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LSI cooling apparatus and computer cooling apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H02B-001/56
  • H05K-007/20
출원번호 US-0659671 (1991-02-25)
우선권정보 JP-0045413 (1990-02-28)
발명자 / 주소
  • Hatada Toshio (Tsuchiura) Matsushima Hitoshi (Ibaraki) Kondou Yoshihiro (Ibaraki) Inoue Hiroshi (Ibaraki) Otsuka Kanji (Higashiyamato) Shirai Yuji (Kodaira) Ohba Takao (Hadano) Yamagiwa Akira (Hadano
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 50  인용 특허 : 0

초록

An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to

대표청구항

An LSI cooling apparatus for cooling LSIs by flowing a fluid through heat sinks attached to the LSIs, each of said heat sinks comprising a group of a plurality of thin-wire fins, said group of thin-wire fins being aligned in parallel with each other in a plane and being bent in a corrugated shape, s

이 특허를 인용한 특허 (50)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  2. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
  3. John R. Sterner, Apparatus to enhance cooling of electronic device.
  4. John R. Sterner, Apparatus to enhance cooling of electronic device.
  5. John R. Sterner, Apparatus to enhance cooling of electronic device.
  6. John R. Sterner, Apparatus to enhance cooling of electronic device.
  7. John R. Sterner, Apparatus to enhance cooling of electronic device.
  8. John R. Sterner, Apparatus to enhance cooling of electronic device.
  9. Sterner John R., Apparatus to enhance cooling of electronic device.
  10. Sterner,John R., Apparatus to enhance cooling of electronic device.
  11. Lin, Shih-Jen, CPU cooling arrangement.
  12. Wattelet, Jonathan P.; Garner, Scott D., Combination tower and serpentine fin heat sink device.
  13. Miyahira,Frank, Computer equipment temperature control system and methods for operating the same.
  14. Butterbaugh Matthew A. (Rochester MN) Dingfelder Donald W. (Winona MN) Herman Peter M. (Oronoco MN) Kang Sukhvinder S. (Rochester MN), Cooling apparatus for electronic chips.
  15. Cheon Kioan, Cooling apparatus for electronic devices.
  16. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E.; Singh,Prabjit, Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins.
  17. Griesmayer,Erich, Cooling device for a chip and method for its production.
  18. Nair, Manu Kumar Velayudhan; Ravikumar, Frederick Rajendran, Cooling device with air shower.
  19. Miyahara, Munetoshi; Sawai, Jun, Cooling duct and electronic apparatus.
  20. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  21. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  22. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  23. Cheon Kioan, Cooling system for computer.
  24. Popovich, John M., Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density.
  25. Nagata, Hideo; Takamoto, Junji; Hori, Yuji, Electronic equipment and television game machine having heat radiation structure.
  26. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
  27. Cheon Kioan, Fanless cooling system for computer.
  28. Barsun,Stephan Karl; Barr,Andrew Harvey; Dobbs,Robert William, Finned device for removing heat from an electronic component.
  29. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
  30. Batchelder John Samual, Fluid transmissive apparatus for heat transfer.
  31. Batchelder John Samual, Fluid transmissive moderated flow resistance heat transfer unit.
  32. Rees Fenton ; Rinehart Larry, Forced air cooler system.
  33. Chang, Yu-Wei; Chang, Hu-Sung; Chung, Chao-Tsai, Heat dissipation device and method.
  34. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
  35. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
  36. Checchetti Maurizio,ITX, Heat sink.
  37. Ross, Ernest, Heat sink.
  38. Sauciuc, Ioan; Chrysler, Gregory M., Heat sink and electronic circuit module including the same.
  39. Kikuchi Shunichi,JPX ; Hirano Minoru,JPX ; Seyama Kiyotaka,JPX ; Yoshimura Hideaki,JPX ; Kanda Takashi,JPX ; Nori Hitoshi,JPX, Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure.
  40. Gawve, Warren Lee, Heat sink with multiple surface enhancements.
  41. Sato,Kaoru; Fujiwara,Yasuhiro; Manabe,Seiji; Kamizuru,Shinobu, Heat sink, method of manufacturing the same and cooling apparatus using the same.
  42. Ciulla, Anthony; Gernert, Nelson; North, Mark T.; Wood, Donald; Agrawal, Smita; Cui, Tianhong; Huang, Longzhong; Selvi, Vinnee Bharathi A.; Simon, Terrence W.; Yeom, Taiho; Yu, Youmin; Zhang, Min; Wang, Congshun; Zhu, Xuelin; Zhang, Tao, Heat transfer apparatus and method.
  43. Hofmann,Wilfried, Heat-exchanging device.
  44. Liang,Chen Jiunn; Yu,Kuo Yu, Heatsink device.
  45. Self, Bob J., Heatsink with improved heat dissipation capability.
  46. Ward Terence G. ; Downer Scott D., Pin fin heat sink and pin fin arrangement therein.
  47. Rogers, C. James; Hughes, Gregory G.; Zhang, L. Winston; Grippe, Frank M.; Cheema, Rifaquat, Serpentine, slit fin heat sink device.
  48. Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
  49. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  50. East, W. Joe; Weiss, Elliot, Thermal transfer devices with fluid-porous thermally conductive core.
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