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Injection molded printed circuits 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/02
  • H05K-001/03
출원번호 US-0875561 (1992-04-27)
우선권정보 GB-0022003 (1985-09-04); GB-0012116 (1986-05-19)
발명자 / 주소
  • Denes Oscar L. (Greendale WI)
출원인 / 주소
  • UFE Incorporated (Stillwater MN 02)
인용정보 피인용 횟수 : 96  인용 특허 : 0

초록 ▼

An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions ha

대표청구항 ▼

A moulded electrical circuit package wherein an entire support member is secured to a substrate comprising: a support member composed of a thin flexible film material having an electrically conductive circuit trace material disposed on one side of said support member; an electrical component unitari

이 특허를 인용한 특허 (96)

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