$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Reduction of foreign particulate matter on semiconductor wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/306
출원번호 US-0827846 (1992-01-29)
발명자 / 주소
  • Fleming
  • Jr. Marshall J. (Underhill VT) Syverson William A. (Colchester VT) White Eric J. (Essex Junction VT)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 43  인용 특허 : 0

초록 ▼

A substantial reduction in the foreign particulate matter contamination on surfaces, such as the surfaces of semiconductor wafers, is achieved by treating the surfaces with a solution comprising a strong acid and a very small amount of a fluorine-containing compound. A preferred method employs a sol

대표청구항 ▼

A method of reducing foreign particulate matter concentration on a surface, which comprises contacting said surface with a solution comprising a strong acid and a very small amount of a fluorine-containing compound, which is effective in reducing foreign particulate matter contamination, without sig

이 특허를 인용한 특허 (43)

  1. Tanaka, Hiroshi; Hiroshiro, Koukichi; Kamimura, Fumihiro, Chemical-liquid mixing method and chemical-liquid mixing apparatus.
    상세보기
  2. Tanaka, Hiroshi; Hiroshiro, Koukichi; Kamimura, Fumihiro, Chemical-liquid mixing method and chemical-liquid mixing apparatus.
    상세보기
  3. Tanaka, Hiroshi; Hiroshiro, Koukichi; Kamimura, Fumihiro, Chemical-liquid mixing method and chemical-liquid mixing apparatus.
    상세보기
  4. Verhaverbeke, Steven; Tang, Jianshe; Gouk, Roman; Brown, Brian J.; Chen, Han-Wen; Weng, Ching-Hwa; Papanu, James S.; Yost, Dennis, Cleaning submicron structures on a semiconductor wafer surface.
    상세보기
  5. Mellies, Raimund; Boerner, Marc; Arnóld, Lucia; Barko, Andrea; Rhein, Rudolf, Composition for the removal of sidewall residues.
    상세보기
  6. Mellies,Raimund; Boerner,Marc; Arnold,Lucia; Barko,Andrea; Rhein,Rudolf, Composition for the removing of sidewall residues.
    상세보기
  7. Small Robert J. ; Cheng Jun ; Maw Taishih, Compositions for cleaning organic and plasma etched residues for semiconductors devices.
    상세보기
  8. Chao Virginia Chi-Chuen ; Estes Scott A. ; Faure Thomas B. ; Wagner Thomas M., Dilute acid rinse after develop for chrome etch.
    상세보기
  9. Kolls, H. Brock, Dynamic identification interchange method for exchanging one form of identification for another.
    상세보기
  10. Anantha R. Sethuraman ; William W. C. Koutny, Jr., Employing an acidic liquid and an abrasive surface to polish a semiconductor topography.
    상세보기
  11. O'Brien Sean C., Hydrofluoric etch quenching via a colder rinse process.
    상세보기
  12. Kolls, H. Brock, METHOD OF TRANSACTING AN ELECTRONIC MAIL, AN ELECTRONIC COMMERCE, AND AN ELECTRONIC BUSINESS TRANSACTION BY AN ELECTRONIC COMMERCE TERMINAL USING A WIRELESSLY NETWORKED PLURALITY OF PORTABLE DIGITAL .
    상세보기
  13. Asami, Taketomi; Ichijo, Mitsuhiro; Toriumi, Satoshi; Ohtsuki, Takashi; Yamazaki, Shunpei, Manufacturing method for semiconductor device.
    상세보기
  14. Asami, Taketomi; Ichijo, Mitsuhiro; Toriumi, Satoshi; Ohtsuki, Takashi; Yamazaki, Shunpei, Manufacturing method for semiconductor device.
    상세보기
  15. Asami,Taketomi; Ichijo,Mitsuhiro; Toriumi,Satoshi; Ohtsuki,Takashi; Yamazaki,Shunpei, Manufacturing method for semiconductor device.
    상세보기
  16. Hymes Diane J. ; Ravkin Michael ; Zhang Xiuhua ; Krusell Wilbur C., Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF).
    상세보기
  17. Hempel Eugene O. (Garland TX), Method and system for chemical mechanical polishing of semiconductor wafer.
    상세보기
  18. Rotondaro, Antonio Luis Pacheco; Chambers, James Joseph, Method for the selective removal of high-k dielectrics.
    상세보기
  19. Oonishi Teruhito,JPX ; Idota Ken,JPX ; Niwa Masaaki,JPX ; Harada Yoshinao,JPX, Method of cleaning semiconductor device.
    상세보기
  20. Kolls, H. Brock, Method of constructing a digital content play list for transmission and presentation on a public access electronic terminal.
    상세보기
  21. Chao, Virginia Chi-Chuen; Estes, Scott A.; Faure, Thomas B.; Wagner, Thomas M., Method of inhibiting contaminants using dilute acid rinse.
    상세보기
  22. Gilboa, Yitzhak; Koutny, Jr., William W. C.; Hedayati, Steven; Ramkumar, Krishnaswamy, Method of making a planarized semiconductor structure.
    상세보기
  23. Virginia Chi-Chuen Chao ; Scott A. Estes ; Thomas B. Faure ; Thomas M. Wagner, Method of minimizing contaminating deposits using dilute acid rinse.
    상세보기
  24. Kolls, H. Brock, Method of transacting an electronic mail, an electronic commerce, and an electronic business transaction by an electronic commerce terminal operated on a transportation vehicle.
    상세보기
  25. Ravi Iyer ; Ardavan Niroomand, Method to clean substrate and improve photoresist profile.
    상세보기
  26. Kolls, H. Brock, Method to obtain customer specific data for public access electronic commerce services.
    상세보기
  27. Bergman Eric J., Methods for cleaning semiconductor surfaces.
    상세보기
  28. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
    상세보기
  29. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
    상세보기
  30. Asami, Taketomi; Ichijo, Mitsuhiro; Toriumi, Satoshi; Ohtsuki, Takashi; Yamazaki, Shunpei, Methods of removing contaminant impurities during the manufacture of a thin film transistor by applying water in which ozone is dissolved.
    상세보기
  31. Sethuraman, Anantha R.; Seams, Christopher A., Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect.
    상세보기
  32. Grant Donald C. (Excelsior MN), Point-of-use recycling of wafer cleaning substances.
    상세보기
  33. Oikari James R. ; Olson Erik D., Process for enhanced photoresist removal in conjunction with various methods and chemistries.
    상세보기
  34. Larry W. Shive ; Carissima M. Vitus, Process for the removal of copper and other metallic impurities from silicon.
    상세보기
  35. Arndt Russell H. ; Gale Glenn Walton ; Kern ; Jr. Frederick William ; Madden Karen P. ; Okorn-Schmidt Harald F. ; Ouimet ; Jr. George Francis ; Salgado Dario ; Wuthrich Ryan Wayne, Process for treating a semiconductor substrate.
    상세보기
  36. Russell H. Arndt ; Glenn Walton Gale ; Frederick William Kern, Jr. ; Karen P. Madden ; Harald F. Okorn-Schmidt ; George Francis Ouimet, Jr. ; Dario Salgado ; Ryan Wayne Wuthrich, Process for treating a semiconductor substrate.
    상세보기
  37. Okorn-Schmidt, Harald; Frank, Dieter; Kumnig, Franz, Process for treating a semiconductor wafer.
    상세보기
  38. Weng Fu-Tien,TWX ; Lee Chih-Hsiung,TWX, Reducing nitride residue by changing the nitride film surface property.
    상세보기
  39. Koutny, Jr., William W. C., Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer.
    상세보기
  40. Liaw, Ming-Chi; Chao, Tien-Sheng; Lei, Tan-Fu, Solutions and processes for removal of sidewall residue after dry etching.
    상세보기
  41. Allen, Randall R.; Knocke, James; Parker, III, Carleton J.; York, Jason; Didato, Dean T., Synergy of strong acids and peroxy compounds.
    상세보기
  42. Sethuraman Anantha R. ; Koutny ; Jr. William W. C., System for cleaning a surface of a dielectric material.
    상세보기
  43. Kolls, H. Brock, Universal interactive advertizing and payment system for public access electronic commerce and business related products and services.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로