이 특허를 인용한 특허 (62) 인용/피인용 타임라인 분석

1. Jaeger, Richard E., Adhesive compositions containing organic spacers and methods for use thereof.

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2. Dershem, Stephen M, Amide-extended crosslinking compounds and methods for use thereof.

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3. Dershem, Stephen M.; Mizori, Farhad G., Amide-extended crosslinking compounds and methods for use thereof.

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4. Dershem, Stephen M, Anti-bleed compounds, compositions and methods for use thereof.

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5. Anderson, David M.; Evens, Michael W., Bond line control process.

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6. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Bonded patch having multiple zones of fracture toughness.

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7. Dan-Jumbo, Eugene A.; Keller, Russell L; Westerman, Everett A., Bonded patch having multiple zones of fracture toughness.

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8. Blanchard, Steve; Akdeniz, Aydin; Spalding, John; Anderson, David M., Bonded patches with bond line control.

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9. Blanchard, Steven Donald; Akdeniz, Aydin; Spalding, John; Anderson, David M.; Evens, Michael W., Bonded patches with bond line control.

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10. Evens, Michael W.; Anderson, David M.; Blanchard, Steve; Akdeniz, Aydin; Spalding, John, Bonded patches with bond line control.

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11. Suh, Daewoong, Bulk metallic glass solder material.

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12. Deppisch,Carl; Fitzgerald,Tom; Hua,Fay; Shi,Wei; Gasparek,Mike, Capillary underflow integral heat spreader.

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13. Vallee, Alain; Lavoie, Paul-Andre; Leblanc, Patrick; Gagnon, Regis; Regisser, Fabrice; Brouillette, Dany, Cathode material for polymer batteries and method of preparing same.

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14. Mizori, Farhad G; Dershem, Stephen M, Curable composition with rubber-like properties.

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15. Dershem, Stephen M, Curatives for epoxy compositions.

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16. Dershem, Stephen M, Curing agents for epoxy resins.

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17. Nishimura Atsushi,JPX ; Tsuyama Kouichi,JPX ; Iwasaki Yorio,JPX ; Taniguchi Yutaka,JPX ; Teppozuka Mituo,JPX ; Shimizu Wataru,JPX ; Takada Kousuke,JPX ; Kobori Hisaji,JPX, Current protector.

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18. Dershem, Stephen M., Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof.

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19. Dershem, Stephen M, Di-cinnamyl compounds and methods for use thereof.

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20. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Discretely tailored multi-zone bondline for fail-safe structural repair.

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21. Dan-Jumbo, Eugene A.; Keller, Russell L; Westerman, Everett A., Discretely tailored multi-zone bondline for fail-safe structural repair.

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22. Diep, Buu; Gooch, Roland, Disposable bond gap control structures.

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23. Diep, Buu; Gooch, Roland W., Disposable bond gap control structures.

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24. Clemens, Victor; Paus, Sebastian, Fastening element for attaching to a wall.

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25. Dershem, Stephen M.; Mizori, Farhad G., Free-radical curable polyesters and methods for use thereof.

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26. Dershem, Stephen M., Functionalized styrene oligomers and polymers.

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27. Dershem, Stephen M.; Mizori, Farhad G, Hetero-functional compounds and methods for use thereof.

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28. Dershem, Stephen M, Hydrolytically resistant thermoset monomers.

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29. Mizori, Farhad G; Dershem, Stephen M, Imide-linked maleimide and polymaleimide compounds.

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30. Gooch, Roland; Diep, Buu; Kocian, Thomas Allan; Black, Stephen H.; Kennedy, Adam M., Integrated bondline spacers for wafer level packaged circuit devices.

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31. Gooch, Roland; Diep, Buu; Kocian, Thomas Allan; Black, Stephen H.; Kennedy, Adam M., Integrated bondline spacers for wafer level packaged circuit devices.

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32. Gooch, Roland; Diep, Buu; Kocian, Thomas Allan; Black, Stephen H.; Kennedy, Allan M., Integrated bondline spacers for wafer level packaged circuit devices.

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33. Dannheisig, Andreas; Schulze, Carina; Flock, Dustin; Gross, Bernd, Joining process, manufacturing process, arrangement of components and vehicle seat.

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34. Dershem, Stephen M, Low shrinkage polyester thermosetting resins.

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35. Dershem, Stephen M., Low temperature curing acrylate and maleimide based formulations and methods for use thereof.

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36. Dershem, Stephen, Maleimide compositions and methods for use thereof.

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37. Dershem, Stephen M, Maleimide-functional monomers in amorphous form.

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38. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.

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39. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.

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40. Greig Daryl John,GBX ; Sears Kenneth John,GBX, Method of manufacture of a structure and a structural member for use in the method.

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41. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Method of reworking an area of a composite structure containing an inconsistency.

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42. Ely, Kevin J.; Frech, Timothy M.; Ritter, George W., Method of weldbonding.

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43. Sauter, Klaus; Mahrle, Joerg, Microelectronic package with an attachment layer including spacer elements.

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44. Dershem, Stephen, Modified calcium carbonate-filled adhesive compositions and methods for use thereof.

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45. Dershem, Stephen M., Monomers derived from pentacyclopentadecane dimethanol.

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46. Dershem, Stephen M., Olefin oligomers containing pendant maleimide groups.

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47. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Predictable bonded rework of composite structures.

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48. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Predictable bonded rework of composite structures using tailored patches.

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49. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Predictable bonded rework of composite structures using tailored patches.

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50. Akdeniz, Aydin; Blanchard, Steven D.; Anderson, David M., Quick composite repair template tool and method.

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51. Akdeniz, Aydin; Blanchard, Steven D.; Anderson, David M., Quick composite repair template tool and method.

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52. Zaps, Klaus, Rotor for an electric motor.

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53. Shimada Yuzo,JPX ; Senba Naoji,JPX ; Takahashi Nobuaki,JPX, Semiconductor device and method of fabricating the same.

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54. Uchiyama,Kenji, Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit.

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55. Sun,Kuo Yang; Yang,Chia Ming; Lu,Hung Yuan; Tsai,Wei Chin; Lin,Yi Cheng, Semiconductor package.

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56. Dershem, Stephen M., Siloxane monomers and methods for use thereof.

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57. Dershem, Stephen M, Soluble metal salts for use as conductivity promoters.

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58. Dan-Jumbo, Eugene A., Structural bonded patch with tapered adhesive design.

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59. Dan-Jumbo, Eugene A.; Keller, Russell L.; Westerman, Everett A., Tapered patch for predictable bonded rework of composite structures.

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60. Dershem, Stephen M, Thermoplastic elastomer with acyloxyphenyl hard block segment.

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61. Dershem, Stephen M.; Hoang, Gina; Lu, Melin, Thermosetting adhesive compositions.

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62. Dershem, Stephen M., Thermosetting hyperbranched compositions and methods for use thereof.

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