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[미국특허] Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0893448 (1992-06-04)
발명자 / 주소
  • Yu Chris C. (Boise ID) Doan Trung T. (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 178  인용 특허 : 0

초록 ▼

A semiconductor processing method of chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate includes, a) providing a chemical mechanical polishing slurry comprising H2O, a solid abrasive material, and a third component selected from the group consist

대표청구항 ▼

A semiconductor processing method of chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate comprising the following steps: providing a chemical mechanical polishing slurry comprising AgNO3 at from about 2% to about 15% by volume, H2O, and a solid ab

이 특허를 인용한 특허 (178) 인용/피인용 타임라인 분석

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