이 특허를 인용한 특허 (171) 인용/피인용 타임라인 분석

1. Guckel Henry ; Emmerich Harald,DEX ; Klein Jonathan L., Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts.

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2. Tang,Cha Mei; Makarova,Olga V., Anti-scatter grids and collimator designs, and their motion, fabrication and assembly.

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3. Tang,Cha Mei; Makarova,Olga V., Anti-scatter grids and collimator designs, and their motion, fabrication and assembly.

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4. Cohen, Adam L., Apparatus for electrochemical fabrication using a conformable mask.

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5. Fischer, Kevin J.; Guckel, Henry; Gianchandani, Yogesh B., Bi-directional micromechanical latching linear actuator.

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6. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

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7. Chen, Richard T.; Kruglick, Ezekiel J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

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8. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.

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9. Alfredo Martin Morales ; Linda A. Domeier, Cantilevered multilevel LIGA devices and methods.

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10. Domeier, Linda A.; Morales, Alfredo M.; Gonzales, Marcela G.; Keifer, Patrick M., Castable plastic mold with electroplatable base.

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11. Bang,Christopher A.; Cohen,Adam L.; Lockard,Michael S.; Evans,John D., Complex microdevices and apparatus and methods for fabricating such devices.

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12. Morales,Alfredo Martin; Domeier,Linda A.; Gonzales,Marcela G.; Keifer,Patrick N.; Garino,Terry Joseph, Compliant cantilevered micromold.

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13. Miles, Mark W.; Batey, John; Chui, Clarence; Kothari, Manish; Tung, Ming-Hau, Controlling electromechanical behavior of structures within a microelectromechanical systems device.

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14. Schmitz, Gregory P.; Lockard, Michael S.; Wu, Ming-Ting; Miller, Eric C.; Cohen, Adam L., Counterfeiting deterrent and security devices, systems and methods.

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15. Schmitz, Gregory P.; Lockard, Michael S.; Wu, Ming-Ting; Miller, Eric C.; Cohen, Adam L., Counterfeiting deterrent and security devices, systems, and methods.

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16. Garcia Ernest J., Device and method for redirecting electromagnetic signals.

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17. Miles, Mark W., Device for modulating light with multiple electrodes.

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18. Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.

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19. Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.

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20. Cohen, Adam L., Discrete or continuous tissue capture device and method for making.

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21. Cohen, Adam L., Discrete or continuous tissue capture device and method for making.

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22. Lembrikov, Pavel B.; Smalley, Dennis R.; Cohen, Adam L., Electrochemical fabrication method for producing multi-layer three-dimensional structures on a porous dielectric.

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23. Cohen, Adam L.; Arat, Vacit; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication method including elastic joining of structures.

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24. Cohen, Adam L.; Arat, Vacit; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication method including elastic joining of structures.

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25. Cohen,Adam L.; Smalley,Dennis R.; Lockard,Michael S.; Le,Qui T., Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures.

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26. Cohen,Adam L.; Smalley,Dennis R.; Lockard,Michael S.; Le,Qui T., Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures.

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27. Cohen, Adam L.; Lockard, Michael S.; Kim, Kieun; Le, Qui T.; Zhang, Gang; Frodis, Uri; McPherson, Dale S.; Smalley, Dennis R., Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates.

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28. Cohen, Adam L.; Lockard, Michael S.; Kim, Kieun; Le, Qui T.; Zhang, Gang; Frodis, Uri; McPherson, Dale S.; Smalley, Dennis R., Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates.

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29. Cohen, Adam L.; Lockard, Michael S.; Kim, Kieun; Le, Qui T.; Zhang, Gang; Frodis, Uri; McPherson, Dale S.; Smalley, Dennis R., Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates.

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30. Lockard,Michael S.; Smalley,Dennis R., Electrochemical fabrication methods using transfer plating of masks.

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31. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.

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32. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.

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33. Arat,Vacit; Cohen,Adam L.; Smalley,Dennis R.; Kruglick,Ezekiel J. J.; Chen,Richard T.; Kim,Kieun, Electrochemically fabricated microprobes.

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34. Thompson,Jeffrey A.; Cohen,Adam L.; Lockard,Michael S.; Smalley,Dennis R., Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures.

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35. Miles, Mark W.; Batey, John; Chui, Clarence; Kothari, Manish, Electromechanical devices having etch barrier layers.

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36. Smalley, Dennis R.; Lockard, Michael S.; Cohen, Adam L., Enhanced methods for at least partial in situ release of sacrificial material from cavities or channels and/or sealing of etching holes during fabrication of multi-layer microscale or millimeter-scale complex three-dimensional structures.

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37. Morales Alfredo Martin ; Zhang Z. John ; Chinn Douglas, Fabrication of ceramic microstructures from polymer compositions containing ceramic nanoparticles.

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38. Alfredo M. Morales ; Michael R. Winter ; Linda A. Domeier ; Shawn M. Allan ; Dawn M. Skala, Fabrication of metallic microstructures by micromolding nanoparticles.

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39. Cohen, Adam L.; Arat, Vacit; Lockard, Michael S.; Bang, Christopher A.; Lembrikov, Pavel B., Fabrication process for co-fabricating multilayer probe array and a space transformer.

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40. Namburi, Laksmi; Losey, Matt; Cros, Florent, Fine pitch microelectronic contact array and method of making same.

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41. Schmitz,Felix; Nienhaus,Matthias; Lacher,Manfred, Flat coil and lithographic method for producing microcomponents.

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42. Guckel Henry (Madison WI) Christenson Todd R. (Madison WI) Skrobis Kenneth (Madison WI), Formation of microstructures using a preformed photoresist sheet.

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43. Donders Adrianus P. ; Ryan Terence G. ; Weijand Keon J.,NLX ; Wiklund Craig, Implantable medical device and method of manufacture.

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44. Kohler,Stewart M.; Allen,James J., Inertial measurement unit using rotatable MEMS sensors.

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45. Kohler,Stewart M.; Allen,James J., Inertial measurement unit using rotatable MEMS sensors.

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46. Lasiter, Jon Bradley, Interconnect structure for MEMS device.

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47. Guckel Henry ; Mangat Pawitterjit S., Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers.

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48. Webster, James Randolph; Tu, Thanh Nghia; Yan, Xiaoming; Chung, Wonsuk, Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices.

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49. Londergan, Ana R.; Natarajan, Bangalore R.; Gousev, Evgeni; Webster, James Randolph; Heald, David, MEMS cavity-coating layers and methods.

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50. Kogut, Lior; Wang, Chun-Ming; Qui, Chengbin; Zee, Stephen; Zhong, Fan, MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same.

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51. Schmitz, Gregory P.; Wu, Ming-Ting; Chen, Richard T.; Veeramani, Arun, MEMS micro debrider devices and methods of tissue removal.

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52. Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R., Mesoscale and microscale device fabrication methods using split structures and alignment elements.

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53. Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R., Mesoscale and microscale device fabrication methods using split structures and alignment elements.

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54. Blom,Claes; Vieider,Christian; Larsson,Olov, Metallic building element for optoelectronics.

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55. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.

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56. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.

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57. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.

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58. Frodis,Uri; Cohen,Adam L.; Lockard,Michael S., Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures.

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59. Siddons David Peter (Shoreham NY) Johnson Erik D. (Ridge NY) Guckel Henry (Madison WI) Klein Jonathan L. (Madison WI), Method and apparatus for micromachining using hard X-rays.

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60. Tang Cha-Mei, Method and apparatus for obtaining high-resolution digital X-ray and gamma ray images.

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61. Miles, Mark W., Method and device for modulating light.

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62. Adam L. Cohen, Method for electrochemical fabrication.

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63. Cohen Adam L., Method for electrochemical fabrication.

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64. Cohen, Adam L., Method for electrochemical fabrication.

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65. Cohen, Adam L., Method for electrochemical fabrication.

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66. Cohen, Adam L., Method for electrochemical fabrication.

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67. Cohen,Adam L., Method for electrochemical fabrication.

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68. Cohen, Adam L.; Thompson, Jeffrey A., Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data.

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69. Cohen,Adam L.; Thompson,Jeffrey A., Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data.

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70. Cohen, Adam L., Method for electromechanical fabrication.

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71. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.

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72. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.

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73. Tacken, Roland Anthony; De Zwart, Renatus Marius; Meinders, Erwin Rinaldo; Peter, Maria, Method for preparing a patterned electric circuit.

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74. Namburi, Lakshmikanth; Garabedian, Raffi, Method for repairing a microelectromechanical system.

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75. Wang, Chun-Ming; Lan, Jeffrey; Sasagawa, Teruo, Method of creating MEMS device cavities by a non-etching process.

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76. Cohen, Adam L., Method of electrochemical fabrication.

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77. Zhang, Gang; Cohen, Adam L.; Lockard, Michael S.; Kumar, Ananda H.; Kruglick, Ezekiel J. J.; Kim, Kieun, Method of electrochemically fabricating multilayer structures having improved interlayer adhesion.

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78. Miles, Mark W, Method of fabricating MEMS devices (such as IMod) comprising using a gas phase etchant to remove a layer.

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79. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Method of making a contact.

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80. Mehran Mehregany ; Francis L. Merat, Method of making micromotors with utilitarian features.

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81. Eyre, Francis B.; Fink, Wolfgang, Method to create arbitrary sidewall geometries in 3-dimensions using liga with a stochastic optimization framework.

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82. Cohen,Adam L.; Smalley,Dennis R., Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials.

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83. Zhang, Gang, Methods for fabrication of three-dimensional structures.

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84. Zhang, Gang, Methods for forming multi-layer three-dimensional structures.

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85. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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86. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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87. Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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88. Appleby,Michael P.; Fraser,Iain; Atkinson,James E., Methods for manufacturing three-dimensional devices and devices created thereby.

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89. Smalley, Dennis R., Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids.

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90. Smalley, Dennis R., Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids.

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91. Smalley, Dennis R., Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids.

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92. Smalley,Dennis R., Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids.

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93. Cohen,Adam L., Methods of and apparatus for making high aspect ratio microelectromechanical structures.

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94. Cohen,Adam L.; Zhang,Gang; Le,Qui T., Methods of and apparatus for making high aspect ratio microelectromechanical structures.

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95. Cohen,Adam L.; Zhang,Gang; Le,Qui T.; Lockard,Michael S.; Smalley,Dennis R., Methods of and apparatus for making high aspect ratio microelectromechanical structures.

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96. Bang,Christopher A., Methods of and apparatus for molding structures using sacrificial metal patterns.

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97. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

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98. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

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99. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.

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100. Sampsell, Jeffrey Brian; Gally, Brian James; Floyd, Philip Don, Methods of fabricating MEMS with spacers between plates and devices formed by same.

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101. Sampsell, Jeffrey Brian; Gally, Brian James; Floyd, Philip Don, Methods of fabricating MEMS with spacers between plates and devices formed by same.

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102. Mehregany Mehran ; Merat Francis Lawrence, Methods of fabricating micromotors with utilitarian features.

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103. Veeramani, Arun S.; Jensen, Heath A.; Frodis, Uri; Wiita, Christopher G.; Lockard, Michael S.; Boguslavsky, Irina; Lembrikov, Pavel; Smalley, Dennis R.; Chen, Richard T., Methods of forming parts using laser machining.

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104. Veeramani, Arun S.; Jensen, Heath A.; Frodis, Uri; Wiita, Christopher G.; Lockard, Michael S.; Boguslavsky, Irina; Lembrikov, Pavel; Smalley, Dennis R.; Chen, Richard T., Methods of forming parts using laser machining.

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105. Kumar, Ananda H.; Albarran, Jorge S.; Cohen, Adam L.; Kim, Kieun; Lockard, Michael S.; Frodis, Uri; Smalley, Dennis R., Methods of forming three-dimensional structures having reduced stress and/or curvature.

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106. Kumar, Ananda H.; Albarran, Jorge Sotelo; Cohen, Adam L.; Kim, Kieun; Lockard, Michael S.; Frodis, Uri; Smalley, Dennis R., Methods of forming three-dimensional structures having reduced stress and/or curvature.

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107. Despa, Mircea; Hess, Dale Russell; Miller, Kenneth Richard; Share, Christine Marie, Methods of making extrusion dies.

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108. Hill, Edward; Wood, Robert L.; Mahadevan, Ramaswamy, Methods of overplating surfaces of microelectromechanical structure.

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109. Schmitz, Gregory P.; Arcenio, Gregory B.; Leguidleguid, Ronald; Perea, Juan Diego, Micro debrider devices and methods of tissue removal.

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110. Frodis, Uri; Cohen, Adam L.; Lockard, Michael S., Micro-scale and meso-scale hydraulically or pneumatically powered devices capable of rotational motion.

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111. Christopher P. Ausschnitt ; Nancy Greco ; Ernest N. Levine, Micro-surface fabrication process.

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112. Cohen, Adam L., Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures.

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113. Cohen, Adam L., Micro-turbines, roller bearings, bushings, and design of hollow closed structures and fabrication methods for creating such structures.

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114. Dewa Andrews S. ; Sevrain Christophe J. P., Microfabricated fluidic devices.

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115. Ohnstein Thomas R. ; Zook J. David ; Starr James B., Micromechanical stepper motor.

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116. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Microprobe tips and methods for making.

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117. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S.; Bang,Christopher A., Microprobe tips and methods for making.

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118. Folk, Christopher R., Microscale and millimeter scale devices including threaded elements, methods for designing, and methods for making.

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119. Frodis, Uri; Cohen, Adam L.; Folk, Christopher R., Microscale and millimeter scale devices including threaded elements, methods for designing, and methods for making.

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120. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.

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121. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.

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122. Brown,Elliott R.; Evans,John D.; Bang,Christopher A.; Cohen,Adam L.; Lockard,Michael S.; Smalley,Dennis R.; Grosser,Morton, Miniature RF and microwave components and methods for fabricating such components.

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123. Brown,Elliott R.; Evans,John D.; Bang,Christopher A.; Cohen,Adam L.; Lockard,Michael S.; Smalley,Dennis R.; Grosser,Morton, Miniature RF and microwave components and methods for fabricating such components.

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124. Lockard, Michael S.; Frodis, Uri; Cohen, Adam L.; Chen, Richard T., Miniature shredding tool for use in medical applications and methods for making.

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125. Lockard, Michael S.; Frodis, Uri; Cohen, Adam L.; Chen, Richard T., Miniature shredding tool for use in medical applications and methods for making.

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126. Lockard, Michael S.; Frodis, Uri; Cohen, Adam L.; Chen, Richard T.; Dupont, Pierre E.; Del Nido, Pedro J.; Vasilyev, Nikolay V., Miniature shredding tool for use in medical applications and methods for making.

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127. Lockard, Michael S.; Frodis, Uri; Cohen, Adam L.; Chen, Richard T.; Wu, Ming Ting; Schmitz, Gregory P.; Miller, Eric C., Miniature shredding tool for use in medical applications and methods for making.

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128. Cohen, Adam L.; Feinberg, Daniel I.; Bang, Christopher A., Monolithic structures including alignment and/or retention fixtures for accepting components.

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129. Leavy, Montray, Multi material secondary metallization scheme in MEMS fabrication.

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130. Leavy, Montray, Multi material secondary metallization scheme in MEMS fabrication.

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131. Cohen, Adam L., Multi-layer encapsulated structures.

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132. Chen, Richard T., Multi-layer monolithic fiber optic alignment structures, methods for making, and methods for using.

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133. Lockard,Michael S.; Cohen,Adam L.; Arat,Vacit; Smalley,Dennis R., Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers.

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134. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

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135. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

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136. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.

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137. Cohen, Adam L.; Lockard, Michael S.; McPherson, Dale S., Multi-step release method for electrochemically fabricated structures.

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138. Cohen,Adam L.; Lockard,Michael S.; McPherson,Dale S., Multistep release method for electrochemically fabricated structures.

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139. Howe Roger T. ; Franke Andrea ; King Tsu-Jae, Polycrystalline silicon germanium films for forming micro-electromechanical systems.

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140. Andrea Franke ; Roger T. Howe ; Tsu-Jae King, Polycrystalline silicon-germanium films for micro-electromechanical systems application.

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141. Mastrangelo Carlos H. ; Man Piu F. ; Webster James R., Polymer-based micromachining for microfluidic devices.

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142. Ismail,Salleh; Tea,Nim; Hsu,Yang; Tang,Weilong; Garabedian,Raffi; Khoo,Melvin, Post and tip design for a probe contact.

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143. Kumar, Ananda H.; Kruglick, Ezekiel J. J.; Cohen, Adam L.; Kim, Kieun; Zhang, Gang; Chen, Richard T.; Bang, Christopher A.; Arat, Vacit; Lockard, Michael S.; Frodis, Uri; Lembrikov, Pavel B.; Thompson, Jeffrey A., Probe arrays and method for making.

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144. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers.

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145. Ismail, Salleh; Garabedian, Raffi; Wang, Steven, Probe head with machine mounting pads and method of forming same.

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146. Garabedian,Raffi; Ismail,Salleh; Tea,Nim Hak; Hsu,Tseng Yang; Khoo,Melvin B; Tang,Weilong, Process for forming MEMS.

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147. Kelly, James John; Goods, Steven Howard; Yang, Nancy Yuan-Chi; Cadden, Charles Henry, Process for the electrodeposition of low stress nickel-manganese alloys.

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148. Guckel Henry ; Emmerich Harald,DEX ; Klein Jonathan L., Radiation mask adapted to be aligned with a photoresist layer and method of making the same.

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149. Cohen, Adam L.; Folk, Christopher R., Releasable tissue anchoring device and method for using.

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150. Cohen, Adam L.; Folk, Christopher R., Releasable tissue anchoring device, methods for using, and methods for making.

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151. Schmitz, Gregory P.; Miller, Eric C.; Chen, Richard T.; Wu, Ming Ting, Selective tissue removal tool for use in medical applications and methods for making and using.

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152. Schmitz, Gregory P.; Miller, Eric C.; Chen, Richard T.; Wu, Ming-Ting, Selective tissue removal tool for use in medical applications and methods for making and using.

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153. Schmitz, Gregory P.; Miller, Eric C.; Chen, Richard T.; Wu, Ming-Ting, Selective tissue removal tool for use in medical applications and methods for making and using.

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