이 특허를 인용한 특허 (49)

1. Tolles, Robert D., Apparatus for making a polishing pad with a partial adhesive coating.

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2. Khachatryan, Hayk, Apparatus for temporary bonding of substrate on a carrier and method thereof.

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3. Andry, Paul S.; Sprogis, Edmund J.; Tsang, Cornelia K., CMOS structure and method of manufacture.

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4. Andry, Paul S.; Sprogis, Edmund J.; Tsang, Cornelia K., CMOS structure on replacement substrate.

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5. Chung, Kevin Kwong-Tai, Carrier tape.

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6. Doany, Fuad E.; Narayan, Chandrasekhar, Damage-free self-limiting through-substrate laser ablation.

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7. Kim, Tae-Woong; An, Sung-Guk; Jin, Dong-un; Kim, Hyung-Sik; Kim, Young-Gu; Seo, Sang-Joon, Flexible display and method for manufacturing the same.

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8. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Norcott, Maurice Heathcote; Shih, Da Yuan; Walker, George Frederick, High density integrated circuit apparatus, test probe and methods of use thereof.

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9. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Maurice Heathcote Norcott ; Da-Yuan Shih ; George Frederick Walker, High density integrated circuit apparatus, test probe and methods of use thereof.

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10. Farooq Mukta S. ; Kotecki David E. ; Rita Robert A. ; Rossnagel Stephen M., High temperature, conductive thin film diffusion barrier for ceramic/metal systems.

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11. Peter A. Franklin ; Arthur G. Merryman ; Rajesh S. Patel ; Thomas A. Wassick, Inherently robust repair process for thin film circuitry using UV laser.

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12. Franklin, Peter A.; Merryman, Arthur G.; Patel, Rajesh S.; Wassick, Thomas A., Inherently robust repair process for thin film circuitry using uv laser.

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13. Tanaka Shinji,JPX, Laminate organic resin wiring board and method of producing the same.

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14. Sheats,James; Nguyen,Tue, Lamination and delamination technique for thin film processing.

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15. Ono, Yoshihiro, METHOD OF TRANSCRIBING A WIRING PATTERN FROM AN ORIGINAL SUBSTRATE TO A SUBSTRATE WITH CLOSELY MATCHED THERMAL EXPANSION COEFFICIENTS BETWEEN BOTH SUBSTRATES FOR DIMENSIONAL CONTROL OF THE TRANSCRIBE.

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16. Morisue, Masafumi; Watanabe, Ryosuke; Maruyama, Junya; Yamada, Daiki, Manufacturing method of semiconductor device.

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17. Ogita, Kaori; Tamura, Tomoko, Manufacturing method of semiconductor device including peeling step.

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18. Budd, Russell A.; Dang, Bing; Knickerbocker, John U., Method and apparatus for laser dicing of wafers.

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19. Magerlein, John H.; Patel, Chirag S.; Sprogis, Edmund J.; Stoller, Herbert I., Method and manufacture of silicon based package and devices manufactured thereby.

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20. Khachatryan, Hayk, Method for manufacturing display device.

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21. McAllister Michael ; Perfecto Eric Daniel ; McDonald James ; Prasad Keshav ; Robbins Gordon J. ; Prasad Chandrika ; Swaminathan Madhavan ; White George Eugene, Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages.

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22. Schofield Kevin H., Method of laser ablation of semiconductor structures.

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23. Brofman, Peter J.; Daves, Glenn G.; Ray, Sudipta K.; Stoller, Herbert I., Method of manufacture of silicon based package.

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24. Magerlein,John H.; Patel,Chirag S.; Sprogis,Edmund J.; Stoller,Herbert I., Method of manufacture of silicon based package and devices manufactured thereby.

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25. Codding, Steven R.; Krywanczyk, Timothy C.; Neary, Timothy E.; Sprogis, Edmund J., Method of thinning a semiconductor substrate.

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26. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out.

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27. Farnworth, Warren M.; Wood, Alan G., Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods.

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28. Farnworth, Warren M.; Wood, Alan G., Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods.

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29. Yu Roy ; Prasad Chandrika ; Pennacchia John R. ; Hamel Harvey C., Multiple-plane pair thin-film structure and process of manufacture.

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30. Yoshimura, Tetsuzo; Takahashi, Yasuhito; Roman, James; McCormack, Mark Thomas; Beilin, Solomon I.; Wang, Wen-chou Vincent; Inao, Masaaki, Optical coupling structures and the fabrication processes.

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31. Pogge, H. Bernhard; Prasad, Chandrika; Yu, Roy, Process for making fine pitch connections between devices and structure made by the process.

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32. Pogge,H. Bernhard; Prasad,Chandrika; Yu,Roy, Process for making fine pitch connections between devices and structure made by the process.

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33. Caillat Patrice,FRX ; Henry David,FRX, Process for manufacturing an interconnection substrate to connect a chip onto a reception substrate.

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34. Kelly Kimberley A. ; Malhotra Ashwani K. ; Perfecto Eric D. ; Yu Roy, Process for releasing a thin-film structure from a substrate.

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35. Kelly Kimberley A. ; Malhotra Ashwani K. ; Perfecto Eric D. ; Yu Roy, Process for transferring a thin-film structure to a substrate.

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36. Kelly Kimberley A. ; Malhotra Ashwani K. ; Perfecto Eric D. ; Yu Roy, Process for transferring a thin-film structure to a temporary carrier.

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37. Osamu Yokoyama JP; Tatsuya Shimoda JP; Satoru Miyashita JP, Projector and method of manufacturing a light modulation device.

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38. Yokoyama, Osamu; Shimoda, Tatsuya; Miyashita, Satoru, Projector and method of manufacturing a light modulation device.

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39. Franklin Peter A. ; Hendricks Charles J. ; Surprenant Richard P. ; Tirch ; III Stephen J. ; Wassick Thomas A. ; Wood James P., Seed metal delete process for thin film repair solutions using direct UV laser.

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40. Pratt, David S., Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices.

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41. Pratt, David S., Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices.

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42. Pratt, David S., Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices.

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43. Yoshimura, Tetsuzo; Takahashi, Yasuhito; Roman, James; Beilin, Solomon I.; Wang, Wen-chou Vincent; Inao, Masaaki, Single and multilayer waveguides and fabrication process.

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44. Yang, Chih-kuang, Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure.

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45. Yang, Chih-kuang, Substrate with multi-layer interconnection structure and method of manufacturing the same.

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46. Smith, Gordon C., Very ultra thin conductor layers for printed wiring boards.

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47. Smith, Gordon C., Very ultra thin conductor layers for printed wiring boards.

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48. Gordon Smith, Very ultra thin conductor-layers for printed wiring boards.

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49. Caletka,David Vincent; Park,Seungbae; Sathe,Sanjeev Balwant, Wafer scale thin film package.

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