이 특허를 인용한 특허 (43)

1. Hsiao, Benjamin S.; Chu, Benjamin; Fu, Xuan; Blanski, Rusty L.; Phillips, Shawn H., Blends of organic silicon compounds with ethylene-based polymers.

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2. Bruza, Kenneth J.; Godschalx, James P.; Shaffer, II, Edward O.; Smith, Jr., Dennis W.; Townsend, III, Paul H.; Bouck, Kevin J.; Niu, Qing Shan J., Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom.

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3. Bruza, Kenneth J.; Godschalx, James P.; Shaffer, II, Edward O.; Smith, Jr., Dennis W.; Townsend, III, Paul H.; Bouck, Kevin J.; Niu, Qing Shan J., Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom.

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4. Bruza, Kenneth J.; Godschalx, James P.; Shaffer, II, Edward O.; Smith, Jr., Dennis W.; Townsend, III, Paul H.; Bouck, Kevin J.; Niu, Qing Shan J., Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom.

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5. Bruza,Kenneth J.; Godschalx,James P.; Shaffer, II,Edward O.; Smith, Jr.,Dennis W.; Townsend, III,Paul H.; Bouck,Kevin J.; Niu,Qing Shan J., Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom.

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6. Shin Hyunkook ; Siemionko Roger Keith ; Deng Nanlin, Flash spinning process.

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7. Burke, Dann, Game ball with noise suppression disk.

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8. Suh Nam P. ; Hermann Torsten,DEX, Gear throttle as a nucleation device in a continuous microcellular extrusion system.

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9. Farrar,Paul A., Hydrophobic foamed insulators for high density circuits.

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10. Vadala, Jr.,Joseph P.; Kishbaugh,Levi A.; Levesque,Kevin J.; Pierick,David E., In-mold decorated articles and methods.

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11. O'Neill, Michael; Sandusky, Donald Allan, Inflatable articles that provide long term inflation and pressure control.

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12. Burke, Dann, Inflation method for and game ball with noise suppression disk.

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13. Pierick, David E.; Anderson, Jere R.; Cha, Sung W.; Chen, Liqin; Stevenson, James F.; Laing, Dana E., Injection molding of polymeric material.

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14. Pierick,David E.; Anderson,Jere R.; Cha,Sung Woon; Chen,Liqin; Stevenson,James F.; Laing,Dana E., Injection molding of polymeric material.

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15. Farrar, Paul A., Insulators for high density circuits.

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16. Farrar, Paul A., Insulators for high density circuits.

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17. Farrar, Paul A., Integrated circuit device structure including foamed polymeric material.

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18. Chae,Gee Sung, Liquid crystal display and fabricating method thereof.

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19. Farrar, Paul A., Low dielectric constant STI with SOI devices.

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20. Farrar, Paul A., Low dielectric constant STI with SOI devices.

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21. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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22. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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23. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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24. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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25. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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26. Paul A. Farrar, Low dielectric constant shallow trench isolation.

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27. Farrar, Paul A., Memory system with conductive structures embedded in foamed insulator.

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28. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.

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29. Burnham, Theodore A.; Cha, Sung W.; Walat, Robert H.; Kim, Roland Y.; Anderson, Jere R.; Stevenson, James F.; Suh, Nam P.; Pallaver, Matthew, Method and apparatus for microcellular polymer extrusion.

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30. Lange, William H.; Pallarti, Edward J., Method of forming a PTFE insulation layer over a metallic conductor and product derived thereform.

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31. Venkataraman Sundar Kilnagar ; Randa Stuart Karl ; Spohn Peter Dwight, Method of forming foamed fluoropolymer composites.

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32. Farrar Paul A., Method of forming foamed polymeric material for an integrated circuit.

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33. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.

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34. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.

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35. Farrar, Paul A., Polynorbornene foam insulation for integrated circuits.

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36. Satoshi Shukushima JP; Taro Fujita JP; Atsushi Tsujino JP; Yoshihiro Hirakawa JP; Masato Sano JP; Hiroyuki Ootsuka JP, Thin-conductor foamed-polyolefin-insulated wire and manufacturing method thereof.

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37. Shukushima, Satoshi; Fujita, Taro; Tsujino, Atsushi; Hirakawa, Yoshihiro; Sano, Masato; Ootsuka, Hiroyuki, Thin-conductor foamed-polyolefin-insulated wire and manufacturing method thereof.

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38. Morrow, Jason Norman; Ward, Jr., Robert Miller; Kale, Zeb Leonard; Bailey, Michael Ray; Gemme, Christopher; Bollinger, George; Lumley, Scott, Toneable conduit and method of preparing same.

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39. Morrow,Jason Norman; Ward, Jr.,Robert Miller; Kale,Zeb Leonard; Bailey,Michael Ray, Toneable conduit and method of preparing same.

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40. Morrow,Jason Norman; Ward, Jr.,Robert Miller; Kale,Zeb Leonard; Bailey,Michael Ray; Gemme,Christopher; Bollinger,George; Lumley,Scott, Toneable conduit and method of preparing same.

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41. Chamberlain, John; Morrow, Jason, Toneable conduit optimized for conduit shrinkage and elongation.

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42. Morrow, Jason, Toneable conduit with heat treated tone wire.

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43. Morrow, Jason, Toneable conduit with loose toning signal wire.

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