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Method for making printed circuits 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/04
  • C23C-003/02
출원번호 US-0585070 (1990-10-22)
우선권정보 GB-0030251 (1988-12-24); GB-0028563 (1989-12-18)
국제출원번호 PCT/GB89/01536 (1989-12-22)
§371/§102 date 19901022 (19901022)
국제공개번호 WO-9007858 (1990-07-12)
발명자 / 주소
  • Lowe John M. (Leicester GBX) Devonport Joseph (Leicestershire GBX)
출원인 / 주소
  • Technology Applications Company Limited (Isle of Man GB4 03)
인용정보 피인용 횟수 : 76  인용 특허 : 0

초록

Printed circuits are produced by screen printing or the like to deposit conductors, resistors, capacitors and insulators. Crossover connections are made by covering the conducting portions to be crossed with an insulating material that serves as a base for a printed crossing conductor. The equivalen

대표청구항

A printed circuit on a substrate comprising at least one set of electrical conductors carried on a surface of the substrate, a layer of an insulating polymer applied on a portion of said surface and bridging a first electrical conductor, a bridging electrical conductor carried on the surface of said

이 특허를 인용한 특허 (76)

  1. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F., Antifuse interconnect between two conducting layers of a printed circuit board.
  2. Isen Irvin ; Kucherovsky Joseph ; Hilton Jackie E., Apparatus for printing an electrical circuit component with print cells in liquid communication.
  3. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Shepherd William H. ; Xie John Y. ; Jiang Hang, Ball grid array structure and method for packaging an integrated circuit chip.
  4. Fleming, Robert; Graydon, Bhret; Vasquez, Daniel; Wu, Junjun; Razavi, Farhad, Circuit elements comprising ferroic materials.
  5. Hampden Smith, Mark J.; Kodas, Toivo T.; Powell, Quint H.; Skamser, Daniel J.; Caruso, James; Chandler, Clive, Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom.
  6. Kosowsky, Lex; Graydon, Bhret; Fleming, Robert, Components having voltage switchable dielectric materials.
  7. Kosowsky, Lex, Current-carrying structures fabricated using voltage switchable dielectric materials.
  8. Kosowsky, Lex; Fleming, Robert, Device applications for voltage switchable dielectric material having high aspect ratio particles.
  9. Kosowsky, Lex; Fleming, Robert, Device applications for voltage switchable dielectric material having high aspect ratio particles.
  10. Rand, Paul Kenneth; Brand, Peter John; Godfrey, James William, Dispenser with doses' counter.
  11. Kosowsky, Lex; Fleming, Robert; Graydon, Bhret; Vasquez, Daniel, Electric discharge protection for surface mounted and embedded components.
  12. Isen Irvin ; Kucherovsky Joseph, Electrical circuit component formed of a conductive liquid printed directly onto a substrate.
  13. Isen Irvin ; Kucherovsky Joseph, Electrical circuit component formed of a conductive liquid printed directly onto a substrate.
  14. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  15. Kosowsky, Lex; Fleming, Robert, Electronic device for voltage switchable dielectric material having high aspect ratio particles.
  16. Tuttle Mark E. ; Lake Rickie C., Embedded circuits.
  17. Kosowsky, Lex; Fleming, Robert; Graydon, Bhret; Vasquez, Daniel, Embedded protection against spurious electrical events.
  18. Tsai K. C. ; Mason Gary E. ; Goodwin Mark L. ; Ahmad Nazir ; Wu Davy ; Cromack Douglas ; Tong Robert R. ; Poplett James M. ; Anderson Ronald L. ; Nelson James P. ; McEwen Alan B., Energy storage device.
  19. Tsai K. C. ; Mason Gary E. ; Goodwin Mark L., Energy storage device and its methods of manufacture.
  20. DeHaven, Maxwell S., Etch resist using printer technology.
  21. DeHaven, Maxwell S., Etch resist using printer technology.
  22. Kosowsky, Lex; Fleming, Robert, Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same.
  23. Kosowsky, Lex; Fleming, Robert, Formulations for voltage switchable dielectric materials having a stepped voltage response and methods for making the same.
  24. Kosowsky, Lex; Fleming, Robert; Shi, Ning, Geometric and electric field considerations for including transient protective material in substrate devices.
  25. Kosowsky, Lex; Fleming, Robert, Geometric configuration or alignment of protective material in a gap structure for electrical devices.
  26. Lastinger Roc A., Information storage and identification tag.
  27. Kosowsky, Lex, Light-emitting device using voltage switchable dielectric material.
  28. Kosowsky, Lex; Fleming, Robert, Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles.
  29. Mui,Daniel SauFu, Low-cost keypad encoding circuit.
  30. Schreffler, Gary J, Material deposition on circuit card assemblies.
  31. Vanheusden, Karel; Kunze, Klaus; Kim, Hyungrak; Stump, Aaron D.; Schult, Allen B.; Hampden-Smith, Mark J.; Edwards, Chuck; James, Anthony R.; Caruso, James; Kodas, Toivo T.; Haubrich, Scott Thomas; Kowalski, Mark H., Metal nanoparticle compositions.
  32. Vanheusden, Karel; Kunze, Klaus; Kim, Hyungrak; Stump, Aaron D.; Schult, Allen B.; Hampden-Smith, Mark J.; Edwards, Chuck; James, Anthony R.; Caruso, James; Kodas, Toivo T.; Haubrich, Scott Thomas; Kowalski, Mark H., Metal nanoparticle compositions for reflective features.
  33. Xi Xiaomei ; Fu Sam ; Matijavesic Goran ; Brandt Lutz ; Gallagher Catharine ; Gandhi Pradeep, Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements.
  34. Ball Michael B., Method and apparatus for screen printing.
  35. Ball Michael B., Method and apparatus for screen printing.
  36. Ball, Michael B., Method and apparatus for screen printing.
  37. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F. ; Xie John Y., Method and structure to interconnect traces of two conductive layers in a printed circuit board.
  38. Kosowsky, Lex; Fleming, Robert, Method for electroplating a substrate.
  39. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Xie John Y., Method for supporting one or more electronic components.
  40. Tsai, K. C.; Mason, Gary E.; Goodwin, Mark L.; Ahmad, Nazir; Wu, Davy; Cromack, Douglas; Tong, Robert R.; Poplett, James M.; Anderson, Ronald L.; Nelson, James P.; McEwen, Alan B., Method of making energy storage device having electrodes coated with insulating microprotrusions.
  41. Deng Charles Z. ; Tsai Keh Chi ; Ghantous Dania, Method of producing high surface area metal oxynitrides as substrates in electrical energy storage.
  42. Anderson Ronald L. ; Goodwin Mark L. ; Mason Gary E. ; McEwen Alan B. ; Nelson James P. ; Poplett James M. ; Tong Robert R. ; Tsai K. C., Method to fabricate a reliable electrical storage device and the device thereof.
  43. Kosowsky, Lex, Methods for fabricating current-carrying structures using voltage switchable dielectric materials.
  44. Kosowsky,Lex, Methods for fabricating current-carrying structures using voltage switchable dielectric materials.
  45. Tuttle Mark E. ; Lake Rickie C., Methods for forming integrated circuits within substrates.
  46. Tuttle,Mark E.; Lake,Rickie C., Methods for forming integrated circuits within substrates.
  47. Lake Rickie C., Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices.
  48. Morshed, Bashir I., Multilayer additive printed circuit.
  49. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Xie John Y., Multilayer board having insulating isolation rings.
  50. Edwards, Chuck; Howarth, James John; Vanheusden, Karel, Optimized multi-layer printing of electronics and displays.
  51. Cromack Douglas ; Goodwin Mark L. ; Poplett James M. ; Tong Robert, Photolithographic production of microprotrusions for use as a space separator in an electrical storage device.
  52. Vanheusden, Karel; Edwards, Chuck, Printable electronic features on non-uniform substrate and processes for making same.
  53. Stone, Kate, Product packaging.
  54. Stone, Kate, Product packaging.
  55. Kunze, Klaus; Kim, Hyungrak; Schult, Allen B.; Stott, Nathan E.; Argo, Andrew M., Production of metal nanoparticles.
  56. Vanheusden, Karel; Kunze, Klaus; Kiim, Hyungrak; Stump, Aaron D.; Schult, Allen B.; Hampden-Smith, Mark J.; Edwards, Chuck; James, Anthony R.; Caruso, James; Kodas, Toivo T.; Haubrich, Scott Thomas; Kowalski, Mark H., Production of metal nanoparticles.
  57. Nathan Richard J. ; Lan James J. D. ; Chiang Steve S., Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect.
  58. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F., Programmable/reprogrammable structure using fuses and antifuses.
  59. Tuttle, John R., Radio frequency identification device and method.
  60. Tuttle, John R., Radio frequency identification device and method.
  61. Tuttle, John R., Radio frequency identification device and method.
  62. Kosowsky, Lex, Semiconductor devices including voltage switchable materials for over-voltage protection.
  63. Vanheusden, Karel; Kiim, Hyungrak; Stump, Aaron D.; Schult, Allen B.; Hampden Smith, Mark J.; Edwards, Chuck; James, Anthony R.; Caruso, James; Kodas, Toivo T.; Haubrich, Scott Thomas; Kowalski, Mark H., Separation of metal nanoparticles.
  64. Kosowsky, Lex; Fleming, Robert; Graydon, Bhret, Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration.
  65. Fleming, Robert; Kosowsky, Lex; Shang, Shurui; Graydon, Bhret; Chen, Xiaofeng; Irvin, Glen, Substrates having voltage switchable dielectric materials.
  66. Kosowsky, Lex; Graydon, Bhret; Moustafaev, Djabbar; Shang, Shurui; Fleming, Robert, Substrates having voltage switchable dielectric materials.
  67. Shang, Shurui; Fleming, Robert, Substrates having voltage switchable dielectric materials.
  68. Kosowsky, Lex; Fleming, Robert, System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices.
  69. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  70. Edwards, Chuck, System and process for manufacturing custom electronics by combining traditional electronics with printable electronics.
  71. Tuttle,John R., Thin flexible, RFID labels, and method and apparatus for use.
  72. Tuttle,John R., Thin, flexible, RFID label and system for use.
  73. Shepherd William H. ; Chiang Steve S. ; Xie John Y., Use of conductive particles in a nonconductive body as an integrated circuit antifuse.
  74. Kosowsky, Lex; Fleming, Robert; Wu, Junjun; Saraf, Pragnya; Ranganathan, Thangamani, Voltage switchable dielectric material containing conductive core shelled particles.
  75. Kosowsky, Lex; Fleming, Robert; Wu, Junjun; Saraf, Pragnya; Ranganathan, Thangamani, Voltage switchable dielectric material containing conductor-on-conductor core shelled particles.
  76. Kosowsky, Lex; Fleming, Robert, Voltage switchable dielectric material having bonded particle constituents.
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