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Severe environment enclosure with thermal heat sink and EMI protection 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H05K-009/00
출원번호 US-0743509 (1991-08-09)
발명자 / 주소
  • Naedel Richard G. (Rockville MD) Bogdan Francis J. (Baltimore MD) Richardson Michael (Annapolis MD) Rosenberger Keith (Baltimore MD)
출원인 / 주소
  • Pulse Embedded Computer Systems, Inc. (Greenbelt MD 02)
인용정보 피인용 횟수 : 50  인용 특허 : 0

초록

A computer chassis construction for severe environmental conditions enclosing a plurality of circuit cards and a power supply includes a top cover, bottom cover, a pair of side plates and a pair of end plates secured together to form an airtight seal along all abutting edges. A backplane is fixed ad

대표청구항

A chassis construction incorporating a plurality of circuit cards and a power supply comprising: a top cover, bottom cover, a pair of side plates and a pair of end plates secured together to form an airtight seal along all abutting edges; a backplane rigidly fixed to one of said top and bottom cover

이 특허를 인용한 특허 (50)

  1. Hargreaves, Doug, Ballast.
  2. Reynolds, Christopher, Ballast housing.
  3. Reynolds, Christopher, Ballast housing.
  4. Gustine, Gary; Ham, Charles G.; Kusz, Matthew; Daniels, Fredrick; Sawyer, Michael, Cable head assembly.
  5. Harris, Kyle D.; Rodriguez Rivera, Carlos A.; Casey, Ryan; Colasuono, Michael; Lemp, Kenneth D.; Patten, III, Carl H., Card reader and enclosure.
  6. Harris, Kyle D.; Rodriguez Rivera, Carlos A.; Casey, Ryan; Colasuono, Michael; Lemp, Kenneth D.; Patten, III, Carl H., Card reader enclosure.
  7. Harris, Kyle D.; Rodriguez Rivera, Carlos A.; Casey, Ryan; Colasuono, Michael; Lemp, Kenneth D.; Patten, III, Carl H., Card reader enclosure.
  8. von Gutfeld Robert Jacob, Case for portable computers for enhanced heat dissipation.
  9. von Gutfeld Robert Jacob, Case for portable computers for enhanced heat dissipation.
  10. Nicolici Radu-Marko,CAX ; Barber Robert J.,CAX ; Weber John F.,CAX, Casing mountable filler module.
  11. Hendrix Walter M. ; Ati Babi ; Guy Michael, Circuit board enclosure having heat transfer circuit board support.
  12. Hendrix Walter M. ; Ati Babi ; Guy Michael, Circuit board enclosure having heat transfer circuit board support.
  13. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.
  14. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.
  15. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.
  16. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  17. Porreca, Paul J.; Maille, Todd P.; Palis, Michael R., Conduction-cooled apparatus and methods of forming said apparatus.
  18. Daryl J. Nelson ; Michael Stark ; Michael Rutigliano ; Lee Topic ; Yoke Chung ; Mark Thurston JP, Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges.
  19. Nelson Daryl J. ; Stark Michael ; Rutigliano Michael ; Topic Lee ; Chung Yoke ; Thurston Mark,JPX, Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges.
  20. Stromberg, Jan-Erik, Electrical interference protection arrangement for embedded control computers.
  21. Kim, Duk-Yong; Lee, Jung-Pil; Kim, Kyoung-Seuk; Yoo, Chang-Woo; Jang, Sung-Ho, Enclosure device of wireless communication apparatus.
  22. Atkinson, John C.; Shearman, Simon E., Extruded heatsink and EMC enclosure.
  23. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with housing/shielding.
  24. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with shielded housing/covers having mixed finger types.
  25. Bury, Joachim; Salomon, Thomas, Function component upper part for a component construction system.
  26. Johnson Charles E. ; Morrell Edward A., Heat dissipating enclosure for electronic components.
  27. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.
  28. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.
  29. Michael R. Stark ; Michael L. Rutigliano, Inboard retention system for processor enclosure assemblies with substrate alignment.
  30. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
  31. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  32. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  33. Messenger Michael Peter,GBX ; O'Connell Terry Patrick,GBX, Mains interface module.
  34. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.
  35. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick; Bishop, Michelle; King, Lane; Kusz, Matthew, Mechanical housing.
  36. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.
  37. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Methods and apparatus for fiber-optic modules with shielded housings/covers with fingers.
  38. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  39. Everhart, Brian K.; Denson, Jessica A.; Clarke, Melvin W., Mobile modular communication system.
  40. Berlekamp, John D., Modular test systems for severe environments.
  41. Muhlfeld, David E.; Baldini, Augustus R., Moisture-resistant enclosure for electronic circuitry.
  42. Spivey,Thomas; Winn,Tracy, Portable data routing device and method of use.
  43. Nelson Darul J. ; Noval James V. ; Suarez Ricardo E. ; Aghazadeh Mostafa A., Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage.
  44. Stark, Michael; Rutigliano, Michael; Lieska, Bill; Davison, Peter A., Protection shield for an electronic cartridge.
  45. Reynolds, Christopher, Remote ballast.
  46. Reynolds, Christopher, Remote ballast.
  47. Llapitan, David J.; Crocker, Michael; Davison, Peter, Retention mechanism for an electrical assembly.
  48. Llapitan, David J.; Crocker, Michael; Davison, Peter, Retention mechanism for an electrical assembly.
  49. Nelson,Shannon Mary; Paul,Richard Joseph; Hischke,Mark D., Rugged shock-resistant backplane for embedded systems.
  50. Bodini Amedeo,ITX, Structure for housing and heat sinking equipment pieces in an aeronautic or space vehicle.
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