이 특허를 인용한 특허 (66)

1. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.

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2. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.

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3. Utsunomiya, Motoyasu, Circulation-type liquid cooling apparatus and electronic device containing same.

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4. Mok, Lawrence S., Compliant vapor chamber chip packaging.

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5. Kobayashi Kazuo,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus boiling and condensing refrigerant.

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6. Ohara, Takahide, Cooling apparatus boiling and condensing refrigerant with a refrigerant vapor passage having a large cross sectional area.

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7. Wagner,Guy R.; Patel,Chandrakant D., Cooling apparatus for dissipating heat from a heat source.

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8. Kokubo, Akihisa; Terao, Tadayoshi, Cooling device boiling and cooling refrigerant, with main wick and auxiliary wick.

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9. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.

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10. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.

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11. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.

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12. Feierbach,Gary F., Cooling method for ICS.

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13. Suzuki, Minoru; Yamamoto, Tetsuya; Okada, Koichi, Cooling structure for inverter device.

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14. Suzuki, Osamu; Yasuda, Yosuke; Horiuchi, Keisuke; Hayashi, Tomoo; Nishihara, Atsuo; Funakoshi, Sunao, Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle.

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15. Furuya, Keizo, Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module.

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16. Lev, Jeffrey A.; Tracy, Mark S., Device cooling system.

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17. Chen,Pei; Goitia,Jorge; Hwang,Cherngye; Leung,Bigal; Perez,Diana; Sun,Yongjian, Direct cooling pallet assembly for temperature stability for deep ion mill etch process.

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18. Osawa, Satoshi, Electronic device cooling apparatus.

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19. Root Loren Francis ; Sehmbey Maninder Singh, Electronic device with a thermal control capability.

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20. Oman,Todd P., Electronics assembly and heat pipe device.

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21. Mindock, Eric S.; Scott, John R., Encapsulated multi-phase electronics heat-sink.

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22. Takamatsu, Tomonao; Hisano, Katsumi; Iwasaki, Hideo, Evaporator and circulation type cooling equipment using the evaporator.

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23. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.

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24. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.

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25. Wenger, Todd M., Fluid circuit heat transfer device for plural heat sources.

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26. Wenger,Todd M., Fluid circuit heat transfer device for plural heat sources.

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27. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.

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28. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.

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29. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.

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30. Xie Hong, Heat pipe lid for electronic packages.

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31. Choo Kok Fah,SGX ; Liu Chang Yu,SGX ; Wong Yew Wah,SGX ; Chan Weng Kong,SGX ; Tou Kwok Woon,SGX, Heat sink.

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32. Choo Kok Fah,SGX ; Liu Chang Yu,SGX ; Wong Yew Wah,SGX ; Chan Weng Kong,SGX ; Tou Kwok Woon,SGX, Heat sink.

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33. Gilliland, Don Alan; Holahan, Maurice Francis; Huettner, Cary Michael, Heat sink apparatus with extendable pin fins.

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34. Katsui Tadashi (Kawasaki JPX) Nakata Katsuhiko (Kawasaki JPX) Kitahara Takashi (Kahoku-gun JPX), Integrated circuit package.

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35. Malladi Deviprasad ; Lee Mario J. ; Ettehadieh Ehsan ; Mitty Nagaraj, Integrated circuit package and method.

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36. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.

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37. Bhatti,Mohinder Singh; Ghosh,Debashis; Reyzin,Ilya, Liquid cooled thermosiphon for electronic components.

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38. Reyzin,Ilya; Bhatti,Mohinder Singh, Liquid cooled thermosiphon with flexible coolant tubes.

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39. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.

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40. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.

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41. Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.

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42. Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.

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43. Weng, Chun-Jen, Package with high heat dissipation.

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44. Wilkins, Wendy L.; Gilbert, Barry K.; Kline, Bruce R., Packaging for high power integrated circuits.

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45. Bi, Zhenxing; Cheng, Kangguo; Xu, Peng; Zhang, Chen, Pillar formation for heat dissipation and isolation in vertical field effect transistors.

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46. Miller, Dustin M.; Li, Wei, Porous thermoplastic foams as heat transfer materials.

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47. Shinohara, Toshiaki; Yoshida, Takanobu, Power semiconductor device with high radiating efficiency.

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48. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.

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49. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.

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50. Pollard, Berwyn Owain; Scott, David Russell, Surface cooler having channeled fins.

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51. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.

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52. Weber, Richard M.; Rummel, Kerrin A.; Payton, Albert P., System and method of boiling heat transfer using self-induced coolant transport and impingements.

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53. Wilkins, Wendy L.; Gilbert, Barry K., System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device.

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54. Oyamada,Takashi, Telecommunication device including a housing having improved heat conductivity.

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55. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.

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56. Wilson, James S.; Moore, Michael A., Thermal management system and method for electronic assemblies.

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57. Wilson,James S.; Moore,Michael A., Thermal management system and method for electronic assemblies.

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58. Garner, Scott D., Thermal management system and method for electronics system.

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59. Alcoe,David J.; Brodsky,William L.; Calmidi,Varaprasad V.; Sathe,Sanjeev B.; Stutzman,Randall J., Thermally enhanced lid for multichip modules.

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60. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.

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61. Farrar,Paul A., Three-dimensional multichip module.

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62. Refai-Ahmed, Gamal, Three-dimensional thermal spreading in an air-cooled thermal device.

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63. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.

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64. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.

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65. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.

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66. Joseph T. Dibene, II ; Farhad Raiszadeh, Vapor chamber with integrated pin array.

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