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Endpoint detection apparatus and method for chemical/mechanical polishing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/304
출원번호 US-0828054 (1992-01-30)
발명자 / 주소
  • Cote William J. (Poughquag NY) Cronin John E. (Milton VT) Hill William R. (Underhill VT) Hoffman Cheryl A. (Colchester VT)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 148  인용 특허 : 0

초록 ▼

An apparatus and method for determining a selected endpoint in the polishing of layers on a workpiece in a chemical/mechanical polishing apparatus where the workpiece is rotated by a motor against a polishing pad. When a difficult to polish layer, i.e., one requiring a chemical change in a surface s

대표청구항 ▼

In a process of polishing of a layer of a first material requiring a chemical/mechanical removal process arranged over a layer of second material requiring only a mechanical removal process disposed on a surface of a workpiece wherein the workpiece is rotated by a first motor and is brought into con

이 특허를 인용한 특허 (148)

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