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Continuous process for the manufacture of substrates for printed wire boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/02
  • H05K-003/46
  • B32B-031/20
출원번호 US-0989736 (1992-12-10)
우선권정보 NL-0002080 (1990-09-24)
발명자 / 주소
  • Middelman Erik (Arnhem NLX)
출원인 / 주소
  • Akzo nv (Arnhem NLX 03)
인용정보 피인용 횟수 : 27  인용 특허 : 11

초록

A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres and the fibres are positioned in at least two crossing directions, whereupon the filaments layers p

대표청구항

A continuous process for the manufacture of a printed wire board from a fiber-reinforced matrix, the continuous process comprising a laying stage in which at least two layers of wholly unbonded unwoven threads of reinforcing fibers are superposed and laid on a transport element moving in a plane con

이 특허에 인용된 특허 (11)

  1. Eggers Eugene A. (Binghamton NY) Summa William J. (Endwell NY), Continuous process for the manufacture of printed circuit boards.
  2. Barrell David (10148 Green St. Temple City CA 91780) Kennedy Donald E. (4960 Cutler Ave. Baldwin Park CA 91706) Rollen Donald C. (5577 Riverdale Dr. Railto CA 92376), Copper-clad polyester-epoxy-glass fiber laminates using zinc-coated copper.
  3. Dunbar, Sidney G., Highly dispersed continuous glass fiber mats.
  4. Cave Brian J. (Formby GB2) Holmes William B. (Wallasey GB2), Method and apparatus for incorporating a filament into a plastic containing sheet.
  5. Krueger, Ronald G., Method and apparatus for production of bias fabrics.
  6. Krueger Ronald G. (Sparks NV), Method for the production of bias fabrics.
  7. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board for ceramic chip carriers.
  8. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board structure.
  9. Kobayashi Hiroyasu (Suita JPX) Inoue Akihisa (Hirakata JPX) Tsujii Katsushi (Amagasaki JPX), Non-woven reinforcement for composite.
  10. Schwarz Lothar (Lindlar DEX) Ueberberg Friedel (Lindlar DEX) Kuehne Rudolf (Cologne DEX) Fischer Dieter (Cologne DEX), Process and apparatus for producing metal-laminated base material for printed circuit boards.
  11. Jensen Warren M. (Kirkland WA) Wilkinson William C. (Redmond WA), Thermally conductive printed wiring board laminate.

이 특허를 인용한 특허 (27)

  1. Gruenert Jan,DEX ; Vettermann Frank,DEX ; Reuchsel Dietmar,DEX ; Grenzendoerfer Dietmar,DEX ; Erth Dieter,DEX ; Fischer Jens,DEX ; Wiedenhoeft Klaus,DEX, Apparatus for supplying a multi-layer, multi-axial layer of yarn to the knitting site of a warp knitting machine.
  2. Mansour H. Mohamed ; R. Bradley Lienhart ; Pu Gu, Base material for a printed circuit board formed from a three-dimensional woven fiber structure.
  3. Min, Gui-Nam, Display device.
  4. Honda, Shiro; Sawaoka, Ryuji; Nakahara, Koyomi, Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment.
  5. Honma, Masato; Tsuchiya, Atsuki; Sawaoka, Ryuji, Fiber-reinforced composite sheet.
  6. Tsuchiya, Atsuki; Honma, Masato; Sawaoka, Ryuji, Fiber-reinforced composite sheet and integrated molding.
  7. Wunner Roland,DEX ; Maier Stefan,DEX, Method and warp knitting machine for the production of knitted fabric having a freely selectable pattern repeat.
  8. Wagener, Gert, Method for producing a multiaxial structure out of multifilament threads.
  9. Kaushal, Ramesh; Frieder, Leonard Peter; LaJesse, John; Chatterjee, Amit, Method of making a composite sheet.
  10. Borgmann, Robert E.; Beachy, Wendell; Evans, Don O.; McClard, Christina M., Methods and systems for manufacturing advanced composite components.
  11. Borgmann, Robert E.; Beachy, Wendell; Evans, Don O.; McClard, Christina M., Methods and systems for manufacturing advanced composite components.
  12. Wagener, Gert Herrn, Multiaxial complex.
  13. Okamoto, Keishiro; Kurashina, Mamoru; Abe, Tomoyuki, Multilevel interconnection board and method of fabricating the same.
  14. Bergstedt, Leif; Ligander, Per; Boustedt, Katarina, Printed board assembly and method of its manufacture.
  15. Nakatani Seiichi,JPX, Printed circuit board and method for the manufacture of same.
  16. Taggart, David, Process and equipment for manufacture of advanced composite structures.
  17. Taggart, David, Process and equipment for manufacture of advanced composite structures.
  18. Taggart, David, Process and equipment for manufacture of advanced composite structures.
  19. Taggart,David, Process and equipment for manufacture of advanced composite structures.
  20. Booher Benjamin, Pultrusion method of making composite friction units.
  21. Booher Benjamin V. (Scottsdale AZ), Pultrusion method of making composite friction units.
  22. Cramer, David R.; Evans, Don O.; McClard, Christina M.; Weinman, Dennis L., System and method for making advanced composite laminates.
  23. Cramer, David R.; Beidleman, Neal J.; Chapman, Colin R.; Evans, Don O.; Passmore, Michael K.; Skinner, Michael L., System and method for the rapid, automated creation of advanced composite tailored blanks.
  24. Cramer, David R.; Beidleman, Neal J.; Chapman, Colin R.; Evans, Don O.; Passmore, Michael K.; Skinner, Michael L., System and method for the rapid, automated creation of advanced composite tailored blanks.
  25. Cramer, David R.; Beidleman, Neal J.; Chapman, Colin R.; Evans, Don O.; Passmore, Michael K.; Skinner, Michael L., System and method for the rapid, automated creation of advanced composite tailored blanks.
  26. Cramer, David R.; Beidleman, Neal J.; Chapman, Colin R.; Evans, Don O.; Passmore, Michael K.; Skinner, Michael L., System and method for the rapid, automated creation of advanced composite tailored blanks.
  27. Miyasato Keita,JPX ; Sato Eiji,JPX, Woven glass fabrics and laminate for printed wiring boards.
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