[특허]Apparatus for cooling a plurality of electronic modules

Apparatus for cooling a plurality of electronic modules 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0942874 (1992-09-10)
발명자 / 주소	Ferchau Joerg (Morgan Hill CA) Trujillo Victor (Fremont CA)
출원인 / 주소	Tandem Computers Incorporated (Cupertino CA 02)
인용정보	피인용 횟수 : 65 인용 특허 : 0

초록 ▼

A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet. Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

대표청구항 ▼

An apparatus for cooling a plurality of electronic modules comprising: a module housing; a cooling fluid intake housing defining a cooling fluid intake chamber disposed on one side of the module housing, the cooling fluid intake housing having an intake opening therein for directing cooling fluid from the cooling fluid intake chamber into the module housing; a cooling fluid exhaust housing defining a cooling fluid exhaust chamber disposed on a second side of the module housing opposite the first side of the module housing, the cooling fluid exhaust housing having an exhaust opening therein for directing cooling fluid received from the module housing into the cooling fluid exhaust chamber; a plurality of electronic modules disposed in the module housing between the cooling fluid intake housing and the cooling fluid exhaust housing; wherein cooling fluid introduced into the module housing by the cooling fluid intake chamber passes through the plurality of electronic modules before entering the cooling fluid exhaust chamber; wherein the cooling fluid intake housing includes a cooling fluid entry opening disposed on a side of the cooling fluid intake housing for releasably coupling with a cooling fluid distribution intake opening disposed in a cooling fluid distribution housing for communicating cooling fluid from the cooling fluid distribution housing to the cooling fluid intake chamber; wherein the cooling fluid exhaust housing includes a cooling fluid exit opening disposed on a side of the cooling fluid exhaust housing for releasably coupling with a cooling fluid distribution exhaust opening disposed in the cooling fluid distribution housing for communicating cooling fluid from the cooling fluid exhaust chamber to the cooling fluid distribution housing; and wherein the cooling fluid entry opening and the cooling fluid exit opening are disposed on the same side of the module housing.

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Konshak, Michael V.; Eichel, Dale R.; Fechner, Jimmy R., Forced air system for cooling a high density array of disk drives.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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연합인증

Apparatus for cooling a plurality of electronic modules 원문보기

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Apparatus for cooling a plurality of electronic modules 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (65)

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