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Rack based packaging system for computers with cable, cooling and power management module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H02B-001/20
출원번호 US-0827238 (1992-01-29)
발명자 / 주소
  • Basara Michael (Milan NC ITX) Kneale Collan B. (Ashville NC) Lucente Samuel A. (Stamford CT) Natoli John (Woodstock NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 116  인용 특허 : 0

초록 ▼

An assembly of chases is disposed on the exterior of a rack supporting discrete computer, DASD, communications, storage and similar electronic modules to provide input/output cable management, cooling passages to supply cooling air to each of the electronic units and a power distribution chase to ma

대표청구항 ▼

An electronic module packaging system for assembling and containing electronic modular components of an electronic system comprising: electronic modular components; a frame for receiving and supporting said electronic modular components, said frame having two vertical sides, a vertical front, a vert

이 특허를 인용한 특허 (116)

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