[특허]Heat sink plate for multiple semi-conductors

Heat sink plate for multiple semi-conductors 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0937470 (1992-08-28)
발명자 / 주소	Villaume Henry F. (Intervale NH)
출원인 / 주소	Aavid Engineering, Inc. (Laconia NH 02)
인용정보	피인용 횟수 : 59 인용 특허 : 0

초록 ▼

A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with the semiconductors on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board.

대표청구항 ▼

A heat sink dissipating heat from one or more semiconductors on a printed circuit board comprising: a plate having a top surface and a bottom surface, said plate being made of heat conductive material and having said bottom surface contacting the semiconductors to be cooled, said plate having at least one chimney means, each said chimney means including a tapered sidewall defining a first opening in said plate and a smaller second opening away from said plate, so as to convect heated air from the area adjacent to said bottom surface of said plate to the area adjacent to said top surface, attachment means connecting said bottom surface of said plate to the semiconductors so that said plate conducts heat generated by the semiconductors when the semiconductors are in operation, and connecting means connecting said plate to a printed circuit board.

이 특허를 인용한 특허 (59)

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Kirstine, Rodney L., Heat-dissipating assemblies and methods of assembling heat-dissipating assemblies.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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연합인증

Heat sink plate for multiple semi-conductors 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (59)

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연합인증

Heat sink plate for multiple semi-conductors 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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이 특허를 인용한 특허 (59)

관련 콘텐츠

특허 원문 보기

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