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Laser ablatable polymer dielectrics and methods 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-003/06
  • B05D-005/12
  • B23K-026/00
출원번호 US-0456421 (1989-12-26)
발명자 / 주소
  • Cole Herbert S. (Scotia NY) Wojnarowski Robert J. (Ballston Lake NY)
출원인 / 주소
  • General Electric Company (Schenectady NY 02)
인용정보 피인용 횟수 : 45  인용 특허 : 0

초록

The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified material is substantially non-laser ablatable.

대표청구항 ▼

A method of making a high density interconnect structure, comprising: providing a module substrate having a plurality of integrated circuit chips disposed in at least one cavity in the module substrate, the integrated circuit chips having contact pads on upper surfaces thereof; providing a dye-conta

이 특허를 인용한 특허 (45)

  1. Robert John Wojnarowski ; Glenn Alan Forman ; Yung Sheng Liu, Alignment of optical interfaces for data communication.
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  2. Wojnarowski Robert John ; Forman Glenn Alan ; Liu Yung Sheng, Alignment of optical interfaces for data communication.
    상세보기
  3. Woychik, Charles Gerard; Fillion, Raymond Albert, Demountable interconnect structure.
    상세보기
  4. Davis Charles R. (Wappingers Falls NY) Egitto Frank D. (Binghamton NY) Skarvinko Eugene R. (Binghamton NY), Design of high density structures with laser etch stop.
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  5. Von Oepen, Randolf, Fluid bearing to support stent tubing during laser cutting.
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  6. Bradley ; Jr. Richard Alan ; Yamasaki Nancy Lee Schultz ; Lantman Christopher Wayne ; Hichwa Bryant, In-situ laser patterning of thin film layers during sequential depositing.
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  7. Fillion, Raymond Albert; Durocher, Kevin Matthew; Saia, Richard Joseph; Woychik, Charles Gerard, Interconnect structure.
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  8. Andrews, John R., Laser ablatable hydrophobic fluorine-containing graft copolymers.
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  9. Chen, Li; Yribarren, Travis; Von Oepen, Randolf; Ku, Yu-Chun, Laser cutting process for forming stents.
    상세보기
  10. Ow, Rodney C.; Webler, William E.; Von Oepen, Randolf, Laser cutting system.
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  11. Yang, Michael Wen-Chein; Kanga, Rustom Sam, Laser imaged printing plates.
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  12. Yang, Michael Wen-Chein; Kanga, Rustom Sam; Randall, Alvin Varnard, Laser imaged printing plates.
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  13. Yang, Michael Wen-Chein; Kanga, Rustom Sam; Randall, Alvin Varnard, Laser imaged printing plates.
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  14. Wojnarowski Robert J. (Ballston Lake NY) Cole Herbert S. (Burnt Hills NY) Sitnik-Nieters Theresa A. (Scotia NY) Daum Wolfgang (Schenectady NY), Low Dielectric constant materials for high speed electronics.
    상세보기
  15. Matsuo, Naoyuki; Urairi, Masakatsu; Hino, Atsushi, Manufacturing method of laser processed parts and adhesive sheet for laser processing.
    상세보기
  16. Matsuo, Naoyuki; Urairi, Masakatsu; Hino, Atsushi, Manufacturing method of laser processed parts and protective sheet for laser processing.
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  17. Urairi, Masakatsu; Hino, Atsushi; Matsuo, Naoyuki; Takahashi, Tomokazu; Matsumura, Takeshi; Yamamoto, Syouji, Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same.
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  18. Doany,Fuad E.; Marino,Jeffrey R.; Sambucetti,Carlos J.; Saraf,Ravi F., Means of seeding and metallizing polyimide.
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  19. Rose Paul B. (Winter Park FL) Lamanna John L. (Winter Park FL), Method and system for fabricating a multilayer laminate for a printed wiring board, and a printed wiring board formed th.
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  20. Cole ; Jr. Herbert Stanley ; Sitnik-Nieters Theresa Ann, Method for making an electronic module.
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  21. Clarke James A. ; Kunze ; Jr. Robert K., Method of forming acoustic attenuation chambers using laser processing of multi-layered polymer films.
    상세보기
  22. Clarke James A. ; Kunze ; Jr. Robert K., Method of forming acoustic attenuation chambers using laser processing of multi-layered polymer films.
    상세보기
  23. Belgacem Haba (Tokyo JPX) Morishige Yukio (Tokyo JPX), Method of forming via holes in a insulation film and method of cutting the insulation film.
    상세보기
  24. Schofield Kevin H., Method of laser ablation of semiconductor structures.
    상세보기
  25. Woychik, Charles Gerard; Fillion, Raymond Albert, Method of making demountable interconnect structure.
    상세보기
  26. Yang Michael Wen-Chein ; Kanga Rustom Sam ; Randall Alvin Varnard, Method of making laser imaged printing plates utilizing ultraviolet absorbing layer.
    상세보기
  27. Chua,Swee Kwang; Low,Siu Waf; Chia,Yong Poo; Eng,Meow Koon; Neo,Yong Loo; Boon,Suan Jeung; Huang,Suangwu; Zhou,Wei, Method of making multichip wafer level packages and computing systems incorporating same.
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  28. Budd, Richard W.; Moon, Brett A., Micro-machining of ceramics using an ytterbium fiber-laser.
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  29. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
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  30. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
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  31. Chen, Li; Von Oepen, Randolf, Multiple beam laser system for forming stents.
    상세보기
  32. Chen, Li; von Oepen, Randolf, Multiple beam laser system for forming stents.
    상세보기
  33. Chen, Li; von Oepen, Randolf, Multiple beam laser system for forming stents.
    상세보기
  34. Fillion, Raymond Albert; Beaupre, Richard Alfred; Elasser, Ahmed; Wojnarowski, Robert John; Korman, Charles Steven, Power semiconductor packaging method and structure.
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  35. Fillion,Raymond Albert; Beaupre,Richard Alfred; Elasser,Ahmed; Wojnarowski,Robert John; Korman,Charles Steven, Power semiconductor packaging method and structure.
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  36. Tang, Peter Torben; Nielsen, Jakob Skov; Nielsen, Peter Caroe; Hansen, Hans Nørgaard; Zhang, Yang, Preparation of a polymer article for selective metallization.
    상세보기
  37. Wojnarowski Robert J. (Ballston Lake NY) Cole Herbert S. (Burnt Hills NY) Sitnik-Nieters Theresa A. (Scotia NY) Daum Wolfgang (Schenectady NY), Processing low dielectric constant materials for high speed electronics.
    상세보기
  38. Urairi, Masakatsu; Hino, Atsushi; Matsuo, Naoyuki; Takahashi, Tomokazu; Matsumura, Takeshi; Yamamoto, Syouji, Protective sheet for laser processing and manufacturing method of laser processed parts.
    상세보기
  39. Echigo, Fumio; Higashitani, Hideki; Andoh, Daizo; Fukuda, Noritake; Nakatani, Yasuhiro; Nakamura, Tadashi, Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board.
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  40. Echigo, Fumio; Higashitani, Hideki; Andoh, Daizo; Fukuda, Noritake; Nakatani, Yasuhiro; Nakamura, Tadashi, Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board.
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  41. Pacetti, Stephen D.; Harrington, Joel, Short pulse laser machining of polymers enhanced with light absorbers for fabricating medical devices.
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  42. Lee, Seung-Ryong, Substrate for display device and method of fabricating the same.
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  43. Lee, Seung-Ryong, Substrate for display device and method of fabricating the same.
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  44. Komplin Steven Robert, System and method for feature compensation of an ablated inkjet nozzle plate.
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  45. Lichtenstein, Parker Ross; Peng, Hong, Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites.
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