이 특허를 인용한 특허 (126)

1. Jialanella, Gary L.; Johnson, Dean A., Accelerated organoborane amine complex initiated polymerizable compositions.

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2. Jialanella, Gary L.; Johnson, Dean A., Accelerated organoborane amine complex initiated polymerizable compositions.

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3. Jialanella, Gary L.; Johnson, Dean A., Accelerated organoborane amine complex initiated polymerizable compositions.

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4. Jialanella, Gary L.; Ristoski, Toni; Cawley, Arthur F.; Cole, Eric E.; Johnson, Dean A., Accelerated organoborane initiated polymerizable compositions.

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5. Jialanella, Gary L.; Ristoski, Toni; Cawley, Arthur F.; Cole, Eric E.; Johnson, Dean A., Accelerated organoborane initiated polymerizable compositions.

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6. Bluem Gregory L. ; Haak Christopher A. ; McCormick ; Jr. Fred B. ; Tead Stanley F., Adhesive compositions and methods of use.

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7. Feng, Shaoguang; Jialanella, Gary L.; Nickias, Peter; Ristoski, Toni, Amido-organoborate initiator systems.

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8. Sonnenschein, Mark F.; Webb, Steven P.; Wendt, Benjamin L.; Harrington, Daniel R., Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components.

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9. Sonnenschein,Mark F.; Webb,Steven P.; Wendt,Benjamin L.; Harrington,Daniel R., Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components.

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10. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F., Antifuse interconnect between two conducting layers of a printed circuit board.

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11. Baars,Dirk M.; Borges,Hillary P.; Chun,Seung B., Apparatus and method of manufacture of electrochemical cell components.

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12. Nathan Richard J. (Morgan Hill CA) Lan James J. D. (Fremont CA) Chiang Steve S. (Saratoga CA), Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printe.

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13. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Shepherd William H. ; Xie John Y. ; Jiang Hang, Ball grid array structure and method for packaging an integrated circuit chip.

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14. Becker,Paul N.; Maniraj,Sirikhit; Pineda,Martin; Vranicar,Anthony; Yankello,Francis M.; Wasilewski,Frank, Circuit protection device.

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15. Golubovic, Boris; Becker, Paul N.; Moore, Robert P., Circuit protection device having thermally coupled MOV overvoltage element and PPTC overcurrent element.

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16. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Composite comprising a metal substrate and a corrosion protecting layer.

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17. Ford, William E.; Wessels, Jurina; Yasuda, Akio; Barger, Jack, Composite materials comprising carbon nanotubes and metal carbonates.

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18. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Composition containing a polymer and conductive filler and use thereof.

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19. Shibuta, Daisuke; Imai, Hiroyuki; Yokomizo, Masahiro; Tsunashima, Makoto; Maeda, Yusuke; Furuya, Nobuo, Conductive fiber, manufacturing method therefor, apparatus, and application.

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20. Ducros, Jean-Alec; El Cadi, Mohamed Ait, Conductive paste for the electrical industry and its use.

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21. Wartenberg Mark F. ; Lahlouh John G. ; Toth James, Conductive polymer composition and device.

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22. Sadhir Rajender K. ; Saudners Howard E. ; Schoch ; Jr. Karl F. ; Smith James D. B., Conductive polymer compositions, electrical devices and methods of making.

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23. Barrett Andrew Brian,IEX ; Hogge Steven D. ; Li Wen Been,TWX ; Yang Kun Ming,TWX, Conductive polymer device and method of manufacturing same.

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24. Wen Been Li TW; Kun Ming Yang TW, Conductive polymer device and method of manufacturing same.

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25. Zhao Liren ; Khadkikar Prasad S., Conductive polymer materials for high voltage PTC devices.

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26. Cawse, John; Simmons, Martin, Conductivity of resin materials and composite materials.

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27. Simmons, Martin; Cawse, John, Conductivity of resin materials and composite materials.

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28. Hogge Steven Darryl ; Zhang Mengruo,HKX ; Wiryana Sidharta,HKX, Continuous process and apparatus for manufacturing conductive polymer components.

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29. Hogge Steven Darryl ; Zhang Mengruo,HKX ; Wiryana Sidharta,HKX, Continuous process and apparatus for manufacturing conductive polymer components.

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30. Anil Raj Duggal ; Andrew Jay Salem ; Lionel Monty Levinson ; Michael Leslie Todt, Current limiting device with conductive composite material and method of manufacturing the conductive composite material and the current limiting device.

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31. Cole Herbert Stanley ; Sitnik-Nieters Theresa Ann ; Duggal Anil Raj, Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite.

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32. Rolls John A., Device and method for heating and deicing wind energy turbine blades.

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33. Nathan Richard J. ; Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Osann ; Jr. Robert, Device-under-test card for a burn-in board.

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34. Simhambhatla, Murthy V.; Saltman, Robert P., Dimensionally stable and growth controlled inflatable member for a catheter.

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35. Pachla, Timothy; Harris, Edwin James; Vyas, Tushar, Direct application voltage variable material.

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36. Harris,Edwin James; Vyas,Tushar; Whitney,Stephen J., Direct application voltage variable material, components thereof and devices employing same.

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37. Harris,Edwin James; Vyas,Tushar; Pachla,Timothy; Colby,James A., Direct application voltage variable material, devices employing same and methods of manufacturing such devices.

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38. Chiang, Justin N.; Toth, James; Beadling, William C., Distributed sensor.

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39. Jean Denis, Edge connectors for printed circuit boards comprising conductive ink.

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40. O'Grady, Patrick James, Electrical connection.

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41. Chandler Daniel A. ; Navarro Luis A. ; Chu Edward F., Electrical device.

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42. Walsh, Cecilia A.; Rubiano, Rodrigo; Martin, Albert R., Electrical device.

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43. Jianhua Joyce Chen ; Susan Melsa Jordan, Electrical device and assembly.

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44. Banich Ann ; Chu Edward F., Electrical device comprising a conductive polymer.

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45. Becker, Paul N.; Jankowski, Orion; Walsh, Cecilia A., Electrical devices containing conductive polymers.

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46. Becker, Paul N.; Rinde, James A.; Mathews, Barry C.; Jankowski, Orion; Walsh, Cecilia A., Electrical devices containing conductive polymers.

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47. Becker,Paul N.; Jankowski,Orion; Walsh,Cecilia A., Electrical devices containing conductive polymers.

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48. Chandler Daniel A. ; Matthiesen Martin ; Leong Derek ; Galla Matthew P., Electrical devices containing conductive polymers.

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49. Minervini Anthony D. ; Nguyen Thinh K., Electrical devices having a polymer PTC array.

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50. Galla,Matthew P., Electrical devices having an oxygen barrier coating.

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51. Lawson David Charles,CAX ; Wiese Earl George,CAX, Electrically conductive composite heater and method of manufacture.

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52. Chandler, Daniel A.; Matthiesen, Martin; Leong, Derek, Electrically resistive PTC devices containing conductive polymers.

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53. Pascenko, Ivan, Electrolytic capacitor assembly containing a resettable fuse.

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54. Chu Edward F. ; Jordan Susan M. ; Lahlouh John, Extrusion of polymers.

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55. Harris, Edwin James; Pachla, Timothy; Vyas, Tushar, Flexible circuit having overvoltage protection.

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56. John Joseph Shea ; Miomir B. Djordjevic ; William Kingston Hanna, Flexible moldable conductive current-limiting materials.

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57. Bhagwagar, Dorab Edul, Heat softening thermally conductive compositions and methods for their preparation.

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58. Zhao Liren, High temperature PTC device and conductive polymer composition.

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59. Zhao Liren, High temperature PTC device and conductive polymer composition.

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60. Zhao Liren, High temperature PTC device comprising a conductive polymer composition.

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61. Butler Kurt I., Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds.

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62. Kurt I. Butler, Highly conductive molding compounds for use as fuel cell plates and the resulting products.

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63. Butler, Kurt I., Highly conductive molding compounds having an increased distribution of large size graphite particles.

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64. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Housing for electromagnetic interference shielding.

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65. Ichikawa, Steven; Mekdhanasarn, Boonmi; Ahmed, Abdul R., Integrated ESD protection method and system.

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66. Steven Ichikawa ; Boonmi Mekdhanasarn ; Abdul R. Ahmed, Integrated ESD protection method and system.

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67. Whitney, Steven J.; Maercklein, Nate; Deblieck, Rob; Davidson, Scott, Integrated electrostatic discharge and overcurrent device.

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68. Cheng,Chih Min; Collins,Andrew, Low stress conductive adhesive.

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69. van den Berg Eduard Aarts,NLX ; Bailly Christian Maria Emile ; Fortuyn Johannes Everardus,NLX ; van der Ree Marinus Cornelis Adriaan,NLX ; Venderbosch Robert Walter,NLX ; Viersen Frits Jan,NLX ; de W, Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent.

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70. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F. ; Xie John Y., Method and structure to interconnect traces of two conductive layers in a printed circuit board.

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71. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for controlling the viscosity of a fluid in a defined volume.

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72. Hall, Tom J.; Weber, Michael J., Method for heat treating PTC devices.

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73. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for heating a solid surface such as a floor, wall, or countertop surface.

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74. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for heating a solid surface such as a floor, wall, roof, or countertop surface.

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75. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for heating a solid surface such as a floor, wall, roof, or countertop surface.

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76. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for heating a solid surface such as a floor, wall, roof, or countertop surface.

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77. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for heating a tooling die.

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78. Miller Charles G. ; Rolls John A., Method for heating the surface of a food receptacle.

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79. Miller Charles G. ; Rolls John A., Method for heating the surface of an antenna dish.

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80. Hogge Steven Darryl ; Zhang Mengruo,HKX ; Straker Gary ; Gratzinger Paul G. ; Wisner Duane, Method for manufacturing surface mount conductive polymer devices.

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81. Miller Charles G. ; Rolls John A. ; Hastings Otis H., Method for preventing biofouling in aquatic environments.

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82. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Method for providing discharge protection or shielding.

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83. Angelopoulos Marie ; Brusic Vlasta A. ; Graham Teresita Ordonez ; Purushothaman Sampath ; Saraf Ravi F. ; Shaw Jane Margaret ; Roldan Judith Marie ; Viehbeck Alfred, Method for providing discharge protection or shielding.

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84. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Xie John Y., Method for supporting one or more electronic components.

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85. Wartenberg Mark F. ; Lahlouh John G. ; Toth James, Method of making a conductive polymer composition.

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86. Toth James ; Wartenberg Mark F. ; Bannick Mark, Method of making an electrical device comprising a conductive polymer.

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87. Galla, Matthew P., Method of making electrical devices having an oxygen barrier coating.

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88. Shaw ; Jr. Philip C. ; Randle Donna L. ; Weber Michael J. ; Hoss Michael J. ; Hall Tom J., Method of manufacturing a PTC circuit protection device.

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89. Keulen Jan P. H.,NLX ; Janssen Joseph M. H.,NLX ; Van Nuus Martin A.,NLX, Mixing apparatus for mixing thermosetting and thermoplastic resin blends prior to molding.

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90. Funke, Herbert; Brandes, Jens; Meyer, Jan, Molding tool for original shaping or reshaping of components composed of materials that can be thermally influenced.

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91. Lan James J. D. ; Chiang Steve S. ; Wu Paul Y. F. ; Xie John Y., Multilayer board having insulating isolation rings.

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92. Barrett Andrew Brian,IEX, Multilayer conductive polymer device and method of manufacturing same.

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93. Barrett Andrew Brian,IEX ; Walsh Denis,IEX, Multilayer conductive polymer device and method of manufacturing same.

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94. Hogge Steven Darryl, Multilayer conductive polymer positive temperature coefficent device.

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95. Hogge Steven Darryl, Multilayer conductive polymer positive temperature coefficient device.

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96. Jackson, William Carl; McWilliams, Douglas Stephens, Multilayered packaging materials for electrostatic applications.

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97. Mori,Yukie; Shirai,Satoshi; Handa,Tokuhiko, Organic positive temperature coefficient thermistor.

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98. Mori,Yukie, Organic positive temperature coefficient thermistor device.

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99. Sonnenschein, Mark F.; Webb, Steven P.; Wendt, Benjamin L.; Harrington, Daniel D., Organoborane amine complex polymerization initiators and polymerizable compositions.

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100. Shaw ; Jr. Philip C. ; Randle Donna L. ; Weber Michael J. ; Hoss Michael J. ; Hall Tom J., PTC circuit protection device and manufacturing process for same.

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101. Shaw ; Jr. Philip C. (Elk Grove Village IL) Stein Paul Charles (Schaumburg IL), PTC electrical device having fuse link in series and metallized ceramic electrodes.

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102. Bezama Raschid J. ; Cohn Michael A. ; Fasano Benjamin V. ; Johnson Gregory M. ; Rita Robert A. ; Vallabhaneni Rao V. ; Wier-Cavalieri Nancy A., Pastes for improved substrate dimensional control.

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103. Anderson Gregory J. ; Charles Scott B. ; Kropp Michael A., Polyimide hybrid adhesives.

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104. Arai, Nobuyuki; Natsume, Norimitsu; Yoshioka, Kenichi; Kawasaki, Junko; Takezaki, Hiroshi, Prepreg and carbon fiber reinforced composite materials.

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105. James D. B. Smith ; Karl F. Schoch, Jr., Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers.

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106. Lundgard Richard A., Process for the preparation of electromotively coated filled thermoset articles.

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107. Kurt I. Butler ; Daniel G. Thomas, Process of injection molding highly conductive molding compounds and an apparatus for this process.

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108. Nathan Richard J. ; Lan James J. D. ; Chiang Steve S., Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect.

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109. Lan James J. D. ; Chiang Steve S. ; Shepherd William H. ; Wu Paul Y. F., Programmable/reprogrammable structure using fuses and antifuses.

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110. Mori,Yukie; Shirai,Satoshi, Resin composition for forming thermistor body, and thermistor.

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111. Kawata Noriaki,JPX ; Yamada Yoji,JPX ; Iguchi Yasushi,JPX, Roller for fixing toner and method for manufacturing same.

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112. Chiang Justin N. ; Toth James ; Beadling William C., Sensor.

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113. Jialanella,Gary L.; Ristoski,Toni, Stabilized organoborane polymerization initiators and polymerizable compositions.

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114. Lawrence Li TW; Daniel Grindell ; Hugo Chang TW, Surface mount conductive polymer device.

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115. Montoya, Wayne; Navarro, Luis A.; Walsh, Cecilia A.; Mikolajczak, Adrian P., Surface mount multi-layer electrical circuit protection device with active element between PPTC layers.

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116. Montoya, Wayne; Navarro, Luis A.; Walsh, Cecilia A.; Mikolajczak, Adrian P., Surface mount multi-layer electrical circuit protection device with active element between PPTC layers.

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117. McGuire Katherine M. ; Luciano Honorio, Surface mountable electrical device comprising a PTC and fusible element.

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118. Chandrakant M. Yagnik ; Roy E. Barth ; R. Knox Pitzer, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.

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119. Yagnik, Chandrakant M.; Barth, Roy E.; Pitzer, R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.

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120. Yagnik,Chandrakant M.; Barth,Roy E.; Pitzer,R. Knox, Thermally-conductive, electrically non-conductive heat transfer material and articles made thereof.

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121. Alan D. Gardner ; Andrew J. Miller GB; John A. Rolls ; Jeff R. Parkin, Thermoplastic laminate fabric heater and methods for making same.

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122. Dang, Bing; Gelorme, Jeffrey D.; Knickerbocker, John U., Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding.

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123. Wong Alex,HKX, Two-step process for preparing positive temperature coefficient polymer materials.

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124. Karunaratne, Nirupama, UV photoactivatable curable paint formulations and cured coatings thereof.

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125. Shepherd William H. ; Chiang Steve S. ; Xie John Y., Use of conductive particles in a nonconductive body as an integrated circuit antifuse.

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126. Harris,Edwin James; Davidson,Scott; Perry,David; Whitney,Steven J., Voltage variable material for direct application and devices employing same.

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