[특허]High speed optical interconnect

High speed optical interconnect 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-031/12 H01L-031/16
출원번호	US-0740742 (1991-08-06)
발명자 / 주소	Austin Francis D. (Haymarket) Kachmarik Richard (Bealeton) Olson Leonard T. (Centreville VA)
출원인 / 주소	International Business Machines Corporation (Armonk NY 02)
인용정보	피인용 횟수 : 85 인용 특허 : 0

초록 ▼

An optoelectronic package with direct free space optical communication between pairs of optical transmitters and receivers located on different substrate surfaces in a closely spaced stack of chip carrying substrates is disclosed. The transmitters and receivers are aligned so that a light beam from each transmitter follows an optical path toward its respective receiver. In the stack of substrates, the transmitters and receivers are mounted on the surfaces of the substrates, many of which are separated by intervening substrates. These intervening substrates have vias, holes or transparent regions, or other optical means, at locations along the optical paths connecting the transmitters and receivers. Lenses or other concentrating means, where required, are adjacent to a transmitter so that its diverging light is focused on the intended receiver. Substrates are aligned so that the light from transmitters shines through the optical means in intervening substrates to the receivers. Means for removing heat from the substrates are included.

대표청구항 ▼

An optoelectronic package providing free space optical communication between a plurality of substrates arranged in a stacked, spaced relationship each substrate in the package having devices mounted thereon, the package comprising: a first substrate having substantially parallel first and second surfaces; a first light emitting transmitter mounted on the first surface of the first substrate; a second substrate having substantially parallel first and second surfaces, the surfaces of the first and second substrates oriented in substantially parallel directions; a first optical receiver mounted on the second surface of the second substrate, the first transmitter and first receiver oriented along an optical path so that light emitted by the first transmitter can be received by the first receiver, the optical path allowing free space optical communication between the first transmitter and first receiver; a third substrate having substantially parallel first and second surfaces oriented in a substantially parallel direction to the surfaces of the first and second substrates, the third substrate located between the first and second substrates along the optical path having an optical means to allow light to pass through; and, means to hold the first and second substrates so that the first transmitter and the first receiver are located along the optical path.

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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High speed optical interconnect 원문보기

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High speed optical interconnect 원문보기

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이 특허를 인용한 특허 (85)

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