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Staged-vacuum wafer processing system and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-013/08
출원번호 US-0685976 (1991-04-15)
발명자 / 주소
  • Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Somekh Sasson (Los Altos Hills CA) Maydan Dan (Los Altos Hills CA)
출원인 / 주소
  • Applied Materials, Inc. (Santa Clara CA 02)
인용정보 피인용 횟수 : 554  인용 특허 : 0

초록 ▼

A processing system for workpieces such as semiconductor wafers is disclosed which incorporates multiple, isolated vacuum stages between the cassette load lock station and the main vacuum processing chambers. A vacuum gradient is applied between the cassette load lock and the main processing chamber

대표청구항 ▼

A staged vacuum-isolation processing system comprising: a multiplicity of isolatable communicating regions including at least a vacuum load lock chamber; a vacuum workpiece-processing chamber and an intermediate workpiece transport region; and vacuum means communicating with the isolatable regions f

이 특허를 인용한 특허 (554)

  1. Gopalraja Praburam ; Narasimhan Murali, Adjustment of deposition uniformity in an inductively coupled plasma source.
    상세보기
  2. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.
    상세보기
  3. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.
    상세보기
  4. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.
    상세보기
  5. Liu, Feng Q.; Chang, Mei; Thompson, David, Alcohol assisted ALD film deposition.
    상세보기
  6. Satitpunwaycha Peter ; Yao Gongda ; Ngan Kenny King-Tai ; Xu Zheng, Aluminum hole filling method using ionized metal adhesion layer.
    상세보기
  7. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.
    상세보기
  8. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum selective etch.
    상세보기
  9. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.
    상세보기
  10. Arne W. Ballantine ; Peter A. Emmi ; Walter J. Frey ; Michael J. Gambero ; Neena Garg ; Byeongju Park ; Donald L. Wilson, Apparatus and method for controlling wafer environment between thermal clean and thermal processing.
    상세보기
  11. Xu Zheng ; Hofmann Ralf, Apparatus and method for enhancing uniformity of a metal film formed on a substrate with the aid of an inductively coupl.
    상세보기
  12. Park Jun Sig,KRX ; Kim Young Sun,KRX ; Kim Jung Ki,KRX, Apparatus and method for low pressure chemical vapor deposition using multiple chambers and vacuum pumps.
    상세보기
  13. Park Jun Sig,KRX ; Kim Young Sun,KRX ; Kim Jung Ki,KRX, Apparatus and method for low pressure chemical vapor deposition using multiple chambers and vacuum pumps.
    상세보기
  14. Chen, Chen-An; Gelatos, Avgerinos; Yang, Michael X.; Xi, Ming; Hytros, Mark M., Apparatus and method for plasma assisted deposition.
    상세보기
  15. Chen,Chen An; Gelatos,Avgerinos; Yang,Michael X.; Xi,Ming; Hytros,Mark M., Apparatus and method for plasma assisted deposition.
    상세보기
  16. Kato Susumu,JPX ; Ozawa Masahito,JPX ; Muraoka Sunao,JPX, Apparatus and method for regulating pressure in two chambers.
    상세보기
  17. Kim, Sam H.; Hosokawa, Akihiro; Suh, Dong Choon, Apparatus and method for uniform substrate heating and contaminate collection.
    상세보기
  18. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
    상세보기
  19. Klawuhn, Erich R.; Rozbicki, Robert; Dixit, Girish A., Apparatus and methods for deposition and/or etch selectivity.
    상세보기
  20. Yudovsky, Joseph; Gangakhedkar, Kaushal, Apparatus and methods for wafer chucking on a susceptor for ALD.
    상세보기
  21. Schauer, Ronald Vern; Lappen, Alan Rick, Apparatus for alignment of automated workpiece handling systems.
    상세보기
  22. Xu Zheng ; Forster John ; Yao Tse-Yong, Apparatus for filling apertures in a film layer on a semiconductor substrate.
    상세보기
  23. Chung,Hua; Chen,Ling; Yu,Jick; Chang,Mei, Apparatus for integration of barrier layer and seed layer.
    상세보기
  24. Yamazaki,Shunpei; Takenouchi,Akira; Takemura,Yasuhiko, Apparatus for processing a semiconductor.
    상세보기
  25. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
    상세보기
  26. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
    상세보기
  27. Stevens, Craig L.; Levy, Karl B., Architecture for high throughput semiconductor processing applications.
    상세보기
  28. Hong Minghwei ; Kwo Jueinai Raynien ; Mannaerts Joseph Petrus ; Passlack Matthias ; Ren Fan ; Zydzik George John, Article comprising a gallium layer on a GaAs-based semiconductor, and method of making the article.
    상세보기
  29. Mark I. Gardner ; H. Jim Fulford, Asymmetrical transistor having a barrier-incorporated gate oxide and a graded implant only in the drain-side junction area.
    상세보기
  30. Kadosh Daniel ; Gardner Mark I. ; Duane Michael ; Cheek Jon D. ; Hause Fred N. ; Dawson Robert ; Moore Brad T., Asymmetrical transistor structure.
    상세보기
  31. Chin,Barry L.; Mak,Alfred W.; Lei,Lawrence Chung Lai; Xi,Ming; Chung,Hua; Lai,Ken Kaung; Byun,Jeong Soo, Atomic layer deposition apparatus.
    상세보기
  32. Chung, Hua; Wang, Rongjun; Maity, Nirmalya, Atomic layer deposition of barrier materials.
    상세보기
  33. Thompson, David, Atomic layer deposition of films comprising Si(C)N using hydrazine, azide and/or silyl amine derivatives.
    상세보기
  34. Nguyen, Victor; Li, Ning; Balseanu, Mihaela; Xia, Li-Qun; Saly, Mark; Thompson, David, Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors.
    상세보기
  35. Weidman, Timothy W.; Michaelson, Timothy; Ma, Paul F.; Deaton, Paul, Atomic layer deposition of hafnium or zirconium alloy films.
    상세보기
  36. Pradhan, Anshu A.; Rozbicki, Robert, Atomic layer profiling of diffusion barrier and metal seed layers.
    상세보기
  37. Shri Singhvi ; Suraj Rengarajan ; Peijun Ding ; Gongda Yao, Barrier applications for aluminum planarization.
    상세보기
  38. Chen, Ling; Marcadal, Christophe, Barrier layer structure for copper metallization and method of forming the structure.
    상세보기
  39. Kori, Moris; Mak, Alfred W.; Byun, Jeong Soo; Lei, Lawrence Chung-Lai; Chung, Hua; Sinha, Ashok; Xi, Ming, Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques.
    상세보기
  40. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
    상세보기
  41. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
    상세보기
  42. Wood, Keith Freeman; Rodnick, Matthew Jonathon, Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates.
    상세보기
  43. Inagawa,Makoto; Hosokawa,Akihiro, Chamber for uniform substrate heating.
    상세보기
  44. Shang, Quanyuan; Kardokus, Janine; Hosokawa, Akihiro, Chamber for uniform substrate heating.
    상세보기
  45. Shang,Quanyuan; Kardokus,Janine; Hosokawa,Akihiro, Chamber for uniform substrate heating.
    상세보기
  46. Lubomirsky, Dmitry, Chamber with flow-through source.
    상세보기
  47. Lubomirsky, Dmitry, Chamber with flow-through source.
    상세보기
  48. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
    상세보기
  49. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
    상세보기
  50. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
    상세보기
  51. Lu, Jiang; Ha, Hyoung-Chan; Ma, Paul F.; Ganguli, Seshadri; Aubuchon, Joseph F.; Yu, Sang-ho; Narasimhan, Murali K., Cobalt deposition on barrier surfaces.
    상세보기
  52. Lu, Jiang; Ha, Hyoung-Chan; Ma, Paul; Ganguli, Seshadri; Aubuchon, Joseph F.; Yu, Sang Ho; Narasimhan, Murali K., Cobalt deposition on barrier surfaces.
    상세보기
  53. Wang, Xikun; Cui, Zhenjiang; Park, Soonam; Ingle, Nitin K., Cobalt-containing material removal.
    상세보기
  54. Cheung, David; Yau, Wai-Fan; Mandal, Robert R., Computer readable medium for holding a program for performing plasma-assisted CVD of low dielectric constant films formed from organosilane compounds.
    상세보기
  55. Lubomirsky, Dmitry; Kim, Sung Je, Conditioned semiconductor system parts.
    상세보기
  56. Shaviv, Roey; Gopinath, Sanjay; Holverson, Peter; Pradhan, Anshu A., Conformal films on semiconductor substrates.
    상세보기
  57. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
    상세보기
  58. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
    상세보기
  59. Kim, Nam-Hun; Chinn, Jeffrey D., Construction of built-up structures on the surface of patterned masking used for polysilicon etch.
    상세보기
  60. Lu, Xinliang; Kao, Chien Teh; Lai, Chiukin Steve; Chang, Mei, Contact clean by remote plasma and repair of silicide surface.
    상세보기
  61. Lu, Xinliang; Kao, Chien-Teh; Lai, Chiukin Steve; Chang, Mei, Contact clean by remote plasma and repair of silicide surface.
    상세보기
  62. Lu, Xinliang; Kao, Chien-Teh; Lai, Chiukin Steve; Chang, Mei, Contact clean by remote plasma and repair of silicide surface.
    상세보기
  63. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
    상세보기
  64. Ye, Yan; Zhao, Allen; Deng, Xiancan; Ma, Diana Xiaobing, Control of patterned etching in semiconductor features.
    상세보기
  65. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
    상세보기
  66. Ye Yan ; Zhao Allen ; Deng Xiancan ; Ma Diana Xiaobing, Copper etch using HCI and HBr chemistry.
    상세보기
  67. Yan Ye ; Allen Zhao ; Xiancan Deng ; Diana Xiaobing Ma, Copper etch using HCl and HBR chemistry.
    상세보기
  68. Hoinkis, Mark; Yan, Chun; Miyazoe, Hiroyuki; Joseph, Eric, Copper residue chamber clean.
    상세보기
  69. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
    상세보기
  70. Yang, Michael X.; Xi, Ming, Cyclical deposition of a variable content titanium silicon nitride layer.
    상세보기
  71. Wang, Shulin; Kroemer, Ulrich; Luo, Lee; Chen, Aihua; Li, Ming, Cyclical deposition of tungsten nitride for metal oxide gate electrode.
    상세보기
  72. Wang,Shulin; Kroemer,Ulrich; Luo,Lee; Chen,Aihua; Li,Ming, Cyclical deposition of tungsten nitride for metal oxide gate electrode.
    상세보기
  73. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Damage-free sculptured coating deposition.
    상세보기
  74. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
    상세보기
  75. Zhu, Lina; Kang, Sean S.; Nemani, Srinivas D.; Kao, Chia-Ling, Delicate dry clean.
    상세보기
  76. Yoon, Ki Hwan; Cha, Yonghwa Chris; Yu, Sang Ho; Ahmad, Hafiz Farooq; Wee, Ho Sun, Deposition methods for barrier and tungsten materials.
    상세보기
  77. Yoon,Ki Hwan; Cha,Yonghwa Chris; Yu,Sang Ho; Ahmad,Hafiz Farooq; Wee,Ho Sun, Deposition methods for barrier and tungsten materials.
    상세보기
  78. Gandikota, Srinivas; Lu, Xinliang; Chen, Shih Chung; Tang, Wei; Zhou, Jing; Ganguli, Seshadri; Thompson, David; Anthis, Jeffrey W.; Noori, Atif; Gungor, Faruk; Wu, Dien-Yeh; Chang, Mei; Fu, Xinyu; Lei, Yu, Deposition of N-metal films comprising aluminum alloys.
    상세보기
  79. Law, Kam; Shang, Quanyuan; Harshbarger, William Reid; Maydan, Dan, Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications.
    상세보기
  80. Law,Kam; Shang,Quanyuan; Harshbarger,William Reid; Maydan,Dan, Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications.
    상세보기
  81. Yoon, Hyungsuk A.; Fang, Hongbin; Yang, Michael X., Deposition of tungsten films.
    상세보기
  82. Wyka Gary ; Carrera Jaime ; Hoskins Van, Detection system for substrate clamp.
    상세보기
  83. Wyka Gary ; Carrera Jaime ; Hoskins Van, Detection system for substrate clamp.
    상세보기
  84. Ma, Shawming, Device for monitoring substrate charging and method of fabricating same.
    상세보기
  85. Gardner Mark I. ; Gilmer Mark C., Diamond etch stop rendered conductive by a gas cluster ion beam implant of titanium.
    상세보기
  86. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
    상세보기
  87. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
    상세보기
  88. Purayath, Vinod R.; Wang, Anchuan; Ingle, Nitin K., Dopant etch selectivity control.
    상세보기
  89. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
    상세보기
  90. Zhang, Jingchun; Ingle, Nitin K.; Wang, Anchuan, Dry etch process.
    상세보기
  91. Kim, Sang Hyuk; Yang, Dongqing; Lee, Young S.; Jung, Weon Young; Kim, Sang-jin; Hsu, Ching-Mei; Wang, Anchuan; Ingle, Nitin K., Dry-etch for selective oxidation removal.
    상세보기
  92. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
    상세보기
  93. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
    상세보기
  94. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.
    상세보기
  95. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
    상세보기
  96. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
    상세보기
  97. Avi Tepman ; Donald J. K. Olgado ; Allen L. D'Ambra, Dual buffer chamber cluster tool for semiconductor wafer processing.
    상세보기
  98. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Dual discharge modes operation for remote plasma.
    상세보기
  99. Nagashima, Makoto, Dual hexagonal shaped plasma source.
    상세보기
  100. Lei, Lawrence C.; Kori, Moris, Dual robot processing system.
    상세보기
  101. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
    상세보기
  102. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
    상세보기
  103. Kraus, Joseph Arthur; Strassner, James David, Dual wafer load lock.
    상세보기
  104. Ge, Zhenbin; Kao, Chien-Teh; Huston, Joel M.; Chang, Mei, Dual-direction chemical delivery system for ALD/CVD chambers.
    상세보기
  105. Ge, Zhenbin; Kao, Chien-Teh; Huston, Joel M.; Chang, Mei, Dual-direction chemical delivery system for ALD/CVD chambers.
    상세보기
  106. Lam, Wei Chak Joseph, Efficient layout and design of production facility.
    상세보기
  107. Lam, Wei Chak Joseph, Efficient layout and design of production facility.
    상세보기
  108. Lam, Wei Chak Joseph, Efficient layout and design of production facility.
    상세보기
  109. Lam, Wei Chak Joseph, Efficient layout and design of production facility.
    상세보기
  110. White, John M.; Verplancken, Donald; Kurita, Shinichi, Electronic device manufacturing chamber method.
    상세보기
  111. Forster, John C.; Yudovsky, Joseph; Kwong, Garry K.; Ngo, Tai T.; Griffin, Kevin; Collins, Kenneth S.; Liu, Ren, Elongated capacitively coupled plasma source for high temperature low pressure environments.
    상세보기
  112. Forster, John C.; Yudovsky, Joseph; Kwong, Garry K.; Ngo, Tai T.; Griffin, Kevin; Collins, Kenneth S.; Liu, Ren, Elongated capacitively coupled plasma source for high temperature low pressure environments.
    상세보기
  113. Ingle, Nitin K.; Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Enhanced etching processes using remote plasma sources.
    상세보기
  114. Chen,Ling; Chang,Mei, Enhancement of copper line reliability using thin ALD tan film to cap the copper line.
    상세보기
  115. Hazel, Brian T; DePalma, Joseph A; Serra, Jessica L; Thayer, Henry H; Blankenship, Donn R; Bochiechio, Mario P; Zajchowski, Paul H, Equipment for plasma spray with liquid injection.
    상세보기
  116. Kaveh, Farrokh, Equipment front end module.
    상세보기
  117. Korolik, Mikhail; Ingle, Nitin K.; Zhang, Jingchun; Wang, Anchuan; Liu, Jie, Etch suppression with germanium.
    상세보기
  118. Yan Ye ; Diana Xiaobing Ma ; Gerald Yin, Etched patterned copper features free from etch process residue.
    상세보기
  119. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Even tungsten etch for high aspect ratio trenches.
    상세보기
  120. Xu Zheng ; Forster John ; Yao Tse-Yong ; Nulman Jaim ; Chen Fusen, Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer.
    상세보기
  121. Lei, Yu; Gandikota, Srinivas; Ganguli, Seshadri; Zheng, Bo; Jakkaraju, Rajkumar; Salinas, Martin Jeff; Schmiege, Benjamin, Film deposition using spatial atomic layer deposition or pulsed chemical vapor deposition.
    상세보기
  122. Purayath, Vinod R.; Ingle, Nitin K., Flash gate air gap.
    상세보기
  123. Pandit, Mandar; Wang, Xikun; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Fluorine-based hardmask removal.
    상세보기
  124. Cho, Yonah; Kim, Yihwan, Formation and treatment of epitaxial layer containing silicon and carbon.
    상세보기
  125. Kim, Yihwan; Samoilov, Arkadii V., Formation and treatment of epitaxial layer containing silicon and carbon.
    상세보기
  126. Seutter, Sean M.; Yang, Michael X.; Xi, Ming, Formation of a tantalum-nitride layer.
    상세보기
  127. Seutter, Sean M.; Yang, Michael X.; Xi, Ming, Formation of a tantalum-nitride layer.
    상세보기
  128. Seutter, Sean M.; Yang, Michael X.; Xi, Ming, Formation of a tantalum-nitride layer.
    상세보기
  129. Seutter, Sean M.; Yang, Michael X.; Xi, Ming, Formation of a tantalum-nitride layer.
    상세보기
  130. Seutter,Sean M.; Yang,Michael X.; Xi,Ming, Formation of a tantalum-nitride layer.
    상세보기
  131. Byun, Jeong Soo; Mak, Alfred, Formation of boride barrier layers using chemisorption techniques.
    상세보기
  132. Byun,Jeong Soo; Mak,Alfred, Formation of boride barrier layers using chemisorption techniques.
    상세보기
  133. Byun,Jeong Soo; Mak,Alfred, Formation of boride barrier layers using chemisorption techniques.
    상세보기
  134. Byun,Jeong Soo; Mak,Alfred, Formation of boride barrier layers using chemisorption techniques.
    상세보기
  135. Ye, Zhiyuan; Lam, Andrew M.; Kim, Yihwan, Formation of epitaxial layer containing silicon and carbon.
    상세보기
  136. Kim, Yihwan, Formation of in-situ phosphorus doped epitaxial layer containing silicon and carbon.
    상세보기
  137. Tepman Avi, Front end vacuum processing environment.
    상세보기
  138. White, Carl L.; Shero, Eric; Reed, Joe, Gap maintenance for opening to process chamber.
    상세보기
  139. Chen, Ling; Ku, Vincent; Wu, Dien-Yeh; Chung, Hua; Ouye, Alan; Nakashima, Norman, Gas delivery apparatus and method for atomic layer deposition.
    상세보기
  140. Chen, Ling; Ku, Vincent; Wu, Dien-Yeh; Chung, Hua; Ouye, Alan; Nakashima, Norman, Gas delivery apparatus and method for atomic layer deposition.
    상세보기
  141. Chen, Ling; Ku, Vincent; Wu, Dien-Yeh; Chung, Hua; Ouye, Alan; Nakashima, Norman, Gas delivery apparatus for atomic layer deposition.
    상세보기
  142. Chen, Ling; Ku, Vincent; Wu, Dien-Yeh; Chung, Hua; Ouye, Alan; Nakashima, Norman; Chang, Mei, Gas delivery apparatus for atomic layer deposition.
    상세보기
  143. Yudovsky, Joseph, Gas distribution system for cyclical layer deposition.
    상세보기
  144. Park, Seung; Wang, Xikun; Liu, Jie; Wang, Anchuan; Kim, Sang-jin, Gas-phase tungsten etch.
    상세보기
  145. Hung, Steven C. H.; Miner, Gary E., Gate electrode structures.
    상세보기
  146. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
    상세보기
  147. Kim, Sung Je; Kalita, Laksheswar; Pareek, Yogita; Kadam, Ankur; Goradia, Prerna Sonthalia; Thakur, Bipin; Lubomirsky, Dmitry, Generation of compact alumina passivation layers on aluminum plasma equipment components.
    상세보기
  148. Korolik, Mikhail; Ingle, Nitin; Kioussis, Dimitri, Germanium etching systems and methods.
    상세보기
  149. Cho, Tae; Kang, Sang Won; Yang, Dongqing; Lu, Raymond W.; Hillman, Peter; Celeste, Nicholas; Tan, Tien Fak; Park, Soonam; Lubomirsky, Dmitry, Grooved insulator to reduce leakage current.
    상세보기
  150. Gardner Mark I. ; Hause Frederick N. ; May Charles E., High dielectric constant gate dielectric with an overlying tantalum gate conductor formed on a sidewall surface of a sacrificial structure.
    상세보기
  151. Yao Tse-Yong ; Chin Barry, High pressure copper fill at low temperature.
    상세보기
  152. Jones, William D., High pressure fourier transform infrared cell.
    상세보기
  153. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
    상세보기
  154. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
    상세보기
  155. Provencher, Timothy J.; Hickson, Craig B., High temperature ALD inlet manifold.
    상세보기
  156. Tran, Toan Q.; Malik, Sultan; Lubomirsky, Dmitry; Roy, Shambhu N.; Kobayashi, Satoru; Cho, Tae Seung; Park, Soonam; Venkataraman, Shankar, High temperature chuck for plasma processing systems.
    상세보기
  157. Collins, Joshua; Narasimhan, Murali K.; Liu, Jingjing; Lee, Sang-Hyeob; Wu, Kai; Gelatos, Avgerinos V., High temperature tungsten metallization process.
    상세보기
  158. Collins, Joshua; Narasimhan, Murali K.; Liu, Jingjing; Lee, Sang-Hyeob; Wu, Kai; Gelatos, Avgerinos V., High temperature tungsten metallization process.
    상세보기
  159. Stevens, Craig Lyle, High throughput architecture for semiconductor processing.
    상세보기
  160. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
    상세보기
  161. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
    상세보기
  162. Chen, Zhijun; Li, Zihui; Ingle, Nitin K.; Wang, Anchuan; Venkataraman, Shankar, Highly selective doped oxide removal method.
    상세보기
  163. Gardner Mark I. ; Gilmer Mark C., Incorporating barrier atoms into a gate dielectric using gas cluster ion beam implantation.
    상세보기
  164. Gilmer Mark C. ; Gardner Mark I., Incorporating silicon atoms into a metal oxide gate dielectric using gas cluster ion beam implantation.
    상세보기
  165. O'Donnell, Robert J., Insitu post etch process to remove remaining photoresist and residual sidewall passivation.
    상세보기
  166. Nakasuji, Mamoru; Noji, Nobuharu; Satake, Tohru; Hatakeyama, Masahiro; Kimba, Toshifumi; Sobukawa, Hirosi; Yoshikawa, Shoji; Murakami, Takeshi; Watanabe, Kenji; Karimata, Tsutomu; Oowada, Shin; Saito, Mutsumi; Yamazaki, Yuichiro; Nagai, Takamitsu; Nagahama, Ichirota, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  167. Nakasuji, Mamoru; Noji, Nobuharu; Satake, Tohru; Hatakeyama, Masahiro; Kimba, Toshifumi; Sobukawa, Hirosi; Yoshikawa, Shoji; Murakami, Takeshi; Watanabe, Kenji; Karimata, Tsutomu; Oowada, Shin; Saito, Mutsumi; Yamazaki, Yuichiro; Nagai, Takamitsu; Nagahama, Ichirota, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  168. Nakasuji, Mamoru; Noji, Nobuharu; Satake, Tohru; Hatakeyama, Masahiro; Kimba, Toshifumi; Sobukawa, Hirosi; Yoshikawa, Shoji; Murakami, Takeshi; Watanabe, Kenji; Karimata, Tsutomu; Oowada, Shin; Saito, Mutsumi; Yamazaki, Yuichiro; Nagai, Takamitsu; Nagahama, Ichirota, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  169. Nakasuji, Mamoru; Noji, Nobuharu; Satake, Tohru; Hatakeyama, Masahiro; Kimba, Toshifumi; Sobukawa, Hirosi; Yoshikawa, Shoji; Murakami, Takeshi; Watanabe, Kenji; Karimata, Tsutomu; Oowada, Shin; Saito, Mutsumi; Yamazaki, Yuichiro; Nagai, Takamitsu; Nagahama, Ichirota, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  170. Nakasuji,Mamoru; Noji,Nobuharu; Satake,Tohru; Hatakeyama,Masahiro; Kimba,Toshifumi; Sobukawa,Hiroshi; Yoshikawa,Shoji; Murakami,Takeshi; Watanabe,Kenji; Karimata,Tsutomu; Oowada,Shin; Saito,Mutsumi; Yamazaki,Yuichiro; Nagai,Takamitsu; Nagahama,Ichirota, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  171. Nakasuji,Mamoru; Noji,Nobuharu; Satake,Tohru; Hatakeyama,Masahiro; Kimba,Toshifumi; Sobukawa,Hirosi; Yoshikawa,Shoji; Murakami,Takeshi; Watanabe,Kenji; Karimata,Tsutomu; Oowada,Shin; Saito,Mutsumi; Y, Inspection system by charged particle beam and method of manufacturing devices using the system.
    상세보기
  172. Chen, Xinglong; Lubomirsky, Dmitry; Venkataraman, Shankar, Insulated semiconductor faceplate designs.
    상세보기
  173. Satitpunwaycha Peter ; Yao Gongda ; Ngan Kenny King-Tai ; Xu Zheng, Integrated PVD system for aluminum hole filling using ionized metal adhesion layer.
    상세보기
  174. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
    상세보기
  175. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
    상세보기
  176. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Integrated oxide and nitride recess for better channel contact in 3D architectures.
    상세보기
  177. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.
    상세보기
  178. Yudovsky, Joseph; Gangakhedkar, Kaushal, Integrated two-axis lift-rotation motor center pedestal in multi-wafer carousel ALD.
    상세보기
  179. Chung,Hua; Maity,Nirmalya; Yu,Jick; Mosely,Roderick Craig; Chang,Mei, Integration of ALD tantalum nitride for copper metallization.
    상세보기
  180. Chung,Hua; Bekiaris,Nikolaos; Marcadal,Christophe; Chen,Ling, Integration of ALD/CVD barriers with porous low k materials.
    상세보기
  181. Chung, Hua; Chen, Ling; Yu, Jick; Chang, Mei, Integration of barrier layer and seed layer.
    상세보기
  182. Chung,Hua; Chen,Ling; Yu,Jick; Chang,Mei, Integration of barrier layer and seed layer.
    상세보기
  183. Yang, Michael X.; Itoh, Toshio; Xi, Ming, Integration of titanium and titanium nitride layers.
    상세보기
  184. Yang,Michael X.; Itoh,Toshio; Xi,Ming, Integration of titanium and titanium nitride layers.
    상세보기
  185. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
    상세보기
  186. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
    상세보기
  187. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
    상세보기
  188. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.
    상세보기
  189. Lam,Wei Chak Joseph, Layout of production facility.
    상세보기
  190. Nguyen, Anh N.; Yang, Michael X.; Xi, Ming; Chung, Hua; Chang, Anzhong; Yuan, Xiaoxiong; Lu, Siqing, Lid assembly for a processing system to facilitate sequential deposition techniques.
    상세보기
  191. Tzu, Gwo-Chuan; Umotoy, Salvador P., Lid assembly for a processing system to facilitate sequential deposition techniques.
    상세보기
  192. Tzu, Gwo-Chuan; Umotoy, Salvador P., Lid assembly for a processing system to facilitate sequential deposition techniques.
    상세보기
  193. Kao, Chien Teh; Chou, Jing Pei (Connie); Lai, Chiukin (Steven); Umotoy, Sal; Huston, Joel M.; Trinh, Son; Chang, Mei; Yuan, Xiaoxiong (John); Chang, Yu; Lu, Xinliang; Wang, Wei W.; Phan, See Eng, Lid assembly for front end of line fabrication.
    상세보기
  194. Englhardt, Eric A.; Szudarski, Steve; Cornelius, Andrew Scott; Puri, Amitabh; Rice, Michael Robert; Hudgens, Jeffrey C.; Sansoni, Steven V.; Decottignies, Robert Irwin; Hruzek, Dean C.; Irwin, Peter; Merry, Nir, Linked vacuum processing tools and methods of using the same.
    상세보기
  195. Klomp,Albert Jan Hendrik; Hoogkamp,Jan Frederik; Vugts,Josephus Cornelius Johannes Antonius; Livesey,Robert Gordon; Franssen,Johannes Hendrikus Gertrudis, Lithographic projection assembly, load lock and method for transferring objects.
    상세보기
  196. Klomp, Albert Jan Hendrik; Hoogkamp, Jan Frederik; Vugts, Josephus Cornelius Johannes Antonius; Livesey, Robert Gordon; Franssen, Johannes Hendrikus Gertrudis, Load lock and method for transferring objects.
    상세보기
  197. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
    상세보기
  198. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
    상세보기
  199. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
    상세보기
  200. Thompson, David, Low temperature atomic layer deposition of films comprising SiCN or SiCON.
    상세보기
  201. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.
    상세보기
  202. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted; Chen, Liang-Yuh, Low temperature integrated metallization process and apparatus.
    상세보기
  203. Pratt, Thomas M.; McClelland, Scott Douglas; Stevens, Craig L.; Hopkins, Kerry, Magnetically coupled linear servo-drive mechanism.
    상세보기
  204. Yamazaki,Shunpei; Ohtani,Hisashi; Shimada,Hiroyuki; Sakama,Mitsunori; Abe,Hisashi; Teramoto,Satoshi, Manufacturing method of a thin film semiconductor device.
    상세보기
  205. Tanaka, Tetsuhiro, Manufacturing method of crystalline semiconductor film and manufacturing method of semiconductor device.
    상세보기
  206. Velikov Plamen ; Cameron James A., Material handling device with overcenter arms and method for use thereof.
    상세보기
  207. Ding, Peijun; Xu, Zheng; Zhang, Hong; Tang, Xianmin; Gopalraja, Praburam; Rengarajan, Suraj; Forster, John C.; Fu, Jianming; Chiang, Tony; Yao, Gongda; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y., Metal / metal nitride barrier layer for semiconductor device applications.
    상세보기
  208. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Metal air gap.
    상세보기
  209. Knapp, David; Thompson, David, Metal amide deposition precursors and their stabilization with an inert ampoule liner.
    상세보기
  210. Gardner Mark I. ; Gilmer Mark C., Metal silicide transistor gate spaced from a semiconductor substrate by a ceramic gate dielectric having a high dielectric constant.
    상세보기
  211. Adams Douglas R., Metered gas control in a substrate processing apparatus.
    상세보기
  212. Schauer,Ronald Vern; Lappen,Alan Rick; Tuttle,David L., Method and apparatus for aligning a cassette.
    상세보기
  213. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
    상세보기
  214. Rolfson J. Brett ; Hochhalter Elton, Method and apparatus for controlling rate of pressure change in a vacuum process chamber.
    상세보기
  215. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
    상세보기
  216. Xi,Ming; Sinha,Ashok; Kori,Moris; Mak,Alfred W.; Lu,Xinliang; Lai,Ken Kaung; Littau,Karl A., Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer.
    상세보기
  217. Hunter, Reginald, Method and apparatus for embedded substrate and system status monitoring.
    상세보기
  218. Hunter, Reginald, Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques.
    상세보기
  219. Zheng Xu ; Gongda Yao, Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma.
    상세보기
  220. Ahmed, Khaled Z.; Hung, Steven; Singh, Kaushal K.; Ramamurthy, Sundar, Method and apparatus for forming gate stack on Si, SiGe or Ge channels.
    상세보기
  221. Ken Ngan ; Simon Hui ; Seshadri Ramaswami, Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma.
    상세보기
  222. Ngan, Kenny King-Tai; Hui, Ying Yin; Ramaswami, Seshadri, Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma.
    상세보기
  223. Van Groos, Pieter Johannes Marius; Hoogkamp, Jan Frederik; Vugts, Josephus Cornelius Johannes Antonius; Livesey, Robert Gordon; Franssen, Johannes Hendrikus Gertrudis; Klomp, Albert Jan Hendrik; Vermeulen, Johannes Petrus Martinus Bernardus; Loopstra, Erik Roelof, Method and apparatus for maintaining a machine part.
    상세보기
  224. Reed, Joseph C; Shero, Eric J, Method and apparatus for minimizing contamination in semiconductor processing chamber.
    상세보기
  225. Hunter, Reginald, Method and apparatus for substrate surface inspection using spectral profiling techniques.
    상세보기
  226. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
    상세보기
  227. Hunter, Reginald, Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques.
    상세보기
  228. Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
    상세보기
  229. Kori, Moris; Mak, Alfred W.; Byun, Jeong Soo; Lei, Lawrence Chung-Lai; Chung, Hua, Method and system for controlling the presence of fluorine in refractory metal layers.
    상세보기
  230. Kori,Moris; Mak,Alfred W.; Byun,Jeong Soo; Lei,Lawrence Chung Lai; Chung,Hua; Sinha,Ashok; Xi,Ming, Method and system for controlling the presence of fluorine in refractory metal layers.
    상세보기
  231. Sinha,Ashok; Xi,Ming; Kori,Moris; Mak,Alfred W.; Byun,Jeong Soo; Lei,Lawrence Chung Lai; Chung,Hua, Method and system for controlling the presence of fluorine in refractory metal layers.
    상세보기
  232. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
    상세보기
  233. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
    상세보기
  234. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
    상세보기
  235. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
    상세보기
  236. Hongyong Zhang JP; Naoto Kusumoto JP, Method for annealing a semiconductor.
    상세보기
  237. Zhang Hongyong (Kanagawa JPX) Kusumoto Naoto (Kanagawa JPX), Method for annealing a semiconductor.
    상세보기
  238. Zhang Hongyong,JPX ; Kusumoto Naoto,JPX, Method for annealing a semiconductor.
    상세보기
  239. Zhang, Hongyong; Kusumoto, Naoto, Method for annealing a semiconductor.
    상세보기
  240. Pan, Heng; Rogers, Matthew Scott; Swenberg, Johanes F.; Olsen, Christopher S.; Liu, Wei; Chu, David; Bevan, Malcom J., Method for conformal treatment of dielectric films using inductively coupled plasma.
    상세보기
  241. Yamazaki,Shunpei; Zhang,Hongyong; Kusumoto,Naoto; Takemura,Yasuhiko, Method for crystallizing semiconductor material.
    상세보기
  242. Shunpei Yamazaki JP; Hongyong Zhang JP; Naoto Kusumoto JP; Yasuhiko Takemura JP, Method for crystallizing semiconductor material without exposing it to air.
    상세보기
  243. Yamazaki, Shunpei; Zhang, Hongyong; Kusumoto, Naoto; Takemura, Yasuhiko, Method for crystallizing semiconductor material without exposing it to air.
    상세보기
  244. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method for depositing a diffusion barrier layer and a metal conductive layer.
    상세보기
  245. Srinivas Gandikota ; Dennis Cong ; Liang Chen ; Sesh Ramaswami ; Daniel Carl, Method for enhancing the adhesion of copper deposited by chemical vapor deposition.
    상세보기
  246. Ionov Pavel ; Kim Sung Ho ; Li Dean,TWX ; Yan Chun ; Wang James Chang, Method for etching silicon oxynitride and dielectric antireflection coatings.
    상세보기
  247. Ionov, Pavel; Kim, Sung Ho; Li, Dean; Yan, Chun; Wang, James Chang, Method for etching silicon oxynitride and dielectric antireflection coatings.
    상세보기
  248. Ionov Pavel ; Kim Sung Ho ; Li Dean,TWX, Method for etching silicon oxynitride and inorganic antireflection coatings.
    상세보기
  249. Won, Seok-jun; Park, Soon-yeon; Yoo, Cha-young, Method for fabricating semiconductor device having ruthenium layer and equipment for fabricating the same.
    상세보기
  250. Sundarrajan Arvind ; Saigal Dinesh, Method for forming a multilayered aluminum-comprising structure on a substrate.
    상세보기
  251. Zhang, Honyong; Kusumoto, Naoto, Method for forming a semiconductor.
    상세보기
  252. Zhang, Honyong; Kusumoto, Naoto, Method for forming a semiconductor.
    상세보기
  253. Zhang,Hongyong; Kusumoto,Naoto, Method for forming a semiconductor.
    상세보기
  254. Kori, Moris; Mak, Alfred W.; Byun, Jeong Soo; Lei, Lawrence Chung-Lai; Chung, Hua, Method for forming tungsten materials during vapor deposition processes.
    상세보기
  255. Kori, Moris; Mak, Alfred W.; Byun, Jeong Soo; Lei, Lawrence Chung-Lai; Chung, Hua; Sinha, Ashok; Xi, Ming, Method for forming tungsten materials during vapor deposition processes.
    상세보기
  256. Kori,Moris; Mak,Alfred W.; Byun,Jeong Soo; Lei,Lawrence Chung Lai; Chung,Hua; Sinha,Ashok; Xi,Ming, Method for forming tungsten materials during vapor deposition processes.
    상세보기
  257. Kori,Moris; Mak,Alfred W.; Byun,Jeong Soo; Lei,Lawrence Chung Lai; Chung,Hua; Sinha,Ashok; Xi,Ming, Method for forming tungsten materials during vapor deposition processes.
    상세보기
  258. Kao, Chien-Teh; Chou, Jing-Pei (Connie); Lai, Chiukin (Steven); Umotoy, Sal; Huston, Joel M.; Trinh, Son; Chang, Mei; Yuan, Xiaoxiong (John); Chang, Yu; Lu, Xinliang; Wang, Wei W.; Phan, See-Eng, Method for front end of line fabrication.
    상세보기
  259. Kao,Chien Teh; Chou,Jing Pei (Connie); Lai,Chiukin (Steven); Umotoy,Sal; Huston,Joel M.; Trinh,Son; Chang,Mei; Yuan,Xiaoxiong (John); Chang,Yu; Lu,Xinliang; Wang,Wei W.; Phan,See Eng, Method for front end of line fabrication.
    상세보기
  260. Ye Yan ; Zhao Allen ; Hsieh Peter Chang-Lin ; Ma Diana Xiaobing, Method for high temperature etching of patterned layers using an organic mask stack.
    상세보기
  261. Xu Zheng ; Forster John ; Yao Tse-Yong, Method for low thermal budget metal filling and planarization of contacts vias and trenches.
    상세보기
  262. Ichijo, Mitsuhiro; Kuriki, Kazutaka; Yokoi, Tomokazu; Endo, Toshiya, Method for manufacturing microcrystalline semiconductor and thin film transistor.
    상세보기
  263. Reed, Joseph C.; Shero, Eric J., Method for minimizing contamination in semiconductor processing chamber.
    상세보기
  264. Yamazaki, Shunpei; Shimada, Hiroyuki; Takenouchi, Akira; Takemura, Yasuhiko, Method for processing semiconductor device apparatus for processing a semiconductor and apparatus for processing semiconductor device.
    상세보기
  265. Yamazaki Shunpei,JPX ; Shimada Hiroyuki,JPX ; Takenouchi Akira,JPX ; Takemura Yasuhiko,JPX, Method for processing semiconductor device, apparatus for processing a semiconductor and apparatus for processing semiconductor device.
    상세보기
  266. Ken Yoshioka JP; Yoshimi Torii JP; Moriaki Fuyama JP; Tomohiro Okada JP; Saburou Kanai JP; Takehito Usui JP; Hitoshi Harata JP, Method for processing specimens.
    상세보기
  267. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
    상세보기
  268. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
    상세보기
  269. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
    상세보기
  270. Tang, Xianmin; Gopalraja, Praburam; Rengarajan, Suraj; Forster, John C.; Fu, Jianming; Ding, Peijun, Method of depositing a TaN seed layer.
    상세보기
  271. Imran Hashim ; Hong-Mei Zhang ; John C. Forster, Method of depositing a copper seed layer which promotes improved feature surface coverage.
    상세보기
  272. Imran Hashim ; Hong-Mei Zhang ; John C. Forster, Method of depositing a copper seed layer which promotes improved feature surface coverage.
    상세보기
  273. Rozbicki, Robert T.; Danek, Michal; Klawuhn, Erich R., Method of depositing a diffusion barrier for copper interconnect applications.
    상세보기
  274. Rozbicki, Robert; Danek, Michal; Klawuhn, Erich, Method of depositing a diffusion barrier for copper interconnect applications.
    상세보기
  275. Rozbicki, Robert; Danek, Michal; Klawuhn, Erich, Method of depositing a diffusion barrier for copper interconnect applications.
    상세보기
  276. Yau, Wai-Fan; Cheung, David; Jeng, Shin-Puu; Liu, Kuowei; Yu, Yung-Cheng, Method of depositing a low K dielectric with organo silane.
    상세보기
  277. Yau, Wai-Fan; Cheung, David; Jeng, Shin-Puu; Liu, Kuowei; Yu, Yung-Cheng, Method of depositing a low dielectric with organo silane.
    상세보기
  278. Chiang,Tony; Yao,Gongda; Ding,Peijun; Chen,Fusen E.; Chin,Barry L.; Kohara,Gene Y.; Xu,Zheng; Zhang,Hong, Method of depositing a metal seed layer on semiconductor substrates.
    상세보기
  279. Chiang,Tony; Yao,Gongda; Ding,Peijun; Chen,Fusen E.; Chin,Barry L.; Kohara,Gene Y.; Xu,Zheng; Zhang,Hong, Method of depositing a metal seed layer on semiconductor substrates.
    상세보기
  280. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate.
    상세보기
  281. Ding,Peijun; Xu,Zheng; Zhang,Hong; Tang,Xianmin; Gopalraja,Praburam; Rengarajan,Suraj; Forster,John C.; Fu,Jianming; Chiang,Tony; Yao,Gongda; Chen,Fusen E.; Chin,Barry L.; Kohara,Gene Y., Method of depositing a tantalum nitride/tantalum diffusion barrier layer system.
    상세보기
  282. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features.
    상세보기
  283. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features.
    상세보기
  284. Huang, Tzu-Fang; Lu, Yung-Cheng; Xia, Li-Qun; Yieh, Ellie; Yau, Wai-Fan; Cheung, David W.; Willecke, Ralf B.; Liu, Kuowei; Lee, Ju-Hyung; Moghadam, Farhad K.; Ma, Yeming Jim, Method of depositing low K films.
    상세보기
  285. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
    상세보기
  286. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
    상세보기
  287. Gaillard, Frederic; Xia, Li-Qun; Yieh, Ellie; Fisher, Paul; Nemani, Srinivas D., Method of depositing organosillicate layers.
    상세보기
  288. Yan Ye ; Pavel Ionov ; Allen Zhao ; Peter Hsieh ; Diana Ma ; Chun Yan ; Jie Yuan, Method of etching dielectric layers using a removable hardmask.
    상세보기
  289. Ye Yan ; Ionov Pavel ; Zhao Allen ; Hsieh Peter Chang-Lin ; Ma Diana Xiaobing ; Yan Chun ; Yuan Jie, Method of etching patterned layers useful as masking during subsequent etching or for damascene structures.
    상세보기
  290. Nallan, Padmapani; Zhang, Tong, Method of etching titanium nitride.
    상세보기
  291. Yamazaki,Shunpei, Method of fabricating an EL display device, and apparatus for forming a thin film.
    상세보기
  292. Yamazaki Shunpei,JPX ; Takenouchi Akira,JPX ; Takemura Yasuhiko,JPX, Method of fabricating thin film transistor.
    상세보기
  293. Ko, Jungmin, Method of fin patterning.
    상세보기
  294. Ngan Kenny King-tai ; Hogan Barry ; Ramaswami Seshadri, Method of forming a barrier layer which enables a consistently highly oriented crystalline structure in a metallic inte.
    상세보기
  295. Imahashi Issei,JPX ; Hama Kiichi,JPX ; Hata Jiro,JPX, Method of forming polycrystalline silicon film in process of manufacturing LCD.
    상세보기
  296. Yamazaki, Shunpei; Ohtani, Hisashi; Shimada, Hiroyuki; Sakama, Mitsunori; Abe, Hisashi; Teramoto, Satoshi, Method of manufacturing a semiconductor device.
    상세보기
  297. Yamazaki,Shunpei; Ohtani,Hisashi; Shimada,Hiroyuki; Sakama,Mitsunori; Abe,Hisashi; Teramoto,Satoshi, Method of manufacturing a semiconductor device.
    상세보기
  298. Zhao Ganming,JPX ; Chinn Jeffrey D., Method of obtaining a rounded top trench corner for semiconductor trench etch applications.
    상세보기
  299. Ye Yan ; Ionov Pavel ; Zhao Allen ; Hsieh Peter Chang-Lin ; Ma Diana Xiaobing ; Yan Chun ; Yuan Jie, Method of pattern etching a low K dielectric layer.
    상세보기
  300. Chen Tsan Ying ; Jeng H. Hwang ; Hideyuki Yamauchi JP; Seayoul Park JP; Yohei Kawase JP, Method of patterning lead zirconium titanate and barium strontium titanate.
    상세보기
  301. Hwang, Jeng H.; Chen, Xiaoyi, Method of plasma heating and etching a substrate.
    상세보기
  302. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method of preventing diffusion of copper through a tantalum-comprising barrier layer.
    상세보기
  303. Ngan Kenny K., Method of reducing generation of particulate matter in a sputtering chamber.
    상세보기
  304. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
    상세보기
  305. Wang, Jean; Yang, Chia Ming; Lo, Henry; Tseng, Joshua, Method to implement stress free polishing.
    상세보기
  306. Yim,Kang Sub; Chan,Kelvin; Rajagopalan,Nagarajan; Liu,Josephine Ju Hwei Chang; Ahn,Sang H.; Zheng,Yi; Yi,Sang In; Nguyen,Vu Ngoc Tran; Demos,Alexandros T., Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers.
    상세보기
  307. Jaim Nulman, Methods and apparatus for forming and maintaining high vacuum environments.
    상세보기
  308. Ahmed, Khaled Z., Methods and apparatus for forming silicon passivation layers on germanium or III-V semiconductor devices.
    상세보기
  309. Ghanayem Steve G. ; Chandrachood Madhavi, Methods and apparatus for reducing particle contamination during wafer transport.
    상세보기
  310. Li, Zihui; Kao, Chia-Ling; Wang, Anchuan; Ingle, Nitin K., Methods for anisotropic control of selective silicon removal.
    상세보기
  311. Chu, Schubert; Ping, Er-Xuan; Senzaki, Yoshihide, Methods for depositing oxygen deficient metal films.
    상세보기
  312. Lai, Ken Kaung; Rajagopalan, Ravi; Khandelwal, Amit; Moorthy, Madhu; Gandikota, Srinivas; Castro, Joseph; Gelatos, Avgerinos V.; Knepfler, Cheryl; Jian, Ping; Fang, Hongbin; Huang, Chao-Ming; Xi, Ming; Yang, Michael X.; Chung, Hua; Byun, Jeong Soo, Methods for depositing tungsten layers employing atomic layer deposition techniques.
    상세보기
  313. Lai,Ken Kaung; Rajagopalan,Ravi; Khandelwal,Amit; Moorthy,Madhu; Gandikota,Srinivas; Castro,Joseph; Gelatos,Averginos V.; Knepfler,Cheryl; Jian,Ping; Fang,Hongbin; Huang,Chao Ming; Xi,Ming; Yang,Michael X.; Chung,Hua; Byun,Jeong Soo, Methods for depositing tungsten layers employing atomic layer deposition techniques.
    상세보기
  314. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of SiN films.
    상세보기
  315. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of metal and metal-oxide films.
    상세보기
  316. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.
    상세보기
  317. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of sin films.
    상세보기
  318. Thompson, David; Anthis, Jeffrey W., Methods for the deposition of manganese-containing films using diazabutadiene-based precursors.
    상세보기
  319. Thompson, David; Anthis, Jeffrey W., Methods of depositing a metal alloy film.
    상세보기
  320. Nainani, Aneesh; Abraham, Mathew; Ping, Er-Xuan, Methods of doping substrates with ALD.
    상세보기
  321. Nainani, Aneesh; Abraham, Mathew; Ping, Er-Xuan, Methods of doping substrates with ALD.
    상세보기
  322. Anthis, Jeffrey W.; Schmiege, Benjamin; Thompson, David, Methods of etching films comprising transition metals.
    상세보기
  323. Anthis, Jeffrey W.; Schmiege, Benjamin; Thompson, David, Methods of etching films comprising transition metals.
    상세보기
  324. Hong, Sukwon; Hamana, Hiroshi; Liang, Jingmei, Methods of reducing substrate dislocation during gapfill processing.
    상세보기
  325. Thompson, David; Dai, Huixiong; Martin, Patrick M.; Michaelson, Timothy; Narendrnath, Kadthala R.; Visser, Robert Jan; Xu, Jingjing; Zhang, Lin, Methods of selective layer deposition.
    상세보기
  326. Leveen Lindsay, Microelectronic component fabrication facility, and process for making and using the facility.
    상세보기
  327. Bright Nick ; Mooring Ben, Modular architecture for semiconductor wafer fabrication equipment.
    상세보기
  328. Washburn Hudson A. ; Hamilton Jarrett L., Modular deposition system having batch processing and serial thin film deposition.
    상세보기
  329. Tepman Avi, Monolith processing system platform.
    상세보기
  330. Mohn,Jonathan D.; Helmsen,John J.; Barnes,Michael, Multi-purpose processing chamber with removable chamber liner.
    상세보기
  331. Mullapudi, Ravi; Smith, Dean; Strepka, Edward; Dasaradhi, Srikanth, Multi-station sputtering and cleaning system.
    상세보기
  332. Heyder Roger V. ; Brezocsky Thomas B. ; Davenport Robert E., Multiple loadlock system.
    상세보기
  333. Roger V. Heyder ; Thomas B. Brezocsky ; Robert E. Davenport, Multiple loadlock system.
    상세보기
  334. Yang, Michael Xi; Yoon, Hyungsuk Alexander; Zhang, Hui; Fang, Hongbin; Xi, Ming, Multiple precursor cyclical deposition system.
    상세보기
  335. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
    상세보기
  336. Kim, Bok Hoen; Rathi, Sudha; Ahn, Sang H.; Bencher, Christopher D.; Wang, Yuxiang May; M'Saad, Hichem; Silvetti, Mario D.; Fung, Miguel; Jung, Keebum; Zhu, Lei, Nitrogen-free dielectric anti-reflective coating and hardmask.
    상세보기
  337. Kim,Bok Hoen; Rathi,Sudha; Ahn,Sang H.; Bencher,Christopher D.; Wang,Yuxiang May; M'Saad,Hichem; Silvetti,Mario D., Nitrogen-free dielectric anti-reflective coating and hardmask.
    상세보기
  338. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
    상세보기
  339. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
    상세보기
  340. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
    상세보기
  341. Hunter, Reginald, Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems.
    상세보기
  342. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.
    상세보기
  343. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
    상세보기
  344. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
    상세보기
  345. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.
    상세보기
  346. Lubomirsky, Dmitry, Oxygen compatible plasma source.
    상세보기
  347. Kim Edwin ; Nam Michael ; Cha Chris ; Yao Gongda ; Lee Sophia ; Dorleans Fernand ; Kohara Gene Y. ; Fu Jianming, Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers.
    상세보기
  348. Nguyen, Victor; Lee, Woong Jae; Balseanu, Mihaela; Xia, Li-Qun; Witty, Derek R., PEALD of films comprising silicon nitride.
    상세보기
  349. Hunter, Reginald, Particle detection and embedded vision system to enhance substrate yield and throughput.
    상세보기
  350. Hunter, Reginald; Tsadka, Sagie, Particle detection and embedded vision system to enhance substrate yield and throughput.
    상세보기
  351. Yang, Haichun; Lu, Xinliang; Kao, Chien-Teh; Chang, Mei, Passivation layer formation by plasma clean process to reduce native oxide growth.
    상세보기
  352. Ye Yan ; Ma Diana Xiaobing ; Yin Gerald, Patterned copper etch for micron and submicron features, using enhanced physical bombardment.
    상세보기
  353. Chen, Xinglong; Yang, Jang-Gyoo; Tam, Alexander; Tam, Elisha, Pedestal with multi-zone temperature control and multiple purge capabilities.
    상세보기
  354. Arvind Sundarrajan ; Dinesh Saigal, Physical vapor deposition apparatus with deposition and DC target power control.
    상세보기
  355. Shunpei Yamazaki JP; Toru Takayama JP; Mitsunori Sakama JP; Hisashi Abe JP; Hiroshi Uehara JP; Mika Ishiwata JP, Plasma CVD apparatus.
    상세보기
  356. Yamazaki Shunpei,JPX ; Takayama Toru,JPX ; Sakama Mitsunori,JPX ; Abe Hisashi,JPX ; Uehara Hiroshi,JPX ; Ishiwata Mika,JPX, Plasma CVD apparatus.
    상세보기
  357. Yamazaki, Shunpei; Takayama, Toru; Sakama, Mitsunori; Abe, Hisashi; Uehara, Hiroshi; Ishiwata, Mika, Plasma CVD apparatus.
    상세보기
  358. Yamazaki, Shunpei; Takayama, Toru; Sakama, Mitsunori; Abe, Hisashi; Uehara, Hiroshi; Ishiwata, Mika, Plasma CVD apparatus.
    상세보기
  359. Yamazaki, Shunpei; Takayama, Toru; Sakama, Mitsunori; Abe, Hisashi; Uehara, Hiroshi; Ishiwata, Mika, Plasma CVD apparatus.
    상세보기
  360. Hwang, Jeng H.; Chen, Xiaoyi, Plasma heating of a substrate with subsequent high temperature etching.
    상세보기
  361. Cheung, David; Yau, Wai-Fan; Mandal, Robert P.; Jeng, Shin-Puu; Liu, Kuo-Wei; Lu, Yung-Cheng; Barnes, Michael; Willecke, Ralf B.; Moghadam, Farhad; Ishikawa, Tetsuya; Poon, Tze Wing, Plasma processes for depositing low dielectric constant films.
    상세보기
  362. Cheung, David; Yau, Wai-Fan; Mandal, Robert P.; Jeng, Shin-Puu; Liu, Kuo-Wei; Lu, Yung-Cheng; Barnes, Michael; Willecke, Ralf B.; Moghadam, Farhad; Ishikawa, Tetsuya; Poon, Tze Wing, Plasma processes for depositing low dielectric constant films.
    상세보기
  363. Lubomirsky, Dmitry, Plasma processing system with direct outlet toroidal plasma source.
    상세보기
  364. Lee, Wei Ti; Guo, Ted, Plasma-enhanced chemical vapor deposition of a metal nitride layer.
    상세보기
  365. Yang, Michael X.; Itoh, Toshio; Xi, Ming, Plasma-enhanced cyclic layer deposition process for barrier layers.
    상세보기
  366. Yang,Michael X.; Itoh,Toshio; Xi,Ming, Plasma-enhanced cyclic layer deposition process for barrier layers.
    상세보기
  367. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Plasma-free metal etch.
    상세보기
  368. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Polarity control for remote plasma.
    상세보기
  369. Choi, Tom; Ko, Jungmin; Kang, Sean, Poly directional etch by oxidation.
    상세보기
  370. Ye Yan ; Zhao Xiaoye ; Hsieh Chang-Lin ; Deng Xian-Can,CNX ; Tu Wen-Chiang ; Chu Chung-Fu ; Ma Diana Xiaobing, Post-etch treatment of plasma-etched feature surfaces to prevent corrosion.
    상세보기
  371. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
    상세보기
  372. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
    상세보기
  373. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
    상세보기
  374. Todd Craig B. ; Yu James E., Process chamber lid.
    상세보기
  375. Kim Daehwan D., Process chamber tray.
    상세보기
  376. Song, Kevin; Ravi, Jallepally; Li, Shih-Hung; Chen, Liang-Yuh, Process conditions and precursors for atomic layer deposition (ALD) of AL2O3.
    상세보기
  377. Wuester,Christopher D., Process flow thermocouple.
    상세보기
  378. Ye Yan ; Ma Diana Xiaobing, Process for copper etch back.
    상세보기
  379. Ganguli, Seshadri; Yu, Sang-Ho; Phan, See-Eng; Chang, Mei; Khandelwal, Amit; Ha, Hyoung-Chan, Process for forming cobalt and cobalt silicide materials in tungsten contact applications.
    상세보기
  380. Ganguli, Seshadri; Yu, Sang-Ho; Phan, See-Eng; Chang, Mei; Khandelwal, Amit; Ha, Hyoung-Chan, Process for forming cobalt and cobalt silicide materials in tungsten contact applications.
    상세보기
  381. Ganguli, Seshadri; Chu, Schubert S.; Chang, Mei; Yu, Sang-Ho; Moraes, Kevin; Phan, See-Eng, Process for forming cobalt-containing materials.
    상세보기
  382. Hahn,Jens; Schmidbauer,Sven, Process for producing aluminum-filled contact holes.
    상세보기
  383. Saeki, Hiroaki; Matsushima, Keiichi; Asakawa, Teruo; Narushima, Masaki, Processing apparatus.
    상세보기
  384. Matsushita, Minoru; Kodashima, Yasushi; Kumai, Toshikazu, Processing apparatus, transferring apparatus and transferring method.
    상세보기
  385. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  386. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  387. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  388. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  389. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  390. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  391. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  392. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
    상세보기
  393. Bluck, Terry; Scollay, Stuart; Tong, Edric, Processing thin wafers.
    상세보기
  394. Bluck, Terry; Scollay, Stuart; Tong, Edric, Processing thin wafers.
    상세보기
  395. Ye, Mengqi; Liu, Zhendong; Ding, Peijun, Protective offset sputtering.
    상세보기
  396. Ye, Mengqi; Liu, Zhendong; Ding, Peijun, Protective offset sputtering.
    상세보기
  397. Naik, Mehul; Ma, Paul F.; Nemani, Srinivas D., Protective via cap for improved interconnect performance.
    상세보기
  398. Lu, Xinliang; Jian, Ping; Yoo, Jong Hyun; Lai, Ken Kaung; Mak, Alfred W.; Jackson, Robert L.; Xi, Ming, Pulsed deposition process for tungsten nucleation.
    상세보기
  399. Lu,Xinliang; Jian,Ping; Yoo,Jong Hyun; Lai,Ken Kaung; Mak,Alfred W.; Jackson,Robert L.; Xi,Ming, Pulsed nucleation deposition of tungsten layers.
    상세보기
  400. Dunn, Todd; White, Carl; Halpin, Mike; Shero, Eric; Terhorst, Herbert; Winkler, Jerry, Pulsed valve manifold for atomic layer deposition.
    상세보기
  401. Sugiyama, Toru; Nakano, Ryu, Purge step-controlled sequence of processing semiconductor wafers.
    상세보기
  402. Blonigan, Wendell T.; Sorensen, Carl A., RF matching network with distributed outputs.
    상세보기
  403. Wendell T. Blonigan ; Carl A. Sorensen, RF matching network with distributed outputs.
    상세보기
  404. Bera, Kallol, RF multi-feed structure to improve plasma uniformity.
    상세보기
  405. Bera, Kallol, RF multi-feed structure to improve plasma uniformity.
    상세보기
  406. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  407. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  408. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  409. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
    상세보기
  410. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
    상세보기
  411. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
    상세보기
  412. Pomarede, Christophe; Shero, Eric J.; Jylhä, Olli, Reduced cross-contamination between chambers in a semiconductor processing tool.
    상세보기
  413. Pomarede,Christophe; Shero,Eric J.; Jylh채,Olli, Reduced cross-contamination between chambers in a semiconductor processing tool.
    상세보기
  414. Komino Mitsuaki,JPX, Reduced pressure and normal pressure treatment apparatus.
    상세보기
  415. Chung,Hua; Ganguli,Seshadri; Marcadal,Christophe; Yu,Jick M., Reduction of copper dewetting by transition metal deposition.
    상세보기
  416. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Remotely-excited fluorine and water vapor etch.
    상세보기
  417. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
    상세보기
  418. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
    상세보기
  419. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
    상세보기
  420. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
    상세보기
  421. van Gogh James, Resistive heating of powered coil to reduce transient heating/start up effects multiple loadlock system.
    상세보기
  422. Higashi Kumiko (Kumamoto JPX), Rotary type apparatus for processing semiconductor wafers and method of processing semiconductor wafers.
    상세보기
  423. Yang, Dongqing; Zhu, Lala; Wang, Fei; Ingle, Nitin K., Saving ion-damaged spacers.
    상세보기
  424. Chen, Zhijun; Huang, Jiayin; Wang, Anchuan; Ingle, Nitin, Selective SiN lateral recess.
    상세보기
  425. Wang, Xikun; Lei, Jianxin; Ingle, Nitin; Shaviv, Roey, Selective cobalt removal for bottom up gapfill.
    상세보기
  426. Lam, Andrew; Kim, Yihwan, Selective epitaxy process control.
    상세보기
  427. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
    상세보기
  428. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
    상세보기
  429. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
    상세보기
  430. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
    상세보기
  431. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
    상세보기
  432. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
    상세보기
  433. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
    상세보기
  434. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
    상세보기
  435. Citla, Bhargav; Ying, Chentsau; Nemani, Srinivas; Babayan, Viachslav; Stowell, Michael, Selective etch using material modification and RF pulsing.
    상세보기
  436. Ye, Zhiyuan; Chopra, Saurabh; Lam, Andrew; Kim, Yihwan, Selective formation of silicon carbon epitaxial layer.
    상세보기
  437. Wang, Xikun; Ingle, Nitin, Selective in situ cobalt residue removal.
    상세보기
  438. Hoinkis, Mark; Miyazoe, Hiroyuki; Joseph, Eric, Selective sputtering for pattern transfer.
    상세보기
  439. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and nitrogen.
    상세보기
  440. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and oxygen.
    상세보기
  441. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
    상세보기
  442. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
    상세보기
  443. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
    상세보기
  444. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
    상세보기
  445. Wang, Xikun; Ingle, Nitin, Selective tungsten removal.
    상세보기
  446. Pandit, Mandar B.; Wang, Anchuan; Ingle, Nitin K., Self-aligned process.
    상세보기
  447. Gopalraja, Praburam; Fu, Jianming; Tang, Xianmin; Forster, John C.; Kelkar, Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
    상세보기
  448. Gopalraja,Praburam; Fu,Jianming; Tang,Xianmin; Forster,John C.; Kelkar,Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
    상세보기
  449. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  450. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  451. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  452. Arnepalli, Ranga Rao; Goradia, Prerna Sonthalia; Visser, Robert Jan; Ingle, Nitin; Korolik, Mikhail; Biswas, Jayeeta; Lodha, Saurabh, Self-limiting atomic thermal etching systems and methods.
    상세보기
  453. Xu Zheng ; Forster John ; Yao Tse-Yong, Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches.
    상세보기
  454. Trivedi, Mayur; Padiyar, Sushil; Karuppiah, Lakshmanan; Thakur, Randhir, Semiconductor device processing tools and methods for patterning substrates.
    상세보기
  455. Kawamura Yoshio,JPX ; Kashima Hideo,JPX ; Moriyama Shigeo,JPX, Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing.
    상세보기
  456. Kawamura Yoshio,JPX ; Kashima Hideo,JPX ; Moriyama Shigeo,JPX, Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device.
    상세보기
  457. Yamagishi, Takayuki; Suwada, Masaei; Watanabe, Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
    상세보기
  458. Yamagishi,Takayuki; Suwada,Masaei; Watanabe,Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
    상세보기
  459. Narushima,Masaki; Saeki,Hiroaki, Semiconductor processing system.
    상세보기
  460. Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Semiconductor processing systems having multiple plasma configurations.
    상세보기
  461. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
    상세보기
  462. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
    상세보기
  463. Sanchez, Errol Antonio C.; Carlson, David K.; Kuppurao, Satheesh, Semiconductor substrate processing system.
    상세보기
  464. Nguyen, Andrew; Ramaswamy, Kartik; Nemani, Srinivas; Howard, Bradley; Vishwanath, Yogananda Sarode, Semiconductor system assemblies and methods of operation.
    상세보기
  465. Wang,Hougong; Ngan,Kenny King Tai; Xu,Zheng, Semiconductor wafer preheating.
    상세보기
  466. Huston, Joel M., Showerhead assembly.
    상세보기
  467. Ko, Jungmin; Choi, Tom; Ingle, Nitin; Kim, Kwang-Soo; Wou, Theodore, SiN spacer profile patterning.
    상세보기
  468. Van Zeghbroeck,Bart J.; Torvik,John T., Silicon carbide semiconductor devices with a regrown contact layer.
    상세보기
  469. Park, Seung; Wang, Anchuan, Silicon etch process with tunable selectivity to SiO2 and other materials.
    상세보기
  470. Korolik, Mikhail; Ingle, Nitin K.; Wang, Anchuan; Xu, Jingjing, Silicon germanium processing.
    상세보기
  471. Nistler John L., Silicon implantation into selective areas of a refractory metal to reduce consumption of silicon-based junctions during salicide formation.
    상세보기
  472. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Silicon oxide selective removal.
    상세보기
  473. Huang, Jiayin; Chen, Zhijun; Wang, Anchuan; Ingle, Nitin, Silicon pretreatment for nitride removal.
    상세보기
  474. Li, Zihui; Hsu, Ching-Mei; Zhang, Hanshen; Zhang, Jingchun, Silicon selective removal.
    상세보기
  475. Chen, Zhijun; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Silicon-carbon-nitride selective etch.
    상세보기
  476. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.
    상세보기
  477. Glenn, W. Benjamin; Verplancken, Donald J., Simultaneous cyclical deposition in different processing regions.
    상세보기
  478. Kroeker, Tony, Single wafer load lock with internal wafer transport.
    상세보기
  479. Luere, Olivier; Kang, Sean S.; Nemani, Srinivas D., Spacer formation.
    상세보기
  480. Yudovsky, Joseph, Spring-loaded pins for susceptor assembly and processing methods using same.
    상세보기
  481. Kim Edwin ; Nam Michael ; Cha Chris ; Yao Gongda ; Lee Sophia ; Dorleans Fernand ; Kohara Gene Y. ; Fu Jianming, Sputter deposited barrier layers.
    상세보기
  482. Chiang Tony ; Ding Peijun ; Chin Barry L., Sputtering methods for depositing stress tunable tantalum and tantalum nitride films.
    상세보기
  483. Borden, Peter G., Stacked load-lock apparatus and method for high throughput solar cell manufacturing.
    상세보기
  484. Tony Chiang ; Peijun Ding ; Barry L. Chin ; Bingxi Sun, Stress tunable tantalum and tantalum nitride films.
    상세보기
  485. Ding Peijun ; Hashim Imran ; Chin Barry L., Structure and method for improving low temperature copper reflow in semiconductor features.
    상세보기
  486. Peijun Ding ; Imran Hashim ; Barry L. Chin, Structure for improving low temperature copper reflow in semiconductor features.
    상세보기
  487. Saly, Mark; Thompson, David, Substituted silacyclopropane precursors and their use for the deposition of silicon-containing films.
    상세보기
  488. Saly, Mark; Thompson, David, Substituted silacyclopropane precursors and their use for the deposition of silicon-containing films.
    상세보기
  489. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
    상세보기
  490. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
    상세보기
  491. Rogelstad, Terrance R., Substrate cooldown chamber.
    상세보기
  492. Yamazaki, Shunpei; Ohtani, Hisashi; Shimada, Hiroyuki; Sakama, Mitsunori; Abe, Hisashi; Teramoto, Satoshi, Substrate processing apparatus and a manufacturing method of a thin film semiconductor device.
    상세보기
  493. Shunpei Yamazaki JP; Hisashi Ohtani JP; Hiroyuki Shimada JP; Mitsunori Sakama JP; Hisashi Abe JP; Satoshi Teramoto JP, Substrate processing apparatus and method and a manufacturing method of a thin film semiconductor device.
    상세보기
  494. Yonemitsu Shuji,JPX ; Karino Toshikazu,JPX ; Yoshida Hisashi,JPX ; Watahiki Shinichiro,JPX ; Yoshida Yuji,JPX ; Shimura Hideo,JPX ; Sugimoto Takeshi,JPX ; Aburatani Yukinori,JPX ; Ikeda Kazuhito,JPX, Substrate processing apparatus with a processing chamber, transfer chamber, intermediate holding chamber, and an atmospheric pressure section.
    상세보기
  495. Yonemitsu Shuji,JPX ; Karino Toshikazu,JPX ; Yoshida Hisashi,JPX ; Watahiki Shinichiro,JPX ; Yoshida Yuji,JPX ; Shimura Hideo,JPX ; Sugimoto Takeshi,JPX ; Aburatani Yukinori,JPX ; Ikeda Kazuhito,JPX, Substrate transferring mechanism.
    상세보기
  496. Xi, Ming; Yang, Michael; Zhang, Hui, System and method for forming an integrated barrier layer.
    상세보기
  497. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
    상세보기
  498. Nagashima, Makoto, Systems and methods for magnetron deposition.
    상세보기
  499. Ding, Peijun; Chiang, Tony; Chin, Barry L., Tailored barrier layer which provides improved copper interconnect electromigration resistance.
    상세보기
  500. Jingang Su ; Gongda Yao ; Zhang Xu ; Fusen Chen, Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect.
    상세보기
  501. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.
    상세보기
  502. Ye, Mengqi; Ding, Peijun; Wang, Hougong; Liu, Zhendong, Thin film deposition.
    상세보기
  503. Kenny King-tai Ngan ; Seshadri Ramaswami, Ti/Tinx underlayer which enables a highly <111> oriented aluminum interconnect.
    상세보기
  504. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.
    상세보기
  505. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.
    상세보기
  506. Tepman Avi, Transfer chamber.
    상세보기
  507. Kurita, Shinichi; Beer, Emanuel; Nguyen, Hung T.; Blonigan, Wendell T., Transfer chamber for vacuum processing system.
    상세보기
  508. Schaller, Jason, Transfer chamber with vacuum extension for shutter disks.
    상세보기
  509. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
    상세보기
  510. Gardner Mark I. ; Fulford ; Jr. H. Jim ; May Charles E., Transistor having a nitrogen incorporated epitaxially grown gate dielectric and method of making same.
    상세보기
  511. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
    상세보기
  512. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
    상세보기
  513. Wu, Kai; Yu, Sang Ho, Tungsten deposition with tungsten hexafluoride (WF6) etchback.
    상세보기
  514. Wang, Shulin; Kroemer, Ulrich; Luo, Lee; Chen, Aihua; Li, Ming, Tungsten nitride atomic layer deposition processes.
    상세보기
  515. Wang,Shulin; Kroemer,Ulrich; Luo,Lee; Chen,Aihua; Li,Ming, Tungsten nitride atomic layer deposition processes.
    상세보기
  516. Liu, Jie; Wang, Xikun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Tungsten oxide processing.
    상세보기
  517. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.
    상세보기
  518. Edwards Richard C., Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor.
    상세보기
  519. Yim,Kang Sub; Zheng,Yi; Nemani,Srinivas D.; Xia,Li Qun; Hollar,Eric P., Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD).
    상세보기
  520. Tony Chiang ; Peijun Ding ; Barry Chin, Ultra-low resistivity tantalum films and methods for their deposition.
    상세보기
  521. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.
    상세보기
  522. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
    상세보기
  523. Fukasawa Yoshio (Kofu JPX) Hosoda Shozo (Yamanashi-ken JPX) Nakagome Tatsuya (Yamanashi-ken JPX) Tozawa Takashi (Yamanashi-ken JPX) Suzuki Koji (Yamanashi-ken JPX) Ishihara Yasumasa (Kofu JPX) Aoyagi, Vacuum process apparatus and vacuum processing method.
    상세보기
  524. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
    상세보기
  525. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
    상세보기
  526. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
    상세보기
  527. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
    상세보기
  528. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
    상세보기
  529. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
    상세보기
  530. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
    상세보기
  531. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
    상세보기
  532. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  533. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  534. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  535. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  536. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  537. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
    상세보기
  538. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
    상세보기
  539. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
    상세보기
  540. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
    상세보기
  541. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
    상세보기
  542. Lee Hideki (Nirasaki JPX), Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus.
    상세보기
  543. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
    상세보기
  544. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
    상세보기
  545. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
    상세보기
  546. Lu, Siqing; Chang, Yu; Sun, Dongxi; Dang, Vinh; Yang, Michael X.; Chang, Anzhong; Nguyen, Anh N.; Xi, Ming, Valve control system for atomic layer deposition chamber.
    상세보기
  547. Lu,Siqing; Chang,Yu; Sun,Dongxi; Dang,Vinh; Yang,Michael X.; Chang,Anzhong (Andrew); Nguyen,Anh N.; Xi,Ming, Valve control system for atomic layer deposition chamber.
    상세보기
  548. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.
    상세보기
  549. Lee, Sang-Hyeob; Gelatos, Avgerinos V.; Wu, Kai; Khandelwal, Amit; Marshall, Ross; Renuart, Emily; Lai, Wing-Cheong Gilbert; Lin, Jing, Vapor deposition of tungsten materials.
    상세보기
  550. White, Carl L.; Shero, Eric, Vapor flow control apparatus for atomic layer deposition.
    상세보기
  551. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.
    상세보기
  552. Coxon, Peter, Work piece transfer mechanisms.
    상세보기
  553. Ferrara, Joseph, Work-piece processing system.
    상세보기
  554. Ferrara,Joseph, Work-piece processing system.
    상세보기

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