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Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
  • B29C-037/00
  • C23F-001/00
출원번호 US-0684816 (1991-04-15)
우선권정보 CH-0001378 (1990-04-24)
발명자 / 주소
  • Brandli Gerold (Aarau CHX) Bachmann Guido (Sempach CHX)
출원인 / 주소
  • Hightec MG AG (Lenzburg CHX 03)
인용정보 피인용 횟수 : 78  인용 특허 : 0

초록 ▼

In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulati

대표청구항 ▼

A method of manufacturing multi-layer thin film circuits containing integrated thin film resistors, comprising the steps of: alternately forming conductor and insulating layers upon a substrate; forming free zones in all of the formed conductor and insulating layers, with the exception of the last c

이 특허를 인용한 특허 (78)

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