이 특허를 인용한 특허 (25)

1. Ritzdorf, Thomas L.; Stevens, E. Henry; Chen, LinLin; Graham, Lyndon W.; Dundas, Curt, Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device.

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2. Pearson, Trevor; Clarke, Terence; Chapaneri, Roshan V.; Robinson, Craig; Hyslop, Alison; Singh, Amrik, Electrolytic generation of manganese (III) ions in strong sulfuric acid.

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3. Pearson, Trevor; Clarke, Terence; Chapaneri, Roshan V., Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode.

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4. Pearson, Trevor; Clarke, Terence; Chapaneri, Roshan V., Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode.

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5. Pearson, Trevor; Robinson, Craig, Etching of plastic using acidic solutions containing trivalent manganese.

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6. Pearson, Trevor; Robinson, Craig, Etching of plastic using acidic solutions containing trivalent manganese.

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7. Patel Gordhanbhai N. (Somerset NJ) Patel Subhash H. (Hoboken NJ), Etching plastics with nitrosyls.

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8. Scaraglino, Frank; Sommer, Walter; Brown, Neil D.; Wang, Kai, Metallization of dielectrics.

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9. Joshi, Nayan H., Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions.

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10. Ritzdorf,Thomas L.; Stevens,E. Henry; Chen,LinLin; Graham,Lyndon W.; Dundas,Curt, Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device.

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11. Timmer Roger James, Method for electroplating elastomer-modified polyphthalamide articles.

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12. Ritzdorf, Thomas L.; Graham, Lyndon W., Method for filling recessed micro-structures with metallization in the production of a microelectronic device.

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13. Ritzdorf,Thomas L.; Graham,Lyndon W., Method for filling recessed micro-structures with metallization in the production of a microelectronic device.

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14. Ritzdorf,Thomas L.; Stevens,E. Henry; Chen,LinLin; Graham,Lyndon W.; Dundas,Curt, Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device.

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15. Chen,LinLin; Graham,Lyndon W.; Ritzdorf,Thomas L.; Fulton,Dakin; Batz, Jr.,Robert W., Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density.

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16. Patel, Gordhanbhai N, Monitoring system based on etching of metals.

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17. Feng, Kesheng; Kapadia, Nilesh; Castaldi, Steven A.; Ganjei, John, Nickel-chromium alloy stripper for flexible wiring boards.

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18. Roussel, Sebastien; Gilbert, Frida, Process for coating a surface of a substrate made of nonmetallic material with a metal layer.

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19. Roussel, Sebastien; Gilbert, Frida, Process for coating a surface of a substrate made of nonmetallic material with a metal layer.

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20. Uzoh Cyprian Emeka, Process for integrated circuit wiring.

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21. Aegerter,Brian K.; Dundas,Curt T.; Ritzdorf,Tom L.; Curtis,Gary L.; Jolley,Michael; Peace,Steven L., Selective treatment of microelectric workpiece surfaces.

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22. Chen, Linlin; Graham, Lyndon W.; Ritzdorf, Thomas L.; Fulton, Dakin; Batz, Jr., Robert W., Submicron metallization using electrochemical deposition.

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23. Ball, James Charles; Young, Willie C, Surface activation and coating processes of a thermoplastic olefin using an aqueous immersion bath and products produced thereby.

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24. Haarer, Dietrich; Levy, Yoav, Time-temperature indicating device.

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25. Herdman, Roderick D.; Pearson, Trevor; Chapaneri, Roshan V.; Hyslop, Alison, Treatment for electroplating racks to avoid rack metallization.

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