[특허]Multi-chamber wafer process equipment having plural, physically communicating transfer means

[미국특허] Multi-chamber wafer process equipment having plural, physically communicating transfer means 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-016/00 A61K-027/02
출원번호	US-0818535 (1992-01-09)
우선권정보	JP-0001316 (1991-01-10); JP-0005428 (1991-01-22); JP-0010652 (1991-01-31)
발명자 / 주소	Sato Junichi (Tokyo JPX) Hasegawa Toshiaki (Kanagawa JPX) Komatsu Hiroshi (Kanagawa JPX)
출원인 / 주소	Sony Corporation (Tokyo JPX 03)
인용정보	피인용 횟수 : 195 인용 특허 : 0

초록 ▼

In a multi-chamber process equipment in which a plurality of process chambers for processing a single wafer are connected with a wafer transfer chamber in parallel through respective gate valves, and a wafer transfer means is provided for carrying the wafer between the wafer transfer chamber and each process chamber through one of the gate valves, there are further provided a plurality of vacuum pumps in order to prevent cross contamination among processes, improve throughput and prevent condensation in the process chambers. The vacuum pumps are connected with the wafer transfer chamber, and designed to reduce the pressure in the wafer transfer chamber to different vacuum levels. Therefore, the degree of vacuum in the wafer transfer chamber can be set at a desired value according to the process chamber to be opened, by operating the vacuum pumps properly, so that cross contamination between the wafer transfer chamber and the process chambers is prevented effectively.

대표청구항 ▼

A multi-chamber process equipment comprising: a wafer transfer chamber for wafer transfer; a plurality of process chambers for processing a wafer; a plurality of gate valves each of which connects a unique one of said process chambers with said wafer transfer chamber so that said process chambers are connected with said wafer transfer chamber in parallel to one another; and a plurality of wafer transfer means for transferring the wafer between said wafer transfer chamber and one of said process chambers through one of said gate valves, each of said wafer transfer means being placed in said wafer transfer chamber, each of said wafer transfer means being provided for a unique one of said process chambers so that each of said wafer transfer means is assigned to a unique one of said process chambers; whereby each of said transfer means is capable of transferring a wafer directly to any other of said transfer means.

이 특허를 인용한 특허 (195) 인용/피인용 타임라인 분석

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van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
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Wang,Hougong; Ngan,Kenny King Tai; Xu,Zheng, Semiconductor wafer preheating.
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Takayama, Toru; Yamazaki, Shunpei; Akimoto, Kengo, Silicon nitride film and semiconductor device.
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Takayama,Toru; Yamazaki,Shunpei; Akimoto,Kengo, Silicon nitride film and semiconductor device, and manufacturing method thereof.
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Takayama, Toru; Yamazaki, Shunpei; Akimoto, Kengo, Silicon nitride film, and semiconductor device.
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Takayama, Toru; Yamazaki, Shunpei; Akimoto, Kengo, Silicon nitride film, and semiconductor device.
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Takayama, Toru; Yamazaki, Shunpei; Akimoto, Kengo, Silicon nitride film, and semiconductor device and method of manufacturing the same.
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Glenn, W. Benjamin; Verplancken, Donald J., Simultaneous cyclical deposition in different processing regions.
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van der Meulen, Peter, Stacked process modules for a semiconductor handling system.
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van der Meulen,Peter, Stacked process modules for a semiconductor handling system.
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Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
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Yonemizu, Akira; Kojima, Shigeyoshi, Substrate processing apparatus and substrate processing method.
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Ouellet Luc,CAX ; Tremblay Yves,CAX ; Gendron Luc,CAX, Substrate processing apparatus with non-evaporable getter pump.
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Edo,Ryo, Substrate processing apparatus, method of controlling substrate, and exposure apparatus.
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Fairbairn, Kevin P.; Barnes, Michael S.; Bluck, Terry; Xu, Ren; Liu, Charles; Kerns, Ralph, System and method for commercial fabrication of patterned media.
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Barnes, Michael S.; Bluck, Terry, System and method for dual-sided sputter etch of substrates.
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Barnes, Michael S.; Bluck, Terry, System and method for dual-sided sputter etch of substrates.
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Xi, Ming; Yang, Michael; Zhang, Hui, System and method for forming an integrated barrier layer.
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Begin Robert George ; Clarke Peter J., System for providing a controlled deposition on wafers.
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Chan, Chung, System for the plasma treatment of large area substrates.
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Chung Chan, System for the plasma treatment of large area substrates.
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Nagashima, Makoto, Systems and methods for fabricating self-aligned memory cell.
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Takayama, Toru; Yamazaki, Shunpei; Akimoto, Kengo, Thin film semiconductor device having silicon nitride film.
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Forrest, Stephen R.; Thompson, Mark E.; Burrows, Paul E.; Bulovic, Vladimir; Gu, Gong, Transparent contacts for organic devices.
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Wang, Shulin; Kroemer, Ulrich; Luo, Lee; Chen, Aihua; Li, Ming, Tungsten nitride atomic layer deposition processes.
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Wang,Shulin; Kroemer,Ulrich; Luo,Lee; Chen,Aihua; Li,Ming, Tungsten nitride atomic layer deposition processes.
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Tepman Avi ; Lowrance Robert B., Two-piece slit valve insert for vacuum processing system.
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Lu,Siqing; Chang,Yu; Sun,Dongxi; Dang,Vinh; Yang,Michael X.; Chang,Anzhong (Andrew); Nguyen,Anh N.; Xi,Ming, Valve control system for atomic layer deposition chamber.
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Lee, Sang-Hyeob; Gelatos, Avgerinos V.; Wu, Kai; Khandelwal, Amit; Marshall, Ross; Renuart, Emily; Lai, Wing-Cheong Gilbert; Lin, Jing, Vapor deposition of tungsten materials.
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White, Carl L.; Shero, Eric, Vapor flow control apparatus for atomic layer deposition.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

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[미국특허] Multi-chamber wafer process equipment having plural, physically communicating transfer means 원문보기

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[미국특허] Multi-chamber wafer process equipment having plural, physically communicating transfer means 원문보기

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이 특허를 인용한 특허 (195) 인용/피인용 타임라인 분석

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