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Integrated heat pipe and circuit board structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0953080 (1992-09-29)
발명자 / 주소
  • Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ)
출원인 / 주소
  • International Business Machines, Inc. (Armonk NY 02)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록 ▼

A heat pipe structure is incorporated directly into the metal baseplate of a circuit card thereby eliminating thermal contact resistance between the baseplate and the heat pipe assembly. Components are mounted on a copper circuit layer bonded to a dielectric layer in a first portion of the baseplate

대표청구항 ▼

A metal-backed printed circuit board with electronic components mounted thereon for use in electronic circuits such as power supplies, comprising: a metallic flat baseplate for said printed circuit board; a flat heat pipe structure including a frame incorporated into direct contact with said basepla

이 특허를 인용한 특허 (72)

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