[특허]Electronics package with improved thermal management by thermoacoustic heat pumping

[미국특허] Electronics package with improved thermal management by thermoacoustic heat pumping 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F25B-009/00
출원번호	US-0969709 (1992-10-29)
발명자 / 주소	Chrysler Gregory M. (Poughkeepsie NY) Vader David T. (New Paltz NY)
출원인 / 주소	International Business Machines Corp. (Armonk NY 02)
인용정보	피인용 횟수 : 59 인용 특허 : 0

초록 ▼

Electronic chips are cooled to an efficient operating temperature by engaging their exposed planar surfaces with a heat sink assembly. The heat sink assembly is a part of the cold end heat sink of a thermoacoustic heat pump that utilizes either traveling wave or standing wave heat pumping to transport heat from the cold end heat exchanger to the warm end heat exchanger, utilizing a coaxial pulse tube refrigerator to pump or transport the heat from the electronic chips and the cold end heat exchanger.

대표청구항 ▼

A thermoacoustic refrigeration unit for cooling an electronic chip comprising: a tube having first and second ends and having an interior and an exterior; an annular chamber surrounding said tube, said annular chamber comprising a regenerator chamber and a compression chamber; said regenerator chamber communicatively connected to said tube at a first end of said tube; a compression means at least partially disposed within said compression chamber and at least partially moveable from a first position to a second position; a surge reservoir communicatively connected to said tube at said second end of said tube; said second end of said tube comprising a first heat exchanger; said annular chamber containing and comprising a second heat exchanger; said first end of said tube partially closed by a third heat exchanger extending into said tube and having a heat exchange surface thereon exposed to said tube interior, said third heat exchanger comprising a surface exposed to the exterior of said tube; a thermally conductive contacting means disposed in contact with said surface exposed to said exterior of said tube; an electronic chip supported on a chip support substrate and disposed proximate said contacting means; means for urging said contacting means against said electronic chip; said compression chamber, said regenerator and said pulse tube containing a compressible gas; whereby displacement of said plunger compresses and decompresses said gas to cool said first end of said tube and said third heat exchanger, and heats said second end of said tube and said first heat exchanger, thereby providing a cooled region of said first end to absorb and transfer heat from said electronic chip to said second end of said tube.

이 특허를 인용한 특허 (59) 인용/피인용 타임라인 분석

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[미국특허] Electronics package with improved thermal management by thermoacoustic heat pumping 원문보기

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