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[미국특허] Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutene 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08J-005/10
  • C08K-003/38
  • C08L-077/06
출원번호 US-0821277 (1992-01-10)
발명자 / 주소
  • Solc Jitka (Midland MI) Kleweno Douglas G. (Lake Jackson TX)
출원인 / 주소
  • The Dow Chemical Company (Midland MI 02)
인용정보 피인용 횟수 : 45  인용 특허 : 30

초록 ▼

A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is

대표청구항 ▼

A ceramic-filled thermally-conductive composite for use in microelectronic applications, comprising a substantially homogeneous mixture of: (A) a fusible semi-crystalline polyamide having a melting point of greater than about 250°C. and polymerized from a combination selected from the group consisti

이 특허에 인용된 특허 (30) 인용/피인용 타임라인 분석

  1. Aiba Seiichi (Yatabe JPX) Hiratani Kazuhisa (Yatabe JPX) Nakagawa Tsutomu (Musashino JPX), Catalyst membrane.
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  2. Gilpin, Jo Ann; Lindy, Lowell B., Chloromethylation of deactivated aromatic compounds.
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  3. Domnguez Edward J. (503 Park Ave. San Jose CA 95110), Collapsible door wedge with quick release mechanism.
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  4. Nelb ; II Robert G. (North Haven CT) Oertel ; III Richard W. (Guilford CT), Continuous, solvent-free process for preparing thermoplastic polyamides and polyesteramides.
    상세보기
  5. Bruza Kenneth J. (Midland MI) Kirchhoff Robert A. (Midland MI), Cyclobutarene ketoaniline monomeric and polymeric compositions.
    상세보기
  6. Procter Philip J. (Olean NY), Encapsulating electronic components.
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  7. Wykowski Paul L. (Lake Jackson TX) Puckett Paul M. (Lake Jackson TX), Epoxy resin compositions for use in low temperature curing applications.
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  8. Kuramoto Nobuyuki (Sagamihara JPX) Taniguchi Hitofumi (Chigasaki JPX), Fine powder of aluminum nitride, composition and sintered body thereof and processes for their production.
    상세보기
  9. Solomon Victor J. (1638 Doris Dr. Sarasota FL 33580), Insulation assembly.
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  10. Bonk Henry W. (Wallingford CT) Nelb ; II Robert G. (North Haven CT) Oertel ; III Richard W. (Guilford CT), Melt-polymerization process for the preparation of thermoplastic polyamides and polyesteramides.
    상세보기
  11. Rolles Rolf (New Kensington PA) Williams ; Jr. James E. (New Kensington PA) Kondis Thomas J. (Pittsburgh PA), Metal-pigmented plastic powder.
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  12. Farona Michael F. (Cuyahoga Falls OH) Srinivasan Ramji (Akron OH), Method of polymerizing aw 상세보기
  • Kirchhoff Robert A. (Midland MI), N-Substituted arylcyclo butenyl-maleimides.
    상세보기
  • Woo Edmund P. (Midland MI) Murray Daniel J. (Saginaw MI), Novel polyaromatic cyanates.
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  • Andrews Philip S. (Hamden CT) Onder Kemal (North Haven CT), Polyamide/polyetherimide alloys.
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  • Lebrun Jean-Jacques (Caluire FRX) Porte Huques (Lyons FRX), Polysilazane composition which can crosslink in the presence of a metal compound catalyzing a hydrosilylation reaction.
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  • Quarderer George J. (Midland MI) Stone Fred C. (Midland MI) Beitz Mark J. (Midland MI) O\Donnell Patrick M. (Midland MI), Preparation of cyclobutarenes via the steam pyrolysis of aromatic derivatives.
    상세보기
  • So Ying-Hung (Midland MI), Preparation of cyclobutene substituted aromatic hydrocarbons.
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  • Kirchhoff Robert A. (Midland MI) Schrock Alan (Midland MI) Gilpin Jo A. (Midland MI), Prepolymer processing of arylcyclobutene monomeric compositions.
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  • Liu Ming-Biann (Midland MI), Process for preparing monobrominated cyclobutarenes.
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  • Liu Ming-Biann (Clayton CA), Process for preparing monohalogenated cyclobutarenes.
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  • Chen, Augustin T.; Goldwasser, David J.; Onder, Kemal, Product.
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  • Woo Edmund P. (Midland MI) Dellar David V. (Sanford MI), Production of polytriazines from aromatic polycyanates with cobalt salt of a carboxylic acid as catalyst.
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  • Yang Philip C. (Midland MI) Pickelman Dale M. (Auburn MI), Rubber-modified cyanate ester resins and polytriazines derived therefrom.
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  • Mine Katsutoshi (Ichihara JPX) Maruyama Tsuneo (Ichihara JPX) Takeshita Kazuhide (Tokyo JPX), Siloxane compositions which form ceramics at high temperatures.
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  • Hoffman Dwight K. (Midland MI) Arends Charles B. (Midland MI), Stable dispersions of polymers in polyepoxides.
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  • Hoffman Dwight K. (Midland MI) Arends Charles B. (Midland MI), Stable dispersions of polymers in polyepoxides.
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  • Kerschbaumer Franz (Steinhausen CHX) Schmidt Klaus (Chur CHX), Thermoplastic glass fiber-reinforced polyamide molding material.
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  • Lausberg Dietrich (Ludwigshafen DEX) Seiler Erhard (Ludwigshafen DEX), Thermoplastic molding materials based on nylons and polyaryl ether ketones.
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  • Kirchhoff Robert A. (Midland MI) Schrock Alan K. (Midland MI) Hahn Stephen F. (Midland MI), Unsaturated alkyl monoarylcyclobutane monomers.
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    • 이 특허를 인용한 특허 (45) 인용/피인용 타임라인 분석

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    3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
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    4. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
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    5. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
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    6. Yoo, Hyun Jee; Cho, Yoon Gyung; Chang, Suk Ky; Shim, Jung Sup; Lee, Seung Min, Encapsulation film.
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    7. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
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    8. Mills Lynne K. ; Swedberg Eric J. ; Knudsen Arne K., Filler powder comprising a partially coated alumina powder and process to make the filler powder.
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    9. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
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    10. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
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    11. Gengel Glenn W., Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer.
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    12. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
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    13. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
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    14. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
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    15. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
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    16. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
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    17. Shigeo Sase JP; Yasuyuki Mizuno JP; Takeshi Sugimura JP; Harumi Negishi JP, METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMP.
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    18. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
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    19. Toebben Dirk ; Groteloh Doerthe,DEX ; Spindler Oswald,DEX ; Rogalli Michael,DEX, Method for forming of a silicon oxide layer on a topography.
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    20. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
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    21. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
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    22. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
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    23. Hardikar, Narendra Anand; Sharma, Harindranath K., Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly.
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    24. Howard Kevin E. (Midland MI) Carroll Daniel F. (Midland MI) Biskupski Scott J. (Bay City MI), Method of making moisture resistant aluminum nitride powder and powder produced thereby.
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    25. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
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    26. Shimoto Tadanori,JPX ; Matsui Koji,JPX, Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder.
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    27. Howard Kevin E. (Midland MI), Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same.
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    28. Gross Ronald David (Storrs CT) Kushner Brett David (Wallingford CT), Shaped unidirectional fiber preforms.
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    29. Ueda, Hirotaka; Mizutani, Masaki, Sheet resin composition and process for manufacturing semiconductor device therewith.
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    30. Ueda, Hirotaka; Mizutani, Masaki, Sheet resin composition and process for manufacturing semiconductor device therewith.
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    31. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
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    32. Fischer,Patrick J.; Kobe,James J.; Murray,Cameron T., Thermal interface materials and method of making thermal interface materials.
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    33. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
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    34. Fischer, Patrick J.; Kobe, James J.; Murray, Cameron T., Thermally conducting foam interface materials.
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    35. l'Abee, Roy; Mercx, Frans; van der Mee, Mark; Karlik, Dennis; Guo, Mingcheng; Zou, David, Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof.
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    36. l'Abee, Roy; Mercx, Frans; van der Mee, Mark; Karlik, Dennis; Guo, Mingcheng; Zou, David, Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof.
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    37. Macpherson, Aaron Steve; Kant, Rishi; Kelsic, Gary F., Thermally conductive overmold for a disc drive actuator assembly.
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    38. Raman, Chandrashekar; Xiang, Bei; Murugaiah, Anand, Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics.
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    39. Raman, Chandrashekar; Xiang, Bei; Murugaiah, Anand, Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics.
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    40. Miller, James D., Thermally conductive polymer compositions having moderate tensile and flexural properties.
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    41. Zhuo Qizhuo ; Harris Ronald M. ; Skovran Dennis C. ; Lightner Leo F. ; Randall Michael S. ; Stygar Vernon E., Thermally conductive thermoplastic.
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    42. Chandrakant M. Yagnik ; Roy E. Barth ; R. Knox Pitzer, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
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    43. Yagnik, Chandrakant M.; Barth, Roy E.; Pitzer, R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
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    44. Yagnik,Chandrakant M.; Barth,Roy E.; Pitzer,R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.
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    45. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
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