Hirano Yasuhiro,JPX ; Akiba Masatsugu,JPX ; Shiomi Yutaka,JPX ; Saito Noriaki,JPX, Filler-containing resin composition suitable for injection molding and transfer molding.

   상세보기
9. Higuchi Noriaki,JPX ; Fukumoto Takaaki,JPX ; Shiobara Toshio,JPX ; Asano Eiichi,JPX ; Tomiyoshi Kazutoshi,JPX, Inorganic filler, epoxy resin composition, and semiconductor device.

   상세보기
10. Higuchi Noriaki,JPX ; Fukumoto Takaaki,JPX ; Shiobara Toshio,JPX ; Asano Eiichi,JPX ; Tomiyoshi Kazutoshi,JPX, Inorganic filler, epoxy resin composition, and semiconductor device.

    상세보기
11. Reeh, Ulrike; Höhn, Klaus; Stath, Norbert; Waitl, Günter; Schlotter, Peter; Schneider, Jürgen; Schmidt, Ralf, Light-radiating semiconductor component with a luminescence conversion element.

    상세보기
12. Du, Hung T.; Walter, Richard T., Method for forming a power tool.

    상세보기
13. Du,Hung T.; Walter,Richard T.; Sell,Michael R.; West,Joshua F., Method for forming an armature for an electric motor.

    상세보기
14. Du,Hung T., Method for forming an armature for an electric motor for a portable power tool.

    상세보기
15. Du,Hung T.; Verbrugge,Brandon L.; West,Joshua F.; Sell,Michael R.; Walter,Richard T.; Smith,David J.; Ortt,Earl M.; Stone,John C.; White,Howard T., Method for making an encapsulated coil structure.

    상세보기
16. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Smith, David J.; Ortt, Earl M.; Stone, John C.; White, Howard T., Method of forming a power tool.

    상세보기
17. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Smith, David J.; Ortt, Earl M.; Stone, John C.; White, Howard T., Method of forming a power tool.

    상세보기
18. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Smith, David J.; Ortt, Earl M.; Stone, John C.; White, Howard T., Method of forming a power tool.

    상세보기
19. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Smith, David J.; Ortt, Earl M.; Stone, John C.; White, Howard T., Method of forming a power tool.

    상세보기
20. Du, Hung T.; Walter, Richard T., Method of forming a power tool.

    상세보기
21. Du, Hung T.; Walter, Richard T., Method of forming a power tool.

    상세보기
22. West, Joshua F., Method of making an armature.

    상세보기
23. Du, Hung T.; Verbrugge, Brandon L.; West, Joshua F.; Sell, Michael R.; Walter, Richard T.; Smith, David J.; Ortt, Earl M.; Stone, John C.; White, Howard T., Method of manufacturing a power tool with molded armature.

    상세보기
24. Du, Hung T.; West, Joshua F.; Walter, Richard T., Method of manufacturing an electric motor of a power tool and of manufacturing the power tool.

    상세보기
25. Ito Hiromi,JPX ; Kikuchi Takumi,JPX ; Fujioka Hirofumi,JPX ; Kanegae Hirozoh,JPX ; Itabashi Yoshifumi,JPX ; Nogami Fumio,JPX, Molded products for high voltage apparatus comprising brominated epoxy resins.

    상세보기
26. Fung, Dein-Run; Liao, Te-Chao; Chen, Hao-Sheng, Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof.

    상세보기
27. Hoge James Edward ; Miyazaki Teruko Uchimi ; Eadara Rajan, Room temperature storage-stable, heat-curable, low CTE, one component epoxy resin tooling material.

    상세보기
28. Soga, Kyoko; Asai, Satoshi; Takemura, Katsuya, Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same.

    상세보기
29. Iwasa Mitsuyoshi,JPX ; Sakaguchi Yukio,JPX ; Simazoe Hirofumi,JPX, Silica filler and method for its production.

    상세보기
30. Hermansen Ralph D. ; Lindley Theresa Renee ; Wennberg Samuel R. ; Sanftleben Henry Morris ; Rosson James M., Solder joint encapsulation material.

    상세보기
31. Takeuchi, Hiroki; Kojima, Toshifumi; Ohbayashi, Kazushige; Kashima, Hisahito, Wiring substrate using embedding resin.

    상세보기
더보기

활용도 Top5 특허

더보기

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.