[특허]High conductivity hydrid material for thermal management

High conductivity hydrid material for thermal management 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20 B32B-003/00
출원번호	US-0836130 (1992-02-14)
발명자 / 주소	Kibler John J. (Lansdale PA) Cassin Thomas G. (Prospectville PA)
출원인 / 주소	Materials Science Corporation (Blue Bell PA 02)
인용정보	피인용 횟수 : 28 인용 특허 : 0

초록 ▼

A hybrid structural material combines high thermal conductivity and pre-determined mechanical properties compatible with adjacent or attached materials. It has three elements: (1) a non-structural, high thermal conductivity core material which defines the thermal conductivity of the hybrid structural material; (2) a pair of face sheets, which form opposing surfaces of the hybrid structural material and help to define its mechanical properties, disposed on opposite sides of the core material to create a face sheet-core material-face sheet sandwich construction; and (3) a frame substantially surrounding the core material and bonded to the face sheets for helping to define (along with the face sheets) the mechanical properties of the hybrid structural material. The interfaces between the face sheets and the core material allow physical contact, but prevent structural interaction, between the face sheets and the core material. Consequently, the hybrid structural material achieves a high fraction of the thermal conductivity of the core material while maintaining the thermal expansion (and other mechanical properties) of the face sheets and frame.

대표청구항 ▼

A hybrid structural material for mounting electronic components and transferring heat generated by the electronic components and combining high thermal conductivity and mechanical properties independently selected to be compatible with adjacent electronic components, said hybrid structural material comprising: a non-structural, high thermal conductivity core material chosen from the group consisting of highly ordered pyrolytic graphite, compression annealed pyrolytic graphite, and synthetic diamond, having an in-plane isotropic thermal conductivity greater than 750 W/m-K, and defining the thermal conductivity of said hybrid structural material; a pair of face sheets forming opposing surfaces of said hybrid structural material and helping to define the mechanical properties of said hybrid structural material, the first of said face sheets disposed on one side of said core material and the second of said face sheets disposed on the opposite side of said core material to create a face sheet-core material-face sheet sandwich construction; a first interface between said first face sheet and said core material allowing physical contact between said first face sheet and said core material and sallowing said first face sheet to slide over said core material on heating and cooling; a second interface between said second face sheet and said core material allowing physical contact between said second face sheet and said core material and allowing said second face sheet to slide over said core material on heating and cooling; and a frame substantially surrounding said core material and bonded to said face sheets for helping to define the mechanical properties of said hybrid structural material.

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Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
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Rowe, Michael Paul, Heat transfer systems including heat conducting composite materials.
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Dando, III, Charles H.; Larcheveque, Jon; Vos, David L., High performance large tolerance heat sink.
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Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
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Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
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Ali, Mir Akbar; Peterson, Carl W., Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly.
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Kramer Jesse J. ; Madura Jeffrey R. ; Smith Carl Richard, Printed wiring board structure having continuous graphite fibers.
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Carl R. Smith ; Jeffrey R. Madura ; Jesse J. Kramer, Printed wiring board structure with integral metal matrix composite core.
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Gandi, Angelo; De Oliveira, Rui; Carter, Anthony Arthur, Thermal management device and method of making such a device.
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Gandi, Angelo; De Oliveira, Rui; Carter, Anthony Arthur, Thermal management device and method of making such a device.
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Cornie, James A.; Montesano, Mark; Cornie, Stephen S.; Pokharna, Himanshu, Thermally conductive graphite reinforced alloys.
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Herzl Alfred, Thermally conductive support structure.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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High conductivity hydrid material for thermal management 원문보기

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High conductivity hydrid material for thermal management 원문보기

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