이 특허를 인용한 특허 (75)

1. Shri Singhvi ; Suraj Rengarajan ; Peijun Ding ; Gongda Yao, Barrier applications for aluminum planarization.

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2. Singhvi Shri ; Rengarajan Suraj ; Ding Peijun ; Yao Gongda, Barrier applications for aluminum planarization.

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3. Briggs, Benjamin D.; Clevenger, Lawrence A.; Peethala, Cornelius Brown; Rizzolo, Michael; Yang, Chih-Chao, Barrier layers in trenches and vias.

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4. Flanagan, Aiden, Bioabsorbable metal medical device and method of manufacture.

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5. Atanasoska, Liliana; Weber, Jan; Warner, Robert W., Bioerodible endoprostheses and methods of making the same.

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6. Atanasoska, Liliana; Weber, Jan; Warner, Robert W.; Grovender, Amy, Bioerodible endoprostheses and methods of making the same.

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7. Boismier, Dennis A.; Girton, Timothy S.; Larsen, Steven R.; Shedlov, Matt; Merdan, Ken; O'Brien, Barry, Bioerodible endoprostheses and methods of making the same.

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8. Weber, Jan, Bioerodible endoprostheses and methods of making the same.

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9. Radhakrishnan, Rajesh; Chandrasekaran, Chandru; Schewe, Scott R.; Merdan, Ken, Bioerodible endoprosthesis.

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10. Weber, Jan, Bioerodible endoprosthesis.

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11. Weber, Jan; Atanasoska, Liliana; Schewe, Scott, Bioerodible endoprosthesis with biostable inorganic layers.

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12. Stinson, Jonathan S., Bioerodible metallic ENDOPROSTHESES.

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13. Guo Ted ; Chen Liang ; Chen Fusen ; Mosely Roderick C., Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer.

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14. Okun, Nelya; Hill, Craig L., Compositions, materials incorporating the compositions, and methods of using the compositions, and methods of using the compositions and materials.

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15. Brown,Dirk D.; Williams,John D.; Radza,Eric M., Connector for making electrical contact at semiconductor scales.

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16. Dittmann,Larry E., Connector having staggered contact architecture for enhanced working range.

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17. Dittmann, Larry E., Contact and method for making same.

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18. Brown,Dirk D.; Williams,John D., Contact grid array formed on a printed circuit board.

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19. Williams,John D., Contact grid array system.

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20. Williams,John David, Contact grid array system.

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21. Dittmann,Larry E., Deep drawn electrical contacts and method for making.

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22. Andricacos,Panayotis; Cooper,Emanuel Israel; Dalton,Timothy Joseph; Deligianni,Hariklia; Guidotti,Daniel; Kwietniak,Keith Thomas; Steen,Michelle Leigh; Tsang,Cornelia Kang I, Deep filled vias.

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23. Roman, Jr.,Paul J.; Madsen,Harold O., Deposition of permanent polymer structures for OLED fabrication.

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24. Chen Liang-Yuh ; Tao Rong ; Guo Ted ; Mosely Roderick Craig, Dual damascene metallization.

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25. Chen Liang-Yuh ; Tao Rong ; Guo Ted ; Mosely Roderick Craig, Dual damascene metallization.

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26. Light, David Noel; Kalakkad, Dinesh Sundararajan; Nguyen, Peter Tho, Electrical connector and method of making it.

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27. Dittmann, Larry E., Electrical connector having a flexible sheet and one or more conductive connectors.

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28. Light, David Noel; Wang, Hung-Ming; Baker, David Rodney; Nguyen, Peter Tho; Pao, Dexter Shih-Wei, Electrical connector with electrical contacts protected by a layer of compressible material and method of making it.

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29. Kong, Bob; Li, Nanhai, Electroless plating solution and process.

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30. Sekiguchi, Junnosuke; Imori, Toru, Electronic component formed with barrier-seed layer on base material.

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31. Atanasoska, Liliana; Radhakrishnan, Rajesh; Arcand, Ben; Warner, Robert W., Endoprostheses.

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32. Weber, Jan, Endoprosthesis.

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33. Weber, Jan; Feng, James Q.; Atanasoska, Liliana, Endoprosthesis having a fiber meshwork disposed thereon.

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34. Weber, Jan; Atanasoska, Liliana, Endoprosthesis with three-dimensional disintegration control.

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35. Chen, Liang-Yuh; Guo, Ted; Mosley, Roderick Craig; Chen, Fusen, Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug.

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36. Chen,Liang Yuh; Guo,Ted; Mosley,Roderick Craig; Chen,Fusen, Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug.

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37. Chen Liang-Yuh ; Naik Mehul ; Guo Ted ; Mosely Roderick Craig, Integrated CVD/PVD Al planarization using ultra-thin nucleation layers.

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38. Dittmann,Larry E., Interposer and method for making same.

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39. Dittmann,Larry E., Interposer with compliant pins.

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40. Dittmann,Larry E., Interposer with compliant pins.

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41. Buynoski Matthew S., Low dielectric semiconductor device with rigid, conductively lined interconnection system.

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42. Mosely Roderick Craig ; Zhang Hong ; Chen Fusen ; Guo Ted, Low temperature integrated metallization process and apparatus.

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43. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted, Low temperature integrated metallization process and apparatus.

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44. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted; Chen, Liang-Yuh, Low temperature integrated metallization process and apparatus.

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45. Roderick Craig Mosely ; Hong Zhang ; Fusen Chen ; Ted Guo, Low temperature integrated metallization process and apparatus.

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46. Chen Liang-Yuh ; Mosely Roderick Craig ; Chen Fusen ; Tao Rong ; Guo Ted, Low temperature integrated via and trench fill process and apparatus.

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47. Girton, Timothy S., Medical devices and methods of making the same.

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48. Weber, Jan, Medical implant having NANO-crystal grains with barrier layers of metal nitrides or fluorides.

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49. Aruga Michio,JPX, Metal planarization using a CVD wetting film.

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50. Penner, Avi; Gileadi, Eilezer, Method and device for electrochemical formation of therapeutic species in vivo.

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51. Radza, Eric M.; Williams, John D., Method and system for batch forming spring elements in three dimensions.

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52. Brown, Dirk Dewar; Williams, John David; Long, William B.; Chen, Tingbao, Method and system for batch manufacturing of spring elements.

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53. Dittmann,Larry E., Method for fabricating a connector.

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54. Williams, John D., Method for fabricating a contact grid array.

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55. Uwe Seidel DE; Rainer Braun DE, Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuits.

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56. Lee, Wai M.; Maloney, David J.; Roman, Paul J.; Fury, Michael A.; Hill, Ross H.; Henderson, Clifford; Barstow, Sean, Method of and apparatus for substrate pre-treatment.

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57. Hill,Ross H.; Blair,Sharon Louise; Li,Grace; Zhang,Xin; Ruan,Haixiong, Method of depositing patterned films of materials using a positive imaging process.

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58. Maloney,David J.; Lee,Wai M.; Roman, Jr.,Paul J.; Fury,Michael A., Method of making barrier layers.

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59. Williams, John D., Method of making electrical connector on a flexible carrier.

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60. Maloney, David J.; Lee, Wai M.; Roman, Jr., Paul J.; Fury, Michael A.; Hill, Ross H., Method of making electronic materials.

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61. Ritter, Andrew P.; Heistand, II, Robert; Galvagni, John L.; Dattaguru, Sriram, Method of making multi-layer electronic components with plated terminations.

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62. Ritter, Andrew P.; Heistand, II, Robert; Galvagni, John L.; Dattaguru, Sriram, Method of making multi-layer electronic components with plated terminations.

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63. Ritter, Andrew P.; Heistand, II, Robert H.; Galvagni, John L.; Dattaguru, Sriram, Plated terminations.

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64. Chada, Venkata Gopal Reddy; Yao, Huirong; Padmanaban, Munirathna; Cho, JoonYeon; Wolfer, Elizabeth; Dioses, Alberto D.; Mullen, Salem K., Polyoxometalate and heteropolyoxometalate compositions and methods for their use.

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65. Hill, Craig L.; Xu, Ling; Rhule, Jeffrey T.; Boring, Eric A., Polyoxometalate materials, metal-containing materials, and methods of use thereof.

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66. Atanasoska, Liliana; Shippy, III, James Lee; Holman, Tom; Arney, Michael S.; Schoenle, Victor; Genovese, Frank; Feng, James Q.; Flanagan, Aiden; Weber, Jan, Self-buffering medical implants.

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67. Ted Guo ; Liang-Yuh Chen ; Mehul Naik ; Roderick C. Mosely, Single step process for blanket-selective CVD aluminum deposition.

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68. Chada, Venkata Gopal Reddy; Yao, Huirong; Mullen, Salem; Wolfer, Elizabeth; Dioses, Alberto D.; Cho, JoonYeon; Padmanaban, Munirathna, Spin coatable metallic hard mask compositions and processes thereof.

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69. Williams, John David; Radza, Eric Michael, Spring connector for making electrical contact at semiconductor scales.

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70. Brown, Dirk D.; Williams, John D.; Long, William B., Structure and process for a contact grid array formed in a circuitized substrate.

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71. Scheuermann, Torsten; Weber, Jan; Deng, Charles; Stinson, Jonathan S.; Larsen, Steven R.; Boismier, Dennis A.; Edick, Jacob D., Surface treated bioerodible metal endoprostheses.

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72. Dittmann, Larry E.; Williams, John David; Long, William B., System and method for connecting flat flex cable with an integrated circuit, such as a camera module.

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73. Dittmann, Larry E.; Williams, John D.; Long, William B., System for connecting a camera module, or like device, using flat flex cables.

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74. Li, Nanhai; Petrov, Nicolai; Kolics, Artur, Temperature control sequence of electroless plating baths.

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75. Hill,Ross H.; Roman, Jr.,Paul J.; Suh,Seigi; Zhang,Xin, Titanium carboxylate films for use in semiconductor processing.

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